LP5527 www.ti.com SNVS436A - MAY 2006 - REVISED MAY 2013 Tiny LED Driver for Camera Flash and Four LEDs With I2C Programmability, Connectivity Test, and Audio Synchronization Check for Samples: LP5527 FEATURES APPLICATIONS * * * 1 2 * * * * * * * * * High Current Boost DC-DC Converter (up to 1A Output Current) Programmable Boost Output Voltage 400-mA Flash LED Constant-Current Driver With Low Tolerance and Safety Circuit Synchronization Pin for Flash Timing Two Single-Ended Audio Inputs With Gain Control Four Constant-Current 15-mA LED Drivers With 8-Bit Programmable Brightness Control Audio Synchronization Feature I2C-Compatible Control Interface Built-in LED Connectivity Test to Maximize Manufacturing Yield Small DSBGA-30 Package (2.5 mm x 3.0 mm x 0.6 mm) Camera Flash Funlight and Backlight Driving in BatteryPowered Devices DESCRIPTION The LP5527 is a lighting management unit for handheld devices with I2C compatible control interface. The LP5527 has a step-up DC-DC converter with high current output, and it drives display and keypad backlights and powers the camera flash LED. In addition, the DC-DC converter has the output current to power, for example, an audio amplifier simultaneously. The chip has four 8bit programmable high-efficiency constant-current LED drivers and a flash LED driver. Built-in audio synchronization feature allows the user to synchronize one of the LEDs to audio input. Typical Application VIN 3.0 to 5.5 V AUDIO SIGNAL C1 CVDD1 CVDD2 100 nF 100 nF VDD1 VDD2 ASE1 D1 COUT1 COUT2 10 PF 10 PF 10 PF VOUT SW1 SW2 47 nF C2 FB ASE2 LED1 47 nF AUDIO SIGNAL L1 CIN 4.7 PH LED2 2 CAMERA TEST INTERFACE LED3 LP5527 LED4 FLASH_SYNC FLASH IFLASH SDA RT 1.2 k: SCL MCU RT NRST 82 k: VDD_IO CVDD_IO RF GNDs VREF CVREF VDDA 100 nF 100 nF CVDDA 4.7 PF Figure 1. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2006-2013, Texas Instruments Incorporated LP5527 SNVS436A - MAY 2006 - REVISED MAY 2013 www.ti.com DESCRIPTION (CONTINUED) The LP5527 has an integrated 400-mA flash driver with a safety stop feature and 50-mA torch mode. An external enable pin is provided for synchronizing the flash with the camera action. An external software-independent test interface provides a fast way to find a broken path or short on LED circuits. Very small DSBGA package together with minimum number of external components is a best fit for handheld devices. Connection Diagrams and Package Mark Information Connection Diagrams DSBGA-30 package, 2.466 x 2.974 x 0.60 mm body size, 0.5 mm pitch 5 LED2 LED1 GND_ LED FB SW2 SW1 SW1 SW2 FB GND_ LED LED1 LED2 5 4 LED4 LED3 T1 T2 GND_ SW2 GND_ SW1 GND_ SW1 GND_ SW2 T2 T1 LED3 LED4 4 3 NRST SCL GND VDD1 FLASH_ SYNC GNDC GNDC FLASH_ SYNC VDD1 GND SCL NRST 3 2 IFLASH ASE2 ASE1 RT SDA FLASH FLASH SDA RT ASE1 ASE2 IFLASH 2 1 VDD2 VDDA VREF GNDA VDDIO GND_ FLASH GND_ FLASH VDDIO GNDA VREF VDDA VDD2 1 A B C D E F F E D B A Figure 2. Top View C Figure 3. Top View Pin Descriptions Table 1. Pin Descriptions (1) 2 Pin Name Type (1) D3 VDD1 P Supply voltage A1 VDD2 P Supply voltage F5 SW1 A Boost converter switch Description E5 SW2 A Boost converter switch D5 FB A Boost converter feedback B5 LED1 O LED1 driver output A5 LED2 O LED2 driver output B4 LED3 O LED3 driver output A4 LED4 O LED4 driver output F2 FLASH O Flash LED driver output F3 GNDC G Ground for core circuitry D2 RT A Oscillator frequency setting C1 VREF A Reference voltage B1 VDDA P Internal LDO F4 GND_SW1 G Boost converter ground E4 GND_SW2 G Boost converter ground A: Analog Pin, D: Digital Pin, G: Ground Pin, P: Power Pin, I: Input Pin, I/O: Input/Output, Pin O: Output Pin, OD: Open Drain Pin Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 LP5527 www.ti.com SNVS436A - MAY 2006 - REVISED MAY 2013 Table 1. Pin Descriptions (continued) Pin Name Type (1) C5 GND_LED G LEDs 1 to 4 driver ground connection Description F1 GND_FLASH G Flash driver ground connection A2 IFLASH A Resistor for flash current setting D1 GNDA G Analog ground connection C3 GND G Ground E1 VDD_IO P Supply voltage for digital interface A3 NRST DI Low active reset B3 SCL DI I2C compatible interface clock signal E2 SDA OD I2C