ISOCOM COMPONENTS TLP521, TLP521-2, TLP521-4 DESCRIPTION The TLP521, TLP521-2 and TLP521-4 series of optically coupled isolator consist of an infrared light emitting diode and an NPN silicon photo transistor in a space efficient Dual In Line Plastic Package. TLP521 FEATURES * * * * * * AC Isolation Voltage 5300VRMS CTR Selections Available Wide Operating Temperature Range -30C to +100C Lead Free and RoHS Compliant UL File E91231 Package Code "EE" VDE Approval Certificate No. 40028086 TLP521-2 TLP521-4 APPLICATIONS * * * * Computer Terminals Industrial System Controllers Measuring Instruments Signal Transmission between Systems of Different Potentials and Impedances ORDER INFORMATION * * * * * Add X after PN for VDE Approval Add G after PN for 10mm lead spacing Add SM after PN for Surface Mount Add SMT&R after PN for Surface Mount Tape & Reel (Available for TLP521SM and TLP521-2SM) Consult Factory for Tape and Reel version of TLP521-4SM ISOCOM COMPONENTS 2004 LTD Unit 25B, Park View Road West, Park View Industrial Estate Hartlepool, Cleveland, TS25 1PE, United Kingdom Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581 e-mail : sales@isocom.co.uk http://www.isocom.com 1 20/01/2017 ABSOLUTE MAXIMUM RATINGS (TA = 25C) Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. Input Forward Current Reverse Voltage Power dissipation 50mA 6V 70mW Output Collector to Emitter Voltage BVCEO Emitter to Collector Voltage BVECO Collector Current Power Dissipation 55V 6V 50mA 150mW Total Package Isolation Voltage Total Power Dissipation Operating Temperature Storage Temperature Lead Soldering Temperature (10s) 5300VRMS 200mW -30 to 100 C -55 to 125 C 260C ISOCOM COMPONENTS ASIA LTD Hong Kong Office Block A, 8/F, Wah Hing Industrial Mansion 36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong Tel : +852 2995 9217 Fax : +852 8161 6292 e-mail : sales@isocom.com.hk DD93208 ISOCOM COMPONENTS TLP521, TLP521-2, TLP521-4 ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25C unless otherwise specified) INPUT Parameter Symbol Test Condition Min Typ. Max Unit Forward Voltage VF IF = 10mA 1.0 1.15 1.3 V Reverse Voltage VR IR = 10A 6.0 Reverse Leakage IR VR = 4V Terminal Capacitance Ct V = 0V, f = 1KHz Symbol Test Condition Min Collector--Emitter breakdown Voltage BVCEO IC = 0.5mA, IF = 0mA 55 V Emitter--Collector breakdown Voltage BVECO IE = 100A, IF = 0mA 6 V ICEO VCE = 20V, IF = 0mA V 10 A 30 250 pF Typ. Max Unit OUTPUT Parameter Collector-Emitter Dark Current 2 20/01/2017 100 nA DD93208 ISOCOM COMPONENTS TLP521, TLP521-2, TLP521-4 ELECTRICAL CHARACTERISTICS (Ambient Temperature = 25C unless otherwise specified) COUPLED Parameter Current Transfer Ratio Symbol CTR Test Condition Min Typ. Max Unit % IF = 5mA, VCE = 5V 50 600 Optional CTR Grades GR BL GB GB (IF = 1mA, VCE = 0.4V) 100 200 100 30 300 600 600 Collector--Emitter Saturation Voltage VCE(sat) IF = 8mA, IC = 2.4mA GB (IF = 1mA, IC = 0.2mA) Output Rise Time tr Output Fall Time tf VCE = 2V, Ic = 2mA, RL = 100 Turn-on Time ton 3 Turn-off Time toff 3 Turn-on Time tON Turn-off Time tOFF VCC= 5V, IF = 16mA, RL = 1.9k Symbol Test Condition Min Input to Output Isolation Voltage VISO AC 1 minute, RH = 40 to 60% Note 1 5300 VRMS Input to Output Isolation Resistance RISO VIO= 500V Note 1 5x1010 0.4 0.4 4 V s 3 2 s 25 ISOLATION Parameter Typ. Max Unit Note 1 : Measure with input leads shorted together and output leads shorted together. 