Applications
• Ground Isolate Most Logic
Families – TTL/TTL, CMOS/
TTL, CMOS/CMOS, LSTTL/
TTL, CMOS/LSTTL
• Low Input Current Line
Receiver
• High Voltage Insulation
(HCNW139/138)
• EIA RS-232C Line Receiver
• Telephone Ring Detector
• 117 V ac Line Voltage Status
Indicator – Low Input Power
Dissipation
• Low Power Systems –
Ground Isolation
Low Input Current, High Gain
Optocouplers
Technical Data
Features
• High Current Transfer Ratio
– 2000% Typical (4500%
Typical for HCNW139/138)
• Low Input Current
Requirements – 0.5 mA
• TTL Compatible Output –
0.1 V VOL Typical
• Performance Guaranteed
over Temperature 0°C
to 70°C
• Base Access Allows Gain
Bandwidth Adjustment
• High Output Current –
60 mA
• Safety Approval
UL Recognized – 2500 V rms
for 1 Minute and 5000 V rms*
for 1 Minute per UL 1577
CSA Approved
VDE 0884 Approved with
VIORM = 1414 V peak for
HCNW139 and HCNW138
BSI Certified (HCNW139 and
HCNW138)
• Available in 8-Pin DIP or
SOIC-8 Footprint or
Widebody Package
•MIL-STD-1772 Version
Available (HCPL-5700/1)
Description
These high gain series couplers
use a Light Emitting Diode and an
integrated high gain photodetec-
tor to provide extremely high
current transfer ratio between
input and output. Separate pins
for the photodiode and output
stage result in TTL compatible
saturation voltages and high
speed operation. Where desired
the VCC and VO terminals may be
tied together to achieve conven-
tional photodarlington operation.
A base access terminal allows a
gain bandwidth adjustment to be
made.
6N139 6N138
HCPL-0701 HCPL-0700
HCNW139 HCNW138
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
*5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only.
A 0.1 µF bypass capacitor connected between pins 8 and 5 is recommended.
Functional Diagram
7
1
2
3
45
6
8
NC
ANODE
CATHODE
NC
V
CC
V
O
GND
TRUTH TABLE
LED
ON
OFF
V
O
LOW
HIGH
V
B
2
The 6N139, HCPL-0701, and
CNW139 are for use in CMOS,
LSTTL or other low power appli-
cations. A 400% minimum current
transfer ratio is guaranteed over
0 to 70°C operating range for only
0.5 mA of LED current.
The 6N138, HCPL-0700, and
HCNW138 are designed for use
mainly in TTL applications.
Current Transfer Ratio (CTR) is
300% minimum over 0 to 70°C
for an LED current of 1.6 mA
(1 TTL Unit load ). A 300%
minimum CTR enables operation
with 1 TTL Load using a 2.2 kΩ
pull-up resistor.
Selection for lower input current
down to 250 µA is available upon
request.
The HCPL-0701 and HCPL-0700
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.
The SOIC-8 does not require
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
The HCNW139 and HCNW138
are packaged in a widebody
encapsulation that provides creep-
age and clearance dimensions
suitable for safety approval by
regulatory agencies worldwide.
Selection Guide
Widebody
8-Pin DIP Package Hermetic
(300 Mil) Small Outline SO-8 (400 mil) Single and
Dual Single Dual Minimum Absolute Dual
Single Channel Channel Channel Single Input ON Maxi- Channel
Channel Package Package Package Channel Current Minimum mum Packages
Package HCPL- HCPL- HCPL- Package (IF) CTR VCC HCPL-
6N139 2731[1] 0701 0731 HCNW139 0.5 mA 400% 18 V
6N138 2730[1] 0700 0730 HCNW138 1.6 mA 300% 7 V
HCPL-4701[1] 4731[1] 070A[1] 073A[1] 40 µA 800% 18 V
0.5 mA 300% 20 V 5701[1]
5700[1]
5731[1]
5730[1]
Note:
1. Technical data are on separate HP publications.
3
I
F
8
V
CC
2
3
I
CC
V
F
ANODE
CATHODE
+
–
V
B
I
B
6
5GND
V
O
I
O
7
SHIELD
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
6N139#XXX
020 = 5000 V rms/1 Minute UL Rating Option*
300 = Gull Wing Surface Mount Option†
500 = Tape and Reel Packaging Option
Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.