compatible interface data signal E3 FLASH_SYNC DI Flash LED control D4 T2 DO Test pin (result) C4 T1 DI Test pin (clock) C2 ASE1 AI Audio input B2 ASE2 AI Audio input These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Voltage on power pins (VDD1,2) -0.3V to +6.0V Voltage on analog pins -0.3V to (VDD1,2+0.3V) with 6.0V max Voltage on input/output pins -0.3V to (VDD1,2+0.3V) with 6.0V max V(all other pins): Voltage to GND -0.3V to 6.0V I(VREF) 10 A I(FLASH) Continuous Power Dissipation 500 mA (3) Internally Limited Junction Temperature (TJ-MAX) 125C Storage Temperature Range -65C to +150C Maximum Lead Temperature (Reflow soldering, 3 times) (4) ESD Rating, Human Body Model (1) (2) (3) (4) (5) 260C (5) 2 kV Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which the device operates. Operating Ratings do not imply specified performance limits. For performance limits and associated test conditions, see the Electrical Characteristics tables. All voltages are with respect to the potential at the GND pins. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=160C (typ.) and disengages at TJ=140C (typ.). For detailed soldering specifications and information, see application note AN1112 Micro SMD Wafer Level Chip Scale Package. The Human body model is a 100-pF capacitor discharged through a 1.5-k resistor into each pin. MIL-STD-883 3015.7. Operating Ratings (1) (2) Voltage on power pins (VDD1,2) 3.0 to 5.5V Voltage on ASE1, ASE2 0V to 1.6V VDD_IO 1.65V to VDD1 Junction Temperature (TJ) Range (1) (2) -30C to +125C Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which the device operates. Operating Ratings do not imply specified performance limits. For performance limits and associated test conditions, see the Electrical Characteristics tables. All voltages are with respect to the potential at the GND pins. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 3 LP5527 SNVS436A - MAY 2006 - REVISED MAY 2013 www.ti.com Operating Ratings(1)(2) (continued) Ambient Temperature (TA) Range (3) (3) -30C to +85C In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (JA), as given by the following equation: TA-MAX = TJ-MAX-OP - (JA x PD-MAX). Thermal Properties Junction-to-Ambient Thermal Resistance (JA) (1) (1) 4 60C/W to 100C/W Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 LP5527 www.ti.com SNVS436A - MAY 2006 - REVISED MAY 2013 Electrical Characteristics (1) (2) Limits in standard typeface are for TJ = 25C. Limits in boldface type apply over the operating ambient temperature range (30C < TA < +85C). Unless otherwise noted, specifications apply to the LP5527 Block Diagram with: VIN = 3.6V, CIN = 10 F, COUT1 = 10 F, COUT2 = 10 F, CVDD_IO = 100 nF, CVREF = 100 nF, CVDDA = 4.7 F, CVDD1 = 100 nF, CVDD2 = 100 nF, L1 = 4.7 H. (3) Symbol Parameter Test Conditions Min Typ Max Unit 1 5 A ISHUTDOWN Current of VDD1 + VDD2 pins + Leakage Current of SW1, SW2, LED1 to 4 and FLASH Voltage on VDD_IO = 0V, NRST = L, NSTBY(bit) = L IDD Active Mode Supply Current (VDD1 + VDD2 current) NRST = H, NSTBY(bit) = H, no load, EN_BOOST(bit) = L, SCL, SDA = H 350 A IDD No load supply current (VDD1 + VDD2 current) NSTBY(bit) = H, EN_BOOST(bit) = H, SCL, SDA, NRST = H, AUTOLOAD_EN(bit) = L 850 A IVDDIO VDD_IO Standby Supply current NSTBY(bit) = L VDDA (1) (2) (3) IVDDA = 1 mA -4% 2.8V 1 A +4% V All voltages are with respect to the potential at the GND pins. Min and Max limits are specified by design, test, or statistical analysis. Typical numbers represent the most likely norm. Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 5 LP5527 SNVS436A - MAY 2006 - REVISED MAY 2013 www.ti.com BLOCK DIAGRAM L1 4.7 PH VIN COUT1 CIN 10 PF 10 PF SW1 RT 82k: SW2 INTERNAL OSC PWM VREF 47 nF GNDSW1 ERROR AMP CVREF 100 nF C1 47 nF C2 COUT2 10 PF GNDSW2 FB GAIN CONTROL AND ADC LEVEL DETEC. LIGHTING CONTROL T1 T2 DAC OUTPUT SELECTOR LED1 LED CONNECTIVITY TEST LIGHTING CONTROL DAC DAC CAMERA FLASH_SYNC DAC SCL SDA SERIAL INTERFACE NRST REGISTERS MICROCONTROLLER VDD_IO FINITE STATE MACHINE CVDD_IO 100 nF VDD1 VIN POR CVDD2 100 nF GNDC LED4 FLASH 400 mA FLASH GND_FLASH THERMAL SHUTDOWN RF 1200 : INTERNAL LDO 2.8V