3 20/01/2017 DD93208 ISOCOM COMPONENTS TLP521, TLP521-2, TLP521-4 Fig 1 Forward Current vs TA Fig 2 Collector Power Dissipation vs TA Fig 3 Collector-emitter Saturation Voltage vs Forward Current Fig 4 Collector Current vs Collector-emitter Voltage Fig 5 Current Transfer Ratio vs Forward Current Fig 6 Forward Current vs Forward Voltage 4 20/01/2017 DD93208 ISOCOM COMPONENTS TLP521, TLP521-2, TLP521-4 Fig 7 Relative CTR vs TA Fig 8 Frequency Response Fig 9 Response Time vs Load Resistance Response Time Test Circuit 5 20/01/2017 DD93208 ISOCOM COMPONENTS TLP521, TLP521-2, TLP521-4 ORDER INFORMATION TLP521 (UL Approval) After PN Description PN Packing quantity None TLP521, TLP521GR, TLP521BL, TLP521GB Standard DIP4 100 pcs per tube G TLP521G, TLP521GRG, TLP521BLG, TLP521GBG 10mm Lead Spacing 100 pcs per tube SM TLP521SM, TLP521GRSM, TLP521BLSM, TLP521GBSM Surface Mount 100 pcs per tube SMT&R TLP521SMT&R, TLP521GRSMT&R, TLP521BLSMT&R, TLP521GBSMT&R Surface Mount Tape & Reel 1000 pcs per reel TLP521-2 (UL Approval) After PN Description PN Packing quantity None TLP521-2, TLP521-2GR, TLP521-2BL, TLP521-2GB Standard DIP8 50 pcs per tube G TLP521-2G, TLP521-2GRG, TLP521-2BLG, TLP521-2GBG 10mm Lead Spacing 50 pcs per tube SM TLP521-2SM, TLP521-2GRSM, TLP521-2BLSM, TLP521-2GBSM Surface Mount 50 pcs per tube SMT&R TLP521-2SMT&R, TLP521-2GRSMT&R, TLP521-2BLSMT&R, TLP521-2GBSMT&R Surface Mount Tape & Reel 1000 pcs per reel TLP521-4 (UL Approval) After PN PN Description Packing quantity None TLP521-4, TLP521-4GR, TLP521-4BL, TLP521-4GB Standard DIP16 25 pcs per tube G TLP521-4G, TLP521-4GRG, TLP521-4BLG, TLP521-4GBG 10mm Lead Spacing 25 pcs per tube SM TLP521-4SM, TLP521-4GRSM, TLP521-4BLSM, TLP521-4GBSM Surface Mount 25 pcs per tube 6 20/01/2017 DD93208 ISOCOM COMPONENTS TLP521, TLP521-2, TLP521-4 ORDER INFORMATION TLP521X (UL and VDE Approvals) After PN Description PN Packing quantity None TLP521X, TLP521XGR, TLP521XBL, TLP521XGB Standard DIP4 100 pcs per tube G TLP521XG, TLP521XGRG, TLP521XBLG, TLP521XGBG 10mm Lead Spacing 100 pcs per tube SM TLP521XSM, TLP521XGRSM, TLP521XBLSM, TLP521XGBSM Surface Mount 100 pcs per tube SMT&R TLP521XSMT&R, TLP521XGRSMT&R, TLP521XBLSMT&R, TLP521XGBXSMT&R Surface Mount Tape & Reel 1000 pcs per reel TLP521-2X (UL and VDE Approvals) After PN Description PN Standard DIP8 Packing quantity None TLP521-2X, TLP521-2XGR, TLP521-2XBL, TLP521-2XGB 50 pcs per tube G TLP521-2XG, TLP521-2XGRG 10mm Lead Spacing TLP521-2XBLG, TLP521-2XGBG 50 pcs per tube SM TLP521-2XSM, TLP521-2XGRSM, TLP521-2XBLSM, TLP521-2XGBSM Surface Mount 50 pcs per tube SMT&R TLP521-2XSMT&R, TLP521-2XGRSMT&R, TLP521-2XBLSMT&R, TLP521-2XGBSMT&R Surface Mount Tape & Reel 1000 pcs per reel TLP521-4X (UL and VDE Approvals) After PN PN Description None TLP521-4X, TLP521-4XGR, TLP521-4XBL, TLP521-4XGB G TLP521-4XG, TLP521-4XGRG, 10mm Lead Spacing TLP521-4XBLG, TLP521-4XGBG 25 pcs per tube SM TLP521-4XSM, TLP521-4XGRSM, TLP521-4XBLSM, TLP521-4XGBSM 25 pcs per tube 7 20/01/2017 Standard DIP16 Packing quantity Surface Mount 25 pcs per tube DD93208 ISOCOM COMPONENTS TLP521, TLP521-2, TLP521-4 PACKAGE DIMENSIONS in mm (inch) DIP TLP521 TLP521-2 