DATA SH EET
Product specification
Supersedes data of 1999 Sep 27 2003 May 26
INTEGRATED CIRCUITS
74AHC14; 74AHCT14
Hex inverting Schmitt trigger
2003 May 26 2
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
FEATURES
•Balanced propagation delays
•Inputs accepts voltages higher than VCC
•For 74AHC only: operates with CMOS input levels
•For 74AHCT only: operates with TTL input levels
•ESD protection:
HBM EIA/JESD22-A114-A exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V.
•Specified from −40 to +85 °C and −40 to +125 °C.
DESCRIPTION
The 74AHC14 and 74AHCT14 are high-speed Si-gate
CMOS devices and are pin compatible with low power
Schottky TTL (LSTTL). They are specified in compliance
with JEDEC standard No. 7A.
The74AHC14and74AHCT14providesixinvertingbuffers
with Schmitt-trigger action. They are capable of
transforming slowly changing input signals into sharply
defined, jitter-free output signals.
QUICK REFERENCE DATA
GND = 0 V; Tamb =25°C; tr=t
f≤3.0 ns.
Notes
1. CPD is used to determine the dynamic power dissipation (PDin µW).
PD=C
PD ×VCC2×fi×N+Σ(CL×VCC2×fo) where:
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in Volts;
N = total load switching outputs;
Σ(CL×VCC2×fo) = sum of the outputs.
2. The condition is VI= GND to VCC.
FUNCTION TABLE
See note 1.
Note
1. H = HIGH voltage level;
L = LOW voltage level.
SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
AHC AHCT
tPHL/tPLH propagation delay nA to nY CL= 15 pF; VCC = 5 V 3.2 4.0 ns
CIinput capacitance VI=V
CC or GND 3.0 3.0 pF
COoutput capacitance 4.0 4.0 pF
CPD power dissipation capacitance per
buffer CL= 50 pF; f = 1 MHz;
notes 1 and 2 10 12 pF
INPUT OUTPUT
nA nY
LH
HL
2003 May 26 3
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
ORDERING INFORMATION
TYPE NUMBER PACKAGE
TEMPERATURE
RANGE PINS PACKAGE MATERIAL CODE
74AHC14D −40 to +125 °C 14 SO14 plastic SOT108-1
74AHCT14D −40 to +125 °C 14 SO14 plastic SOT108-1
74AHC14PW −40 to +125 °C 14 TSSOP14 plastic SOT402-1
74AHCT14PW −40 to +125 °C 14 TSSOP14 plastic SOT402-1
74AHC14BQ −40 to +125 °C 14 DHVQFN14 plastic SOT762-1
74AHCT14BQ −40 to +125 °C 14 DHVQFN14 plastic SOT762-1
PINNING
PIN SYMBOL DESCRIPTION
1 1A data input
2 1Y data output
3 2A data input
4 2Y data output
5 3A data input
6 3Y data output
7 GND ground (0 V)
8 4Y data output
9 4A data input
10 5Y data output
11 5A data input
12 6Y data output
13 6A data input
14 VCC supply voltage
PIN SYMBOL DESCRIPTION
Fig.1 Pin configuration SO14 and TSSOP14.
handbook, halfpage
MNA203
14
1
2
3
4
5
6
78
14
13
12
11
10
9
1A
1Y
2A
2Y
3A
3Y
GND 4Y
4A
5Y
5A
6Y
6A
VCC
Fig.2 Pin configuration DHVQFN14.
handbook, halfpage
114
GND(1)
1A VCC
7
2
3
4
5
6
1Y
2A
2Y
3A
3Y
13
12
11
10
9
6A
6Y
5A
5Y
4A
8
GND
Top view 4Y
MCE196
(1) The die substrate is attached to this pad using conductive die
attach material. It can not be used as a supply pin or input.
2003 May 26 4
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
Fig.3 Logic symbol.
handbook, halfpage
MNA204
1A 1Y
12
2A 2Y
34
3A 3Y
56
4A 4Y
98
5A 5Y
11 10
6A 6Y
13 12
Fig.4 IEC logic symbol.
handbook, halfpage
2
1
MNB034
4
3
6
5
8
9
10
11
12
13
Fig.5 Logic diagram (one Schmitt trigger).
handbook, halfpage
MNA205
AY
2003 May 26 5
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
RECOMMENDED OPERATING CONDITIONS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. For SO14 packages: above 70 °C the value of PDderates linearly with 8 mW/K.