*For 6N139 and 6N138 only.
†Gull wing surface mount option applies to through hole parts only.
Schematic
4
9.65 ± 0.25
(0.380 ± 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
HP XXXXZ
YYWW
DATE CODE
1.080 ± 0.320
(0.043 ± 0.013) 2.54 ± 0.25
(0.100 ± 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
5678
4321
5° TYP.
OPTION CODE*
UL
RECOGNITION
UR
0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
TYPE NUMBER
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
Package Outline Drawings
8-Pin DIP Package (6N139/6N138)**
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)
0.635 ± 0.25
(0.025 ± 0.010) 12° NOM.
9.65 ± 0.25
(0.380 ± 0.010)
0.635 ± 0.130
(0.025 ± 0.005)
7.62 ± 0.25
(0.300 ± 0.010)
5
6
7
8
4
3
2
1
9.65 ± 0.25
(0.380 ± 0.010)
6.350 ± 0.25
(0.250 ± 0.010)
1.016 (0.040)
1.194 (0.047)
1.194 (0.047)
1.778 (0.070)
9.398 (0.370)
9.906 (0.390)
4.826
(0.190)
TYP.
0.381 (0.015)
0.635 (0.025)
PAD LOCATION (FOR REFERENCE ONLY)
1.080 ± 0.320
(0.043 ± 0.013)
4.19
(0.165)MAX.
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.254 + 0.076
- 0.051
(0.010+ 0.003)
- 0.002)
**JEDEC Registered Data.
5
Small Outline SO-8 Package (HCPL-0701/HCPL-0700)
8-Pin Widebody DIP Package (HCNW139/HCNW138)
5
6
7
8
4
3
2
1
11.15 ± 0.15
(0.442 ± 0.006)
1.78 ± 0.15
(0.070 ± 0.006)
5.10
(0.201)MAX.
1.55
(0.061)
MAX.
2.54 (0.100)
TYP.
DIMENSIONS IN MILLIMETERS (INCHES).
7° TYP. 0.254 + 0.076
- 0.0051
(0.010+ 0.003)
- 0.002)
11.00
(0.433)
9.00 ± 0.15
(0.354 ± 0.006)
MAX.
10.16 (0.400)
TYP.
HP 
HCNWXXXX
YYWW
DATE CODE
TYPE NUMBER
0.51 (0.021) MIN.
0.40 (0.016)
0.56 (0.022)
3.10 (0.122)
3.90 (0.154)
XXX
YWW
8765
4321
5.994 ± 0.203
(0.236 ± 0.008)
3.937 ± 0.127
(0.155 ± 0.005)
0.406 ± 0.076
(0.016 ± 0.003) 1.270
(0.050)BSG
5.080 ± 0.127
(0.200 ± 0.005)
3.175 ± 0.127
(0.125 ± 0.005) 1.524
(0.060)
45° X 0.432
(0.017)
0.228 ± 0.025
(0.009 ± 0.001)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0.305
(0.012)MIN.
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.203 ± 0.102
(0.008 ± 0.004)
7°
PIN ONE
0 ~ 7°
*
*
6
1.00 ± 0.15
(0.039 ± 0.006)
7° NOM.
12.30 ± 0.30
(0.484 ± 0.012)
0.75 ± 0.25
(0.030 ± 0.010)
11.00
(0.433)
5
6
7
8
4
3
2
1
11.15 ± 0.15
(0.442 ± 0.006)
9.00 ± 0.15
(0.354 ± 0.006)
1.3
(0.051)
12.30 ± 0.30
(0.484 ± 0.012)
6.15
(0.242)TYP.
0.9
(0.035)
PAD LOCATION (FOR REFERENCE ONLY)
1.78 ± 0.15
(0.070 ± 0.006)
4.00
(0.158)MAX.
1.55
(0.061)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.254 + 0.076
- 0.0051
(0.010+ 0.003)
- 0.002)
MAX.
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)
Note: Use of nonchlorine activated fluxes is highly recommended.