GND LED3 KEYPAD AND BACKLIGHT 0 TO 15 mA /LED GND_LED FLASH CONTROL VDD2 CVDD1 100 nF 6 EPROM TIME LIMIT LED2 FUNLIGHT GNDA Submit Documentation Feedback VDDA CVDDA 4.7 PF Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 LP5527 www.ti.com SNVS436A - MAY 2006 - REVISED MAY 2013 MODES OF OPERATION RESET NRST = L or POR= H NSTBY(bit)=L and NRST=H STANDBY NSTBY(bit)=H and NRST=H NSTBY(bit) = H and NRST=H NSTBY(bit)=L and NRST=H INTERNAL STARTUP SEQUENCE TSD=H VREF = 95%OK 1 ~ 10 ms DELAY 1 EN_BOOST(bit)=H 1 EN_BOOST(bit)=L BOOST STARTUP EN_BOOST(bit)=H 1 ~ 10 ms DELAY NORMAL MODE 1) TSD =L RESET: In the reset mode all the internal registers are reset to the default values. Reset is entered always if input NRST is LOW or internal Power On Reset (POR) is active. Power on reset will activate during the chip startup or when the supply voltage VDD2 falls below 1.5V. Once VDD2 rises above 1.5V, POR will inactivate and the chip will continue to the STANDBY mode. NSTBY control bit is low after POR by default. STANDBY: The standby mode is entered if the register bit NSTBY is LOW and reset is not active. This is the low power consumption mode, when all circuit functions are disabled. Registers can be written in this mode and the control bits are effective immediately after start up. STARTUP: When NSTBY bit is written high, the internal startup sequence powers up all the needed internal blocks (VREF, Oscillator, etc.). To ensure the correct oscillator initialization, a 10 ms delay is generated by the internal state-machine. If the chip temperature rises too high, the thermal shutdown (TSD) disables the chip operation and startup mode is entered until no thermal shutdown event is present. BOOST STARTUP: Soft-start for boost output is generated in the boost startup mode. The boost output is raised in a low current PWM mode during the 10 ms delay generated by the state-machine. The boost startup is entered from internal startup sequence if EN_BOOST is HIGH or from normal mode when EN_BOOST is written HIGH. NORMAL: During normal mode the user controls the chip using the Control Registers. The registers can be written in any sequence and any number of bits can be altered in a register in one write. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 7 LP5527 SNVS436A - MAY 2006 - REVISED MAY 2013 www.ti.com MAGNETIC BOOST DC-DC CONVERTER The LP5527 boost DC-DC converter generates a 4.55 - 5.00V output voltage to drive the LEDs from a single LiIon battery (3.0V to 4.5V). The output voltage is controlled with a 4-bit register in 4 steps. The converter is a magnetic switching PWM mode DC-DC converter with a current limit. The converter has 2.0 MHz / 1.0 MHz selectable switching frequency operation, when the timing resistor RT is 82 k. The LP5527 boost converter uses pulse-skipping elimination method to stabilize the noise spectrum. Even with light load or no load a minimum length current pulse is fed to the inductor. An internal active load is used to remove the excess charge from the output capacitor when needed. The topology of the magnetic boost converter is called CPM control, current programmed mode, where the inductor current is measured and controlled with the feedback. The output voltage control changes the resistor divider in the feedback loop. Figure 4 shows the boost topology with the protection circuitry. Four different protection schemes are implemented: 1. Over voltage protection, limits the maximum output voltage - Keeps the output below breakdown voltage. - Prevents boost operation if battery voltage is much higher than desired output. 2. Over current protection, limits the maximum inductor current - Voltage over switching NMOS is monitored; too high voltages turn the switch off. 3. Feedback (FB) protection for no connection. 4. Duty cycle limiting, done with digital control. 