For TSSOP14 packages: above 60 °C the value of PDderates linearly with 5.5 mW/K.
For DHVQFN14 packages: above 60 °C the value of PDderates linearly with 4.5 mW/K.
SYMBOL PARAMETER CONDITIONS 74AHC 74AHCT UNIT
MIN. TYP. MAX. MIN. TYP. MAX.
VCC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V
VIinput voltage 0 −5.5 0 −5.5 V
VOoutput voltage 0 −VCC 0−VCC V
Tamb operating ambient temperature see DC and AC
characteristics per
device
−+25 −−+25 −°C
−40 −+125 −40 −+125 °C
−40 −+125 −40 −+125 °C
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCC supply voltage −0.5 +7.0 V
VIinput voltage −0.5 +7.0 V
IIK input diode current VI<−0.5 V; note 1 −−20 mA
IOK output diode current VO<−0.5 Vor VO>V
CC + 0.5 V; note 1 −±20 mA
IOoutput source or sink current −0.5V<V
O<V
CC + 0.5 V −±25 mA
ICC, IGND VCC or GND current −±75 mA
Tstg storage temperature −65 +150 °C
PDpower dissipation Tamb =−40 to +125 °C; note 2 −500 mW
2003 May 26 6
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
DC CHARACTERISTICS
Type 74AHC14
At recommended operating conditions; voltage are referenced to GND (ground = 0 V).
SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT
OTHER VCC (V)
Tamb =25°C
V
T+ positive going threshold 3.0 −−2.2 V
4.5 −−3.15 V
5.5 −−3.85 V
VT−negative going
threshold 3.0 0.9 −−V
4.5 1.35 −−V
5.5 1.65 −−V
V
Hhysteresis (VT+ −VT−) 3.0 0.3 −1.2 V
4.5 0.4 −1.4 V
5.5 0.5 −1.6 V
VOH HIGH-level output
voltage; all outputs VI=V
IH or VIL;
IO=−50 µA2.0 1.9 2.0 −V
3.0 2.9 3.0 −V
4.5 4.4 4.5 −V
VOH HIGH-level output
voltage VI=V
IH or VIL
IO=−4.0 mA 3.0 2.58 −−V
I
O
=−8.0 mA 4.5 3.94 −−V
V
OL LOW-level output
voltage; all outputs VI=V
IH or VIL;
IO=50µA2.0 −0 0.1 V
3.0 −0 0.1 V
4.5 −0 0.1 V
VOL LOW-level output
voltage VI=V
IH or VIL
IO= 4.0 mA 3.0 −−0.36 V
IO= 8.0 mA 4.5 −−0.36 V
ILI input leakage current VI=V
CC or GND 5.5 −−0.1 µA
ICC quiescent supply
current VI=V
CC or GND;
IO=0 5.5 −−2.0 µA
CIinput capacitance −310pF
2003 May 26 7
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
Tamb =−40 to +85 °C
VT+ positive going threshold 3.0 −−2.2 V
4.5 −−3.15 V
5.5 −−3.85 V
VT−negative going
threshold 3.0 0.9 −−V
4.5 1.35 −−V
5.5 1.65 −−V
V
Hhysteresis (VT+ −VT−) 3.0 0.3 −1.2 V
4.5 0.4 −1.4 V
5.5 0.5 −1.6 V
VOH HIGH-level output
voltage; all outputs VI=V
IH or VIL;
IO=−50 µA2.0 1.9 −−V
3.0 2.9 −−V
4.5 4.4 −−V
V
OH HIGH-level output
voltage VI=V
IH or VIL
IO=−4.0 mA 3.0 2.48 −−V
I
O
=−8.0 mA 4.5 3.8 −−V
V
OL LOW-level output
voltage; all outputs VI=V
IH or VIL;
IO=50µA2.0 −−0.1 V
3.0 −−0.1 V
4.5 −−0.1 V
VOL LOW-level output
voltage VI=V
IH or VIL
IO= 4.0 mA 3.0 −−0.44 V
IO= 8.0 mA 4.5 −−0.44 V
ILI input leakage current VI=V
CC or GND 5.5 −−1.0 µA
ICC quiescent supply
current VI=V
CC or GND;
IO=0 5.5 −−20 µA
CIinput capacitance −−10 pF
SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT
OTHER VCC (V)
2003 May 26 8
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
Tamb =−40 to +125 °C
VT+ positive going threshold 3.0 −−2.2 V
4.5 −−3.15 V
5.5 −−3.85 V
VT−negative going
threshold 3.0 0.9 −−V
4.5 1.35 −−V
5.5 1.65 −−V
V
Hhysteresis (VT+ −VT−) 3.0 0.25 −1.2 V
4.5 0.35 −1.4 V
5.5 0.45 −1.6 V
VOH HIGH-level output
voltage; all outputs VI=V
IH or VIL;
IO=−50 µA2.0 1.9 −−V
3.0 2.9 −−V
4.5 4.4 −−V
V
OH HIGH-level output
voltage VI=V
IH or VIL
IO=−4.0 mA 3.0 2.40 −−V