Solder Reflow Temperature Profile (HCPL-07XX and Gull Wing Surface Mount
Option 300 Parts)
240
∆T = 115°C, 0.3°C/SEC
0
∆T = 100°C, 1.5°C/SEC
∆T = 145°C, 1°C/SEC
TIME – MINUTES
TEMPERATURE – °C
220
200
180
160
140
120
100
80
60
40
20
0
260
123 456789101112
7
Regulatory Information
The 6N139/138, HCNW139/138,
and HCPL-0701/0700 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
VDE
Approved according to VDE 0884/
06.92 (HCNW139/138 only).
BSI
Certification according to
BS415:1994,
(BS EN60065:1994);
BS EN60950:1992
(BS7002:1992) and
EN41003:1993 for Class II
applications (HCNW139/
HCNW138 only.)
Insulation and Safety Related Specifications
8-Pin DIP Widebody
(300 Mil) SO-8 (400 Mil)
Parameter Symbol Value Value Value Units Conditions
Minimum External L(101) 7.1 4.9 9.6 mm Measured from input terminals
Air Gap (External to output terminals, shortest
Clearance) distance through air.
Minimum External L(102) 7.4 4.8 10.0 mm Measured from input terminals
Tracking (External to output terminals, shortest
Creepage) distance path along body.
Minimum Internal 0.08 0.08 1.0 mm Through insulation distance,
Plastic Gap conductor to conductor, usually
(Internal Clearance) the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Minimum Internal NA NA 4.0 mm Measured from input terminals
Tracking (Internal to output terminals, along
Creepage) internal cavity.
Tracking Resistance CTI 200 200 200 Volts DIN IEC 112/VDE 0303 Part 1
(Comparative
Tracking Index)
Isolation Group IIIa IIIa IIIa Material Group
(DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
8
VDE 0884 Insulation Related Characteristics (HCNW139 and HCNW138)
Description Symbol Characteristic Units
Installation Classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤600 V rms I-IV
for rated mains voltage ≤1000 V rms I-III
Climatic Classification 55/100/21
Pollution Degree (DIN VDE 0110/1.89) 2
Maximum Working Insulation Voltage VIORM 1414 V peak
Input to Output Test Voltage, Method b*
VPR = 1.875 x VIORM, 100% Production Test with tP = 1 sec, VPR 2652 V peak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
VPR = 1.5 x VIORM, Type and Sample Test, VPR 2121 V peak
tP = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec) VIOTM 8000 V peak
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 11, Thermal Derating curve.)
Case Temperature TS175 °C
Current (Input Current IF, PS = 0) IS,INPUT 400 mA
Output Power PS,OUTPUT 700 mW
Insulation Resistance at TS, VIO = 500 V RS> 109Ω
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, (VDE 0884) for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in
application.
9
Absolute Maximum Ratings* (No Derating Required up to 85°C)
Parameter Symbol Min. Max. Units
Storage Temperature TS-55 125 °C
Operating Temperature** TA-40 85 °C
Average Forward Input Current IF(AVG) 20 mA
Peak Forward Input Current IFPK 40 mA
(50% Duty Cycle, 1 ms Pulse Width)
Peak Transient Input Current IF(TRAN) 1.0 A
(<1 µs Pulse Width, 300 pps)
Reverse Input Voltage VR5V
HCNW139/138 3 V
Input Power Dissipation PI35 mW
Output Current (Pin 6) IO60 mA
Emitter Base Reverse Voltage (Pin 5-7) VEB 0.5 V
Supply Voltage and Output Voltage VCC -0.5 18 V
(6N139, HCPL-0701, HCNW139)
Supply Voltage and Output Voltage VCC -0.5 7 V
(6N138, HCPL-0700, HCNW138)
Output Power Dissipation PO100 mW
Total Power Dissipation PT135 mW
Lead Solder Temperature (for Through Hole Devices) 260°C for 10 sec., 1.6 mm below seating plane
HCNW139/138 260°C for 10 sec., up to seating plane
Reflow Temperature Profile See Package Outline Drawings section
(for SOIC-8 and Option #300)
*JEDEC Registered Data for 6N139 and 6N138.
**0°C to 70°C on JEDEC Registration.
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Power Supply Voltage VCC 4.5 18 V
Forward Input Current (ON) IF(ON) 0.5 12.0 mA
Forward Input Voltage (OFF) VF(OFF) 0 0.8 V
Operating Temperature TA070°C
10
Electrical Specifications
0°C ≤T
A ≤70°C, 4.5 V ≤VCC ≤18 V, 0.5 mA ≤IF(ON) ≤12 mA, 0 V ≤VF(OFF) ≤0.8 V, unless otherwise
specified. All Typicals at TA = 25°C. See Note 7.