TLP521-4 8 20/01/2017 DD93208 ISOCOM COMPONENTS TLP521, TLP521-2, TLP521-4 PACKAGE DIMENSIONS in mm (inch) G Form TLP521 TLP521-2 TLP521-4 9 20/01/2017 DD93208 ISOCOM COMPONENTS TLP521, TLP521-2, TLP521-4 PACKAGE DIMENSIONS in mm (inch) SMD TLP521 TLP521-2 TLP521-4 10 20/01/2017 DD93208 ISOCOM COMPONENTS TLP521, TLP521-2, TLP521-4 RECOMMENDED PAD LAYOUT FOR SMD (mm) TLP521SM TLP521-2SM TLP521-4SM 11 20/01/2017 DD93208 ISOCOM COMPONENTS TLP521, TLP521-2, TLP521-4 TAPE AND REEL PACKAGING TLP521SMT&R TLP521-2SMT&R 12 20/01/2017 DD93208 ISOCOM COMPONENTS TLP521, TLP521-2, TLP521-4 IR REFLOW SOLDERING TEMPERATURE PROFILE FOR SMD (One Time Reflow Soldering is Recommended) TP 260C TP - 5C Max Ramp Up Rate 3C/s TEMP (C) TL Tsmax Tsmin tP Max Ramp Down Rate 6C/s 217C TL 200C 150C ts Preheat 60s - 120s 25C TIME (s) Time 25C to Peak Temperature Profile Details Conditions Preheat - Min Temperature (TSMIN) - Max Temperature (TSMAX) - Time TSMIN to TSMAX (ts) 150C 200C 60s - 120s Soldering Zone - Peak Temperature (TP) - Time at Peak Temperature - Liquidous Temperature (TL) - Time within 5C of Actual Peak Temperature (TP 5C) - Time maintained above TL (tL) - Ramp Up Rate (TL to TP) - Ramp Down Rate (TP to TL) 260C 10s max 217C 30s max 60s - 100s 3C/s max 6C/s max Average Ramp Up Rate (Tsmax to TP) 3C/s max Time 25C to Peak Temperature 8 minutes max 13 20/01/2017 DD93208 ISOCOM COMPONENTS TLP521, TLP521-2, TLP521-4 NOTES : - Isocom is continually improving the quality, reliability, function or design and Isocom reserves the right to make changes without further notices. - The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical application and instrumentation. - For equipment/application where high reliability or safety is required, such as space applications, nuclear power control equipment, medical equipment, etc., please contact our sales representatives. - When requiring a device for any "specific" application, please contact our sales for advice. - The contents described herein are subject to change without prior notice. - Do not immerse device body in solder paste. 14 20/01/2017 DD93208 ISOCOM COMPONENTS DISCLAIMER __ ISOCOM is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing ISOCOM products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such ISOCOM products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that ISOCOM products are used within specified operating ranges as set forth in the most recent ISOCOM products specifications. __ The ISOCOM products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These ISOCOM products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation Instruments, traffic signal instruments, combustion control instruments, medical Instruments, all types of safety devices, etc.. Unintended Usage of ISOCOM products listed in this document shall be made at the customer's own risk. __ Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. __ The products described in this document are subject to the foreign exchange and foreign trade laws. __ The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by ISOCOM Components for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of ISOCOM Components or others. __ The information contained herein is subject to change without notice. 15 20/01/2017 DD93208