I
O
=−8.0 mA 4.5 3.70 −−V
V
OL LOW-level output
voltage; all outputs VI=V
IH or VIL;
IO=50µA2.0 −−0.1 V
3.0 −−0.1 V
4.5 −−0.1 V
VOL LOW-level output
voltage VI=V
IH or VIL
IO= 4.0 mA 3.0 −−0.55 V
IO= 8.0 mA 4.5 −−0.55 V
ILI input leakage current VI=V
CC or GND 5.5 −−2.0 µA
ICC quiescent supply
current VI=V
CC or GND;
IO=0 5.5 −−40 µA
CIinput capacitance −−10 pF
SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT
OTHER VCC (V)
2003 May 26 9
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
Type 74AHCT14
At recommended operating conditions; voltage are referenced to GND (ground = 0 V).
SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT
OTHER VCC (V)
Tamb =25°C
V
T+ positive going threshold 4.5 −−1.9 V
5.5 −−2.1 V
VT−negative going
threshold 4.5 0.5 −−V
5.5 0.6 −−V
V
Hhysteresis (VT+ −VT−) 4.5 0.4 −1.4 V
5.5 0.4 −1.5 V
VOH HIGH-level output
voltage; all outputs VI=V
IH or VIL;
IO=−50 µA4.5 4.4 4.5 −V
VOH HIGH-level output
voltage VI=V
IH or VIL;
IO=−8.0 mA 4.5 3.94 −−V
V
OL LOW-level output
voltage; all outputs VI=V
IH or VIL;
IO=50µA4.5 −0 0.1 V
VOL LOW-level output
voltage VI=V
IH or VIL;
IO=8mA 4.5 −−0.36 V
ILI input leakage current VI=V
CC or GND 5.5 −−0.1 µA
ICC quiescent supply
current VI=V
CC or GND;
IO=0 5.5 −−2.0 µA
∆ICC additional quiescent
supply current per input
pin
VI=V
CC −2.1 V other
inputs at VCC or GND;
IO=0
4.5 to 5.5 −−1.35 mA
CIinput capacitance −310pF
2003 May 26 10
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
Tamb =−40 to +85 °C
VT+ positive going threshold 4.5 −−1.9 V
5.5 −−2.1 V
VT−negative going
threshold 4.5 0.5 −−V
5.5 0.6 −−V
V
Hhysteresis (VT+ −VT−) 4.5 0.4 −1.4 V
5.5 0.4 −1.5 V
VOH HIGH-level output
voltage; all outputs VI=V
IH or VIL;
IO=−50 µA4.5 4.4 −−V
V
OH HIGH-level output
voltage VI=V
IH or VIL;
IO=−8.0 mA 4.5 3.8 −−V
V
OL LOW-level output
voltage; all outputs VI=V
IH or VIL;
IO=50µA4.5 −−0.1 V
VOL LOW-level output
voltage VI=V
IH or VIL;
IO=8mA 4.5 −−0.44 V
ILI input leakage current VI=V
CC or GND 5.5 −−1.0 µA
ICC quiescent supply
current VI=V
CC or GND;
IO=0 5.5 −−20 µA
∆ICC additional quiescent
supply current per input
pin
VI=V
CC −2.1 V other
inputs at VCC or GND;
IO=0
4.5 to 5.5 −−1.5 mA
CIinput capacitance −−10 pF
SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT
OTHER VCC (V)
2003 May 26 11
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
Tamb =−40 to +125 °C
VT+ positive going threshold 4.5 −−1.9 V
5.5 −−2.1 V
VT−negative going
threshold 4.5 0.5 −−V
5.5 0.6 −−V
V
Hhysteresis (VT+ −VT−) 4.5 0.35 −1.4 V
5.5 0.35 −1.5 V
VOH HIGH-level output
voltage; all outputs VI=V
IH or VIL;
IO=−50 µA4.5 4.4 −−V
V
OH HIGH-level output
voltage VI=V
IH or VIL;
IO=−8.0 mA 4.5 3.7 −−V
V
OL LOW-level output
voltage; all outputs VI=V
IH or VIL;
IO=50µA4.5 −−0.1 V
VOL LOW-level output
voltage VI=V
IH or VIL;
IO=8mA 4.5 −−0.55 V
ILI input leakage current VI=V
CC or GND 5.5 −−2.0 µA
ICC quiescent supply
current VI=V
CC or GND;
IO=0 5.5 −−40 µA
∆ICC additional quiescent
supply current per input
pin
VI=V
CC −2.1 V other
inputs at VCC or GND;
IO=0
4.5 to 5.5 −−1.5 mA
CIinput capacitance −−10 pF
SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT
OTHER VCC (V)
2003 May 26 12
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
AC CHARACTERISTICS
Type 74AHC14
GND = 0 V; tr=t
f≤3.0 ns.
SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT
OTHER CL(pF) VCC (V)
Tamb =25°C
t
PHL/tPLH propagation delay
nA to nY see Figs 6 and 7 15 3.3 −4.3 −ns
15 3.0 to 3.6 −−12.8 ns
50 3.3 −5.8 −ns
50 3.0 to 3.6 −−16.3 ns
15 5.0 −3.2 −ns
15 4.5 to 5.5 −−8.6 ns
50 5.0 −4.2 −ns
50 4.5 to 5.5 −−10.6 ns
Tamb =−40 to +85 °C
tPHL/tPLH propagation delay
nA to nY see Figs 6 and 7 15 3.0 to 3.6 1.0 −15.0 ns
50 3.0 to 3.6 1.0 −18.0 ns
15 4.5 to 5.5 1.0 −10.0 ns
50 4.5 to 5.5 1.0 −12.0 ns
Tamb =−40 to +125 °C
tPHL/tPLH propagation delay
nA to nY see Figs 6 and 7 15 3.0 to 3.6 1.0 −16.0 ns
50 3.0 to 3.6 1.0 −20.5 ns
15 4.5 to 5.5 1.0 −11.0 ns
50 4.5 to 5.5 1.0 −13.5 ns
2003 May 26 13
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
Type 74AHCT14
GND = 0 V; tr=t
f≤3.0 ns.
SYMBOL PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNIT
OTHER CL(pF) VCC (V)
Tamb =25°C
t
PHL/tPLH propagation delay
nA to nY see Figs 6 and 7 15 5.0 −4.0 −ns
15 4.5 to 5.5 −−7.0 ns
50 5.0 −5.4 −ns
50 4.5 to 5.5 −−8.0 ns
Tamb =−40 to +85 °C
tPHL/tPLH propagation delay
nA to nY see Figs 6 and 7 15 4.5 to 5.5 1.0 −8.0 ns
50 4.5 to 5.5 1.0 −9.0 ns
Tamb =−40 to +125 °C
tPHL/tPLH propagation delay
nA to nY see Figs 6 and 7 15 4.5 to 5.5 1.0 −9.0 ns
50 4.5 to 5.5 1.0 −10.0 ns
AC WAVEFORMS
Fig.6 The input (nA) to output (nY) propagation delays.
FAMILY VI INPUT
REQUIREMENTS VM
INPUT VM
OUTPUT
74AHC14 GND to VCC 0.5VCC 0.5VCC
74AHCT14 GND to 3.0 V 1.5 V 0.5VCC
handbook, halfpage
MNA209
nA input
nY output
tPHL tPLH
VM
VM
2003 May 26 14
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
Fig.7 Load circuitry for switching times.
handbook, full pagewidth
open
GND
VCC
VCC
VIVO
MNA219
D.U.T.
CL
RT
RL =
1 kΩ
PULSE
GENERATOR
S1
TEST S1
tPLH/tPHL open
tPLZ/tPZL VCC
tPHZ/tPZH GND
Definitions for test circuit:
RL= Load resistor.
CL= Load capacitance including jig and probe capacitance.
RT= Termination resistance should be equal to the output impedance Zo of the pulse generator.
2003 May 26 15
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
TRANSFER CHARACTERISTIC WAVEFORMS
Fig.8 Transfer characteristic.
MNA207
VO
VI
VHVT+
VT−
Fig.9 The definition of VT+, VT− and VH.
handbook, halfpage
MNA208
VO
VIVH
VT+
VT−
VT+ and VT− are between limits of 20% and 70%.