Parameter Sym. Device Min. Typ.** Max. Units Test Conditions Fig. Note
Current Transfer CTR 6N139 400* 2000 5000 % IF = 0.5 mA VCC = 4.5 2, 3 1, 2,
Ratio HCPL-0701 VO = 0.4 V 4
HCNW139 400 4500
6N139 500* 1600 2600 IF = 1.6 mA
HCPL-0701
HCNW139 500 3000
300 1600 IF = 5.0 mA
200 850 IF = 12 mA
6N138 300* 1600 2600 IF = 1.6 mA
HCPL-0700
HCNW138 1500
Logic Low Output VOL 6N139 0.1 0.4 V IF = 0.5 mA, VCC = 4.5 1 2
Voltage HCPL-0701 IO = 2 mA
HCNW139 IF = 1.6 mA,
IO = 8 mA
IF = 5.0 mA,
IO = 15 mA
0.2 IF = 12 mA,
IO = 24 mA
6N138 0.1 IF = 1.6 mA,
HCPL-0700 IO = 4.8 mA
HCNW138
Logic High IOH 6N139 0.05 100 µAV
O
= VCC = 18 V IF = 0 mA 2
Output Current HCPL-0701
HCNW139
6N138 0.1 250 VO = V
CC = 7 V
HCPL-0700
HCNW138
Logic Low Supply ICCL 6N138/139 0.4 1.5 mA IF = 1.6 mA, VO = Open, 10 2
Current HCPL-0701/ VCC = 18 V
0700
HCNW139 0.5 2
HCNW138
Logic High ICCH 6N138/139 0.01 10 µAI
F
= 0 mA, VO = Open, 2
Supply Current HCPL-0701/ VCC = 18 V
0700
HCNW139 1
HCNW138
Input Forward VF6N138 1.25 1.40 1.7* V TA = 25°CI
F
= 1.6 mA 4, 8
Voltage 6N139
HCPL-0701 1.75
HCPL-0700
HCNW139 1.0 1.45 1.85 TA = 25°C
HCNW138 0.95 1.95
Input Reverse BVR 5.0* V IR = 10 µA, TA = 25°C
HCNW139 3.0 IR = 100 µA, TA = 25°C
HCNW138
Temperature ∆VF-1.8 mV/°CI
F
= 1.6 mA 8
Coefficient of ∆TA
Forward Voltage
Input CIN 60 pF f = 1 MHz, VF = 0 V
Capacitance HCNW139 90
HCNW138
*JEDEC Registered Data for 6N139 and 6N138.
**All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.
Breakdown
Voltage
11
Switching Specifications (AC)
Over recommended operating conditions (T
A = 0 to 70°C), V
CC = 5 V, unless otherwise specified.
Parameter Sym. Device Min. Typ.** Max. Units Test Conditions Fig. Note
Propagation Delay tPHL 6N139 5 25* µsT
A
= 25°C 5, 6, 2, 4
30 IF = 0.5 mA,
Rl = 4.7 kΩ
6N139 0.2 1* µsT
A
= 25°C
2I
F
= 12 mA,
Rl = 270 Ω
HCNW139 1.1
6N138 1.6 10* µsT
A
= 25°C
IF = 1.6 mA,
15 Rl = 2.2 kΩ
HCNW138 11
Propagation Delay tPLH 6N139 18 60* µsT
A
= 25°C 5, 6, 2, 4
90 IF = 0.5 mA,
Rl = 4.7 kΩ
HCNW139 115
6N139 2 7* µsT
A
= 25°C
10 IF = 12 mA,
HCNW139 Rl = 270 Ω
HCNW139 1.1
6N138 10 35* µsT
A
= 25°C
IF = 1.6 mA,
Rl = 2.2 kΩ
6N138 50
HCPL-0700
HCNW139 70
Common Mode |CMH| 1000 10000 V/µsI
F
= 0 mA, 13 5, 6
Transient Immunity TA = 25°C
at Logic High Output Rl = 2.2 kΩ
|VCM| = 10 Vp-p
Common Mode |CML| 1000 10000 V/µsI
F
= 1.6 mA, 13 5, 6
Transient Immunity TA = 25°C
at Logic Low Output Rl = 2.2 kΩ
|VCM| = 10 Vp-p
*JEDEC Registered Data for 6N139 and 6N138.