2 MHz clock VIN Duty control V OUT SW FB UVCOMP 2V R S + OVPCOMP R + - RESETCOMP + - + SWITCH R R ERRORAMP ACTIVE LOAD R SLOPER LOOPC OCPCOMP + - IMAX Figure 4. Boost Converter Topology 8 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 LP5527 www.ti.com SNVS436A - MAY 2006 - REVISED MAY 2013 MAGNETIC BOOST DC-DC CONVERTER ELECTRICAL CHARACTERISTICS Limits in standard typeface are for TJ = 25C. Limits in boldface type apply over the operating ambient temperature range (30C < TA < +85C). Unless otherwise noted, specifications apply to the LP5527 Block Diagram with: VIN = 3.6V, CIN = 10 F, COUT1 = 10 F, COUT2 = 10 F, CVDDIO = 100 nF, CVREF = 100 nF, CVDDA = 4.7 F, CVDD1 = 100 nF, CVDD2 = 100 nF, L1 = 4.7 H. (4) Symbol Parameter Test Conditions ILOAD Load Current (1) 3.2V VIN 4.5V, VOUT = 5.0V VOUT Output Voltage Accuracy (FB pin) 3.2V VIN 4.5V, VOUT (target value) = 5.0V, active load off Output Voltage (FB Pin) 3.0V VIN (5.0V+VSCHOTTKY), active load off Min Typ -3 Max Unit 670 mA +3 % 5.0 VIN > (5.0V + VSCHOTTKY) V VIN VSCHOTTKY Switch ON Resistance VIN = 3.6V, ISW = 1.0A 0.20 fPWF PWM Mode Switching Frequency RT = 82 k, FREQ_SEL (bit) = 1, FREQ_SEL (bit) = 0 2.0 1.0 Frequency Accuracy 3.2V VDD1,2 4.5V, RT = 82 k tPULSE Switch Pulse Minimum Width No load 25 ns tSTARTUP Startup Time 10 ms ICL_OUT SW1+ SW2 current limit 1.7 A (4) (1) -6 -9 3 0.4 RDSON MHz +6 +9 % Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics. Specified currents are the worst case currents. If input voltage is larger or output voltage is smaller, current can be increased according to graph "Boost Maximum Output Current". BOOST STANDBY MODE User can set the boost converter to STANDBY mode by writing the register bit EN_BOOST low when there is no load to avoid idle current consumption. When EN_BOOST is written high, the converter starts in low current PWM (Pulse Width Modulation) mode for 10 ms and then goes to normal PWM mode. BOOST CONTROL REGISTERS User can control the boost output voltage and the switching frequency according to the following tables. Boost Output Voltage [3:0] Register Boost Output Voltage (Typical) 0000 4.55V 0001 4.70V 0011 4.85V 0111 5.00V FREQ_SEL Bit Boost Switching Frequency (Typical) 0 1.0 MHz (default) 1 2.0 MHz Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 9 LP5527 SNVS436A - MAY 2006 - REVISED MAY 2013 www.ti.com Boost Converter Typical Performance Characteristics TJ = 25C. Unless otherwise noted, typical performance characteristics apply to the Block Diagram with: VIN = 3.6V, VOUT = 5.0V, CIN = 10 F, COUT1 = 10 F, COUT2 = 10 F, CVDD_IO = 100 nF, CVREF = 100 nF, CVDDA = 4.7 F, CVDD1 = 100 nF, CVDD2 = 100 nF, L1 = 4.7 H (1). Boost Typical Waveforms at 100 mA Load fBOOST = 2.0 MHz ILOAD = 100 mA 500 mA 670 mA L = TDK VLCF5020T-4R7N1R7-1 VSWITCH (5V/DIV) ICOIL=150 mA AVERAGE (100mA/DIV) 300 mA VOUT (10 mV/DIV) Boost Converter Efficiency Figure 5. Figure 6. Battery Current vs Voltage Boost Frequency vs RT Resistor ILOAD = 670 mA FREQ_SEL (bit) =1 VOUT = 5.0V FREQ_SEL (bit) =0 VOUT = 4.55V Figure 7. (1) 10 Figure 8. Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 LP5527 www.ti.com SNVS436A - MAY 2006 - REVISED MAY 2013 Boost Converter Typical Performance Characteristics (continued) TJ = 25C. Unless otherwise noted, typical performance characteristics apply to the Block Diagram with: VIN = 3.6V, VOUT = 5.0V, CIN = 10 F, COUT1 = 10 F, COUT2 = 10 F, CVDD_IO = 100 nF, CVREF = 100 nF, CVDDA = 4.7 F, CVDD1 = 100 nF, CVDD2 = 100 nF, L1 = 4.7 H (1). Boost Line Regulation 3.0V - 3.6V, no load Boost Startup Time with No Load VIN (500 mV/DIV) VIN (3.0V TO 3.6V) VOUT (10 mV/DIV) EN_AUTOLOAD (bit) = 1 ILOAD = 50 mA Figure 9. Figure 10. Boost Load Transient Response, 50 mA to 100 mA Boost Maximum Output Current ILOAD (20 mA/DIV) fBOOST = 2.0 MHz VOUT = 5V (50 mV/DIV) VOUT = 4.55V VOUT = 5.0V L = TDK VLCF5020T-4R7N1R7-1 Figure 11. Figure 12. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 11 LP5527 SNVS436A - MAY 2006 - REVISED MAY 2013 www.ti.com FLASH DRIVER LP5527 has an internal constant current driver that is capable for sinking low (50 mA) and high (400 mA) current mainly targeted for torch and flash LED in camera phone applications. 