Fig.10 Typical 74AHC transfer characteristic.
handbook, halfpage
001 3
1.5
0.5
1
MNA411
2VI (V)
ICC
(mA)
VCC = 3.0 V.
Fig.11 Typical 74AHC transfer characteristic.
handbook, halfpage
05
V
I
(V)
ICC
(mA)
5
0
1
MNA412
2
3
4
1234
V
CC = 4.5 V.
2003 May 26 16
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
Fig.12 Typical AHC transfer characteristic.
handbook, halfpage
02 6
6
0
2
4
MNA413
4VI (V)
ICC
(mA)
VCC = 5.5 V.
Fig.13 Typical 74AHCT transfer characteristic.
handbook, halfpage
05
V
I
(V)
ICC
(mA)
6
0
MNA414
2
4
1234
V
CC = 4.5 V.
Fig.14 Typical 74AHCT transfer characteristics.
handbook, halfpage
02 6
8
0
2
4
6
MNA415
4VI (V)
ICC
(mA)
VCC = 5.5 V.
Fig.15 Relaxation oscillator.
handbook, halfpage
MNA206
R
C
74AHC14:
74AHCT14:
f1
T
---
=1
0.55RC
---------------------
≅
f1
T
---
=1
0.60RC
---------------------
≅
2003 May 26 17
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
PACKAGE OUTLINES
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75 0.25
0.10 1.45
1.25 0.25 0.49
0.36 0.25
0.19 8.75
8.55 4.0
3.8 1.27 6.2
5.8 0.7
0.6 0.7
0.3 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT108-1
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
7
8
1
14
y
076E06 MS-012
pin 1 index
0.069 0.010
0.004 0.057
0.049 0.01 0.019
0.014 0.0100
0.0075 0.35
0.34 0.16
0.15 0.05
1.05
0.041
0.244
0.228 0.028
0.024 0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
99-12-27
03-02-19
0 2.5 5 mm
scale
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
2003 May 26 18
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 5.1
4.9 4.5
4.3 0.65 6.6
6.2 0.4
0.3 0.72
0.38 8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT402-1 MO-153 99-12-27
03-02-18
wM
bp
D
Z
e
0.25
17
14 8
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
A
max.
1.1
pin 1 index
2003 May 26 19
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
terminal 1
index area
0.51
A1Eh
b
UNIT ye
0.2
c
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 3.1
2.9
Dh
1.65
1.35
y1
2.6
2.4 1.15
0.85
e1
2
0.30
0.18
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT762-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT762-1
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm
A(1)
max.
AA1c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
26
13 9
8
7
1
14
X
D
E
C
BA
02-10-17
03-01-27
terminal 1
index area
AC
CB
vM
wM
E(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D(1)
2003 May 26 20
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
SOLDERING
Introduction to soldering surface mount packages
Thistextgives averybrief insighttoa complextechnology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certainsurfacemountICs, butitisnot suitableforfinepitch
SMDs. In these situations reflow soldering is
recommended.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuitboard byscreen printing, stencillingor
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
•below 220 °C (SnPb process) or below 245 °C (Pb-free
process)
– for all the BGA packages
– for packages with a thickness ≥2.5 mm
– for packages with a thickness < 2.5 mm and a
volume ≥350 mm3 so called thick/large packages.
•below 235 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemountdevices (SMDs)orprinted-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
•Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
•For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
•Forpackageswithleads onfoursides,the footprintmust
be placed at a 45°angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2003 May 26 21
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. Formore detailedinformation onthe BGApackages referto the
“(LF)BGAApplication Note
”(AN01026); ordera copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE(1) SOLDERING METHOD
WAVE REFLOW(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA not suitable suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS not suitable(3) suitable
PLCC(4), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(4)(5) suitable
SSOP, TSSOP, VSO, VSSOP not recommended(6) suitable
2003 May 26 22
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
LEVEL DATA SHEET
STATUS(1) PRODUCT
STATUS(2)(3) DEFINITION
I Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseor atany otherconditionsabove thosegiven inthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythatsuch applicationswillbe
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2003 May 26 23
Philips Semiconductors Product specification
Hex inverting Schmitt trigger 74AHC14; 74AHCT14
NOTES
© Koninklijke Philips Electronics N.V. 2003 SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Printed in The Netherlands 613508/03/pp24 Date of release: 2003 May 26 Document order number: 9397 750 11221