**All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.
Time to Logic Low at
Output
HCPL-0701
HCNW139
HCPL-0701
HCPL-0700
HCNW138
Time to Logic High
at Output
HCPL-0701
HCNW139
HCPL-0701
HCPL-0700
HCNW138
7, 9,
12
7, 9,
12
12
Package Characteristics
Parameter Sym. Min. Typ.** Max. Units Test Conditions Fig. Note
Input-Output Momentary VISO 2500 V rms RH < 50%, t = 1 min., 3, 8
Withstand Voltage† TA = 25°C
Option 020 5000 3, 9
HCNW139
HCNW138
Resistance (Input-Output) RI-O 1012 ΩVI-O = 500 Vdc 3
RH < 45%
Capacitance (Input-Output) CI-O 0.6 pF f = 1 MHz 3
**All typicals at TA = 25°C, unless otherwise noted.
†The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output
continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable),
your equipment level safety specification or HP Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.”
Notes:
1. DC CURRENT TRANSFER RATI0
(CTR) is defined as the ratio of output
collector current, IO, to the forward
LED input current, IF, times 100%.
2. Pin 7 Open.
3. Device considered a two-terminal
device. Pins 1, 2, 3, and 4 shorted
together and Pins 5, 6, 7, and 8 shorted
together.
4. Use of a resistor between pin 5 and 7
will decrease gain and delay time.
Significant reduction in overall gain can
occur when using resistor values below
47 kΩ. For more information, please
contact your local HP Components
representative.
5. Common mode transient immunity in a
Logic High level is the maximum toler-
able (positive) dVCM/dt of the common
mode pulse, VCM, to assure that the
output will remain in a Logic High state
(i.e., VO > 2.0 V). Common mode
transient immunity in a Logic Low level
is the maximum tolerable (negative)
dVCM/dt of the common mode pulse,
VCM, to assure that the output will
remain in a Logic Low state (i.e.,
VO< 0.8 V).
6. In applications where dV/dt may exceed
50,000 V/µs (such as static discharge) a
series resistor, RCC, should be included
to protect the detector IC from
destructively high surge currents. The
recommended value is RCC = 220 Ω.
7. Use of a 0.1 µF bypass capacitor
connected between pins 8 and 5
adjacent to the device is recommended.
8. In accordance with UL 1577, each
optocoupler is proof tested by applying
an insulation test voltage 3000 V rms
for 1 second (leakage detection current
limit, II-O < 5 µA). This test is per-
formed before the 100% production test
shown in the VDE 0884 Insulation
Related Characteristics Table, if
applicable.
9. In accordance with UL 1577, each
optocoupler is proof tested by applying
an insulation test voltage > 6000 V rms
for 1 second (leakage detection current
limit, II-O < 5 µA). This test is per-
formed before the 100% production test
for partial discharge (method b) shown
in the VDE 0884 Insulation Related
Characteristics Table, if applicable.
13
R
L
– LOAD RESISTANCE – kΩ
100
0.1 1.0
TIME – µs
10
10
1
I
F
– ADJUSTED FOR V
OL
= 2 V
T
A
= 25° C t
f
t
r
Figure 1. 6N138/6N139 DC Transfer
Characteristics.
Figure 6. Propagation Delay vs.
Temperature.
Figure 5. Propagation Delay vs.
Temperature.
Figure 2. Current Transfer Ratio vs.
Forward Current 6N138/6N139. Figure 3. 6N138/6N139 Output
Current vs. Input Diode Forward
Current.
Figure 4. Input Diode Forward
Current vs. Forward Voltage.
Figure 7. Propagation Delay vs.
Temperature.
Figure 8. Forward Voltage vs.
Temperature.
Figure 9. Nonsaturated Rise and Fall
Times vs. Load Resistance.