400 mA flash driver can be hardware or software enabled. Flash safety function prevents hardware damages due to possible overheating when the flash has been stuck on because of a hardware, software, or user error. Flash safety counter starts counting when the flash is activated, and disables the flash automatically when the pre-defined 1.0s or 2.0s time limit is reached. Flash is activated with FLASH_SYNC bit or FLASH_SYNC pin, as defined in Table 2. Safety time limit is defined by SAFETY_TIME bit. (Time limit is 2.0s if SAFETY_TIME bit is low and 1.0s if the bit is high.) Table 2. Flash LED Control (X = don't care) EN_TORCH Bit EN_FLASH Bit FLASH_SYNC Bit or Pin SAFETY_TIME Bit Flash LED Action 0 0 X X Off 1 0 X X Torch X 1 Change from LOW to HIGH to engage; from HIGH to LOW to disengage 0 for 2.0 seconds; 1 for 1.0 second Flash Table 3. Flash Programming Example Address Data 00H 8FH Sets safety time to 1.0s. In this example LED1 to LED4 are enabled. Function 00H 9FH Enables torch. 00H FFH Activates FLASH. EN_FLASH bit and FLASH_SYNC bit are written simultaneously because EN_FLASH disables torch. 00H BFH Disables FLASH. If FLASH is disabled by safety time, FLASH_SYNC bit needs to be written to 0 before next FLASH. FLASH DRIVER ELECTRICAL CHARACTERISTICS Limits in standard typeface are for TJ = 25C. Limits in boldface type apply over the operating ambient temperature range (-30C < TA < +85C). Unless otherwise noted, specifications apply to the LP5527 Block Diagram with: VIN = 3.6V, CIN = 10 F, COUT1 = 10 F, COUT2 = 10 F, CVDDIO = 100 nF, CVREF = 100 nF, CVDDA = 4.7 F, CVDD1 = 100 nF, CVDD2 = 100 nF, L1 = 4.7 H, RF = 1200 Symbol Parameter Test Conditions Min Typ Max Unit 370 (-7,5%) 400 430 (+7,5%) mA IMAX Maximum Sink Current 3.0V VIN 5.5V, VFLASH = 1.0V ITORCH Torch Mode Sink Current 3.0V VIN 5.5V 50 mA ILEAKAGE Flash Driver Leakage Current VFB = 5.0V 0.1 A tFLASH Flash Turn-On Time (1) 20 s VSAT Saturation Voltage 550 mV tSAFETY Safety Time Accuracy (1) 12 3.0V VIN 5.5V, Current decreased to 95% of the maximum sink current -9 +9 % Flash turn-on time is measured from the moment the flash is activated until the flash current crosses 90% of its target value. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 LP5527 www.ti.com SNVS436A - MAY 2006 - REVISED MAY 2013 CONSTANT CURRENT SINK OUTPUTS LED1, LED2, LED3, LED4 LP5527 has four independent backlight/keypad LED drivers. All the drivers are regulated constant current sinks. LED currents are controlled by 8-bit current mode DACs. Every driver can be controlled in two ways: 1. Brightness control with constant current drivers 2. Direct ON/OFF control. The current is pre-set by 8-bit current mode DAC. In addition, LED1 driver can be synchronized to audio input signal amplitude. By using brightness control user can set brightness of every single LED by using 8-bit brightness control registers. If analog audio is available on system the user can use audio synchronization for synchronizing LED1 to the music. Direct ON/OFF control is mainly for switching LEDs on and off. LED Control Register (00 hex) has control bits for direct on/off control of all the LEDs. Note that the LEDs have to be turned on to control them with audio synchronization (LED1 only) or brightness control. The brightness is programmed as described in the following. ILED = n x (15 mA / 255) (1) where: n = LED[7:0] (8-bit) step = 15 mA / 255 0.05882 mA For example if 13.2 mA is required for driver current: n = 13.2 mA / (15 mA / 255) 224 224 = 1110 0000, E0 hex Table 4. LED1 to LED4 Brightness Control LED1[7:0], LED2[7:0], LED3[7:0], LED4[7:0] Register Driver Current (mA) (Typical) 0000 0000 0 0000 0001 0.059 0000 0010 0.118 1110 0000 13.176 1111 1110 14.941 1111 1111 15 LED1 TO LED4 DRIVERS ELECTRICAL CHARACTERISTICS Limits in standard typeface are for TJ = 25C. Limits in boldface type apply over the operating ambient temperature range (-30C < TA < +85C). Unless otherwise noted, specifications apply to the LP5527 Block Diagram with: VIN = 3.6V, CIN = 10 F, COUT1 = 10 F, COUT2 = 10 F, CVDDIO = 100 nF, CVREF = 100 nF, CVDDA = 4.7 F, CVDD1 = 100 nF, CVDD2 = 100 nF, L1 = 4.7 H. (1) Symbol Parameter Test Conditions IMAX Maximum sink current ILEAKAGE Leakage current VFB = 5.0V ILED Current tolerance ISINK =13.2 mA (target value) IMATCH Sink current matching between LED1 to LED4 (1) ISINK =13.2 mA VSAT Saturation voltage 3.0V VIN 5.5V, Current decreased to 95% of the maximum sink current Min Typ 11.9 13.2 A 14.5 mA +10 % 1 150 Unit mA 0.03 -10 (1) (1) Max 15 % 230 mV Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics. Sink current matching is the maximum difference from the average. Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 13 LP5527 SNVS436A - MAY 2006 - REVISED MAY 2013 www.ti.com AUDIO SYNCHRONIZATION The LED1 output can be synchronized to incoming audio signal with Audio Synchronization feature. Audio Synchronization synchronizes LED1 based on input signal's peak amplitude. Programmable gain and automatic gain control function are also available for adjustment of input signal amplitude to light response. Control of LED1 brightness refreshing frequency is done with four different frequency configurations. The digitized input signal has a DC component that is removed by a digital DC-remover. The DC-remover is a high-pass filter where corner frequency is user selectable by using DC_FREQ bit. LP5527 has 2-channel audio (stereo) input for audio synchronization, as shown in Figure 13. The inputs accept signals in the range of 0V to 1.6V peak-to-peak and these signals are mixed into a single wave so that they can be filtered simultaneously. LP5527 audio synchronization is mainly done digitally and it consists following signal path blocks (see Figure 13). * Input buffer * AD converter * Automatic Gain Control (AGC) and manually programmable gain * Peak detector Automatic Gain Control (AGC) adjusts the input signal to suitable range automatically. User can disable AGC and the gain can be set manually with programmable gain. Audio synchronization is based on peak detection method. EN_AGC GAIN_SEL [2:0] ASE1 Threshold & AGC ADC ASE2 SPEED_CTRL[1:0] 15k 15k PEAK DETECTOR HOLD LED1 CONTROL THRESHOLD [3:0] Figure 13. Table 5. Audio Synchronization Input Electrical Parameters Symbol Parameter Test Conditions ZIN Input impedance of ASE1, ASE2 AIN ASE1, ASE2 audio input level range (peak-to-peak) Min input level needs maximum gain, Max input level for minimum gain Min Typ 10 15 0 Max Unit 1600 mV k CONTROL OF AUDIO SYNCHRONIZATION Table 6 describes the controls required for audio synchronization. LED1 brightness control through serial interface is not available when audio synchronization is enabled. Table 6. Audio Synchronization Control EN_SYNC Audio synchronization enabled. Set EN_SYNC = 1 to enable audio synchronization or 0 to disable. EN_AGC Automatic gain control. Set EN_AGC = 1 to enable automatic control or 0 to disable. When EN_AGC is disabled, the audio input signal gain value is defined by GAIN_SEL. GAIN_SEL[2:0] Input signal gain control. Gain has a range from 0 dB to -46 dB. SPEED_CTRL[1:0] Control for refreshing frequency. Sets the typical refreshing rate for the LED1 output. THRESHOLD[3:0] Control for the audio input threshold. Sets the typical threshold for the audio inputs signals. May be needed if there is noise on the audio lines. DC_FREQ Control for the high-pass filter corner frequency. 0 = 80 Hz 1 = 510 Hz 14 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 LP5527 www.ti.com SNVS436A - MAY 2006 - REVISED MAY 2013 Table 7. Audio Input Threshold Setting Threshold[3:0] Threshold Level, mV (typical) 0000 Disabled 0001 0.2 0010 0.4 1110 2.5 1111 2.7 Table 8. Typical Gain Values vs. Audio Input Amplitude Audio Input Amplitude mVP-P Gain Value dB 0 to 10 0 0 to 20 -6 0 to 40 -12 1 to 85 -18 3 to 170 -24 5 to 400 -31 10 to 800 -37 20 to 1600 -46 Table 9. Input Signal Gain Control GAIN_SEL[2:0] Gain dB 000 0 001 -6 010 -12 011 -18 100 -24 101 -31 110 -37 111 -46 Table 10. Refreshing Frequency SPEED_CTRL[1:0] Refreshing Rate Hz 00 FASTEST 01 15 10 7.6 11 3.8 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 15 LP5527 SNVS436A - MAY 2006 - REVISED MAY 2013 www.ti.com LOGIC INTERFACE CHARACTERISTICS Limits in standard typeface are for TJ = 25C. Limits in boldface type apply over the operating ambient temperature range (30C < TA < +85C). Unless otherwise noted, specifications apply to the LP5527 Block Diagram with: VIN = 3.6V, CIN = 10 F, COUT1 = 10 F, COUT2 = 10 F, CVDDIO = 100 nF, CVREF = 100 nF, CVDDA = 4.7 F, CVDD1 = 100 nF, CVDD2 = 100 nF, L1 = 4.7 H (1) Symbol Parameter Test Conditions Min Typ Max Unit 0.2 x VDD_IO V Logic Inputs SCL and FLASH_SYNC VIL Input Low Level VIH Input High Level II Input Current fSCL SCL Pin Clock Frequency VDD_IO = 1.65V to VDD1,2 0.8 x VDD_IO V -1.0 1.0 400 A kHz Logic Input NRST VIL Input Low Level VDD_IO = 1.65V to VDD1,2 VIH Input High Level 1.2 II Input Current -1.0 tNRST Reset Pulse Width 0.5 V 1.0 A V 10 s Logic Input/Output SDA VOL Output Low Level IOUT = 3 mA IL Output leakage current VOUT = 2.8V (1) 0.3 0.5 V 1.0 A Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics. I2C COMPATIBLE INTERFACE I2C SIGNALS The SCL pin is used for the I2C clock and the SDA pin is used for bidirectional data transfer. Both these signals need a pullup resistor according to I2C specification. The values of the pullup resistors are determined by t I2C Timing Parametershe capacitance of the bus (~1.8 k typical). Signal timing specifications are shown in . I2C DATA VALIDITY The data on SDA line must be stable during the HIGH period of the clock signal (SCL). In other words, state of the data line can only be changed when CLK is LOW. SCL SDA data change allowed data valid data change allowed data valid data change allowed Figure 14. I2C Signals: Data Validity I2C START AND STOP CONDITIONS START and STOP bits classify the beginning and the end of the I2C session. START condition is defined as SDA signal transitioning from HIGH to LOW while SCL line is HIGH. STOP condition is defined as the SDA transitioning from LOW to HIGH while SCL is HIGH. The I2C master always generates START and STOP bits. The I2C bus is considered to be busy after START condition and free after STOP condition. During data transmission, I2C master can generate repeated START conditions. First START and repeated START conditions are equivalent, function-wise. 16 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 LP5527 www.ti.com SNVS436A - MAY 2006 - REVISED MAY 2013 SDA SCL S P START condition STOP condition Figure 15. I2C Start and Stop Conditions TRANSFERRING DATA Every byte put on the SDA line must be eight bits long, with the most significant bit (MSB) being transferred first. Each byte of data has to be followed by an acknowledge bit. The acknowledge related clock pulse is generated by the master. The transmitter releases the SDA line (HIGH) during the acknowledge clock pulse. The receiver must pull down the SDA line during the 9th clock pulse, signifying an acknowledge. A receiver which has been addressed must generate an acknowledge after each byte has been received. After the START condition, the I2C master sends a chip address. This address is seven bits long followed by an eighth bit which is a data direction bit (R/W). The LP5527 address is 4C hex. For the eighth bit, a "0" indicates a WRITE and a "1" indicates a READ. The second byte selects the register to which the data will be written. The third byte contains data to write to the selected register. When a READ function is to be accomplished, a WRITE function must precede the READ function, as shown in the I2C Read Cycle waveform. MSB ADR6 Bit7 LSB ADR5 bit6 ADR4 bit5 ADR3 bit4 ADR2 bit3 ADR1 bit2 ADR0 bit1 R/W bit0 2 I C SLAVE address (chip address) Figure 16. I2C Chip Address 4C hex for LP5527 ack from slave start msb Chip Address lsb ack from slave ack from slave w ack msb Register Add lsb ack msb Data w ack addr = 02 hex ack address 02 lsb ack stop SCL SDA start Id = 4C data ack stop w = write (SDA = "0") r = read (SDA = "1") ack = acknowledge (SDA pulled down by either master or slave) rs = repeated start id = chip address, 4C hex for LP5527. Figure 17. I2C Write Cycle Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 17 LP5527 SNVS436A - MAY 2006 - REVISED MAY 2013 www.ti.com start msb Chip Address lsb w ack from slave data from slave ack from master ack from slave repeated start ack from slave rs msb Register Add lsb msb Chip Address lsb r msb Data lsb stop SCL SDA start Id = 4C addr = 00 hex w ack ack rs r ack Address 00 