0 1.0 2.0
V
O
– OUTPUT VOLTAGE – V
I
O
– OUTPUT CURRENT – mA
50
25
0
5.0 mA
T
A
= 25° C
V
CC
= 5 V
4.5 mA
4.0 mA
3.5 mA
3.0 mA
2.5 mA
2.0 mA
1.5 mA
1.0 mA
0.5 mA
I
F
– FORWARD CURRENT – mA
2000
1600
800
400
0.1 1.0
CTR – CURRENT TRANSFER RATIO – %
10
1200
0
V
CC
= 5 V
V
O
= 0.4 V
85°C
70°C
25°C
70°C
-40°C
I
F
– INPUT DIODE FORWARD CURRENT – mA
0.01
0.01 0.1 10
I
O
– OUTPUT CURRENT – mA
0.1
1.0
10
100
T
A
= 25° C
T
A
= 0° C
T
A
= 70° C
T
A
= 85° C
T
A
= -40° C
1
1.6
1.5
1.4
1.3
-60 -20 20 40 100
V
F
– FORWARD VOLTAGE – V
T
A
– TEMPERATURE – °C
60 80
0
-40
1.2
I
F
= 1.6 mA
V
F
– FORWARD VOLTAGE – V
100
10
0.1
0.01
1.1 1.2 1.3 1.4
I
F
– FORWARD CURRENT – mA
1.61.5
1.0
0.001
1000
–
V
F
+
T
A
= 25°C
T
A
= 0°C
I
F
T
A
= 85°C
T
A
= 70°C
T
A
= -40°C
40
35
30
25
20
10
-60 -20 20 40 100
t
P
– PROPAGATION DELAY – µs
T
A
– TEMPERATURE – °C
5
60 80
0
-40
0
I
F
= 0.5 mA
R
L
= 4.7 kΩ
1/f = 50 µs
15
t
PLH
t
PHL
24
21
18
15
12
6
-60 -20 20 40 100
t
P
– PROPAGATION DELAY – µs
T
A
– TEMPERATURE – °C
3
60 80
0
-40
0
I
F
= 1.6 mA
R
L
= 2.2 kΩ
1/f = 50 µs
9
t
PLH
t
PHL
4
3
2
1
-60 -20 20 40 100
t
P
– PROPAGATION DELAY – µs
T
A
– TEMPERATURE – °C
60 80
0
-40
0
I
F
= 12 mA
R
L
= 270 kΩ
1/f = 50 µs t
PLH
t
PHL
14
V
O
PULSE
GEN.
Z = 50 Ω
t = 5 ns
O
r
I MONITOR
F
I
F
0.1 µF
L
R
C
L
= 15 pF*
R
M
0
t
PHL
t
PLH
O
V
I
F
OL
V
1.5 V 1.5 V
5 V
+5 V
7
1
2
3
45
6
8
10% DUTY CYCLE
I/f < 100 µs
(SATURATED
RESPONSE)
t
f
t
r
O
V
(NON-SATURATED
RESPONSE)
5 V
90%
10%
90%
10%
* INCLUDES PROBE AND
FIXTURE CAPACITANCE
Figure 12. Switching Test Circuit.
Figure 11. Thermal Derating Curve,
Dependence of Safety Limiting Value
with Case Temperature per VDE 0884.
Figure 10. Logic Low Supply Current
vs. Forward Current.
0.8
0.6
0.4
0.2
04 810 16
I
CCL
– LOGIC LOW SUPPLY CURRENT – mA
I
F
– FORWARD CURRENT
12 14
6
2
0
V
CC
= 18 V
0.1
0.3
0.5
0.7
V
CC
= 5 V
OUTPUT POWER – P
S
, INPUT CURRENT – I
S
0
0
T
S
– CASE TEMPERATURE – °C
175
1000
50
400
12525 75 100 150
600
800
200
100
300
500
700
900 P
S
(mW)
I
S
(mA)
WIDEBODY
15
Figure 13. Test Circuit for Transient Immunity and Typical Waveforms.
V
O
I
F
L
R
A
B
PULSE GEN.
V
CM
+
V
FF
O
V
OL
V
O
V
0 V 10% 90% 90% 10%
SWITCH AT A: I = 0 mA
F
SWITCH AT B: I = 1.6 mA
F
CM
V
t
r
t
f
5 V
+5 V
–
7
1
2
3
45
6
8R
CC
(SEE NOTE 6)
10 V t
r
, t
f
= 16 ns
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Data subject to change.
Copyright © 1998 Hewlett-Packard Co.
Obsoletes 5965-3599E
Printed in U.S.A. 5968-1085E (7/98)
www.hp.com/go/isolator