hex data ack stop Id Figure 18. I2C Read Cycle SDA 10 8 7 6 1 8 2 7 SCL 5 1 3 4 9 Figure 19. I2C Timing Diagram I2C TIMING PARAMETERS (VDD1,2 = 3.0 to 4.5V, VDDIO = 1.65V to VDD1,2) Symbol (1) 18 Parameter 1 Hold time (repeated) START condition 2 3 Limit (1) Min Max Unit 0.6 s Clock low time 1.3 s Clock high time 600 ns 4 Setup time for a repeated START condition 600 ns 5 Data hold time (output direction, delay generated by LP5527) 300 900 ns 5 Data hold time (input direction) 0 900 ns 6 Data setup time 7 Rise time of SDA and SCL 20+0.1Cb 300 ns 8 Fall time of SDA and SCL 15+0.1Cb 300 ns 9 Setup time for STOP condition 600 ns 10 Bus free time between a STOP and a START condition 1.3 s Cb Capacitive load for each bus line 10 100 ns 200 pF Data specified by design Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 LP5527 www.ti.com SNVS436A - MAY 2006 - REVISED MAY 2013 TEST INTERFACE The test bus can be controlled externally or internally. For the external control, the LP5527 pins VDD1,2 only need to be powered. External control is independent on status of NRST and VDDIO pins. T1 is an input and it has an internal 6 k pulldown resistor. T2 is an output line for the test result with an internal 200 k pulldown resistor. When T1 is low, T2 is always pulled down; when T1 is high, T2 is indicating the result of the test. 4.2V FLASH LED4 LED3 LED2 LED1 T1 COUNTER PASS/ FAIL V 500 PA T2 Figure 20. High Level Schematic Representation of the Test Interface The device is capable of detecting a defective unit in three cases: * Production test 1: The LP5527 is assembled on a printed wiring board (PWB), but there is no LEDs connected on current sink outputs. An external 4.2V test voltage is supplied on the VDD1 and VDD2 pins, from which follows that the reset operating mode is entered with POR. Test pin T1 is pulled high. The chip will send an acknowledge "1" onto the T2 pin if the chip is in working order; otherwise T2 stays low (0). See Figure 21. * Production test 2: The LP5527 is assembled on a PWB with the external components shown in LP5527 Block Diagram. 4.2V voltage is connected to VDD1, VDD2 and FB pins (see Figure 20), from which follows that the reset operating mode is entered with POR. Test pin T1 is pulled high. The chip will send an acknowledge "1" onto the T2 pin if the chip is in working order; otherwise T2 stays low (0). If the ACK is "1", a repetitive test pattern "0-1-0-1-0-1-0-1-0-1-0-1" is applied to T1 pin and if the LED corresponding the pattern (see Figure 21) is connected properly T2 gives "1", otherwise T2 stays low. The last "1" disengages the test. * Field test: Build-in self-test through the I2C compatible control interface. The LP5527 is enabled (NSTBY(bit) = 1, EN_BOOST(bit) = 1) and external test pins T1 and T2 are disconnected. The result can be read through the I2C compatible control interface. LED test is enabled by writing to address 0Ch hex data 01h. Result can be read from the same address during the next I2C cycle. Note: I2C compatible interface clock signal controls the timing of the test procedure. For that reason the clock signal frequency should be 50 kHz or less during the build-in self-test. T1 1 2 3 4 T2 DUT OK LED1 OK LED2 OK LED3 OK LED4 OK FLED OK 5 Figure 21. Test Interface Timing Diagram Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 19 LP5527 SNVS436A - MAY 2006 - REVISED MAY 2013 www.ti.com Table 11. Test Interface Timing Parameters Symbol Parameter Limit (1) Test Conditions Min (1) VDD1,2 = 4.2V Unit Max 1 Setup Time after VDD1,2 = 4.2V 1 ms 2 Clock High Time 200 s 3 Clock Low Time 200 4 Test Result Settling Time 5 Data Hold Time s 0 10 s 10 ns Data specified by design Test Interface Characteristics (2) Limits in standard typeface are for TJ = 25C Symbol Parameter Test Conditions Min Typ Max Unit 0.5 V Logic Input T1 VIL Input Low Level VIH Input High Level VDD1,2 = 4.2V 1.2 V Logic Output T2 VOL Output Low Level VDD1,2 = 4.2V, IOUT = 3 mA (pullup current) VOH Output High Level VDD1,2 =4.2V, IOUT = -3 mA (pulldown current) 0.3 VDD1,2 - 0,5 0.5 V 3.9 V 500 A Internal Current Sink ISINK Sink Current VDD1,2 = 4.2V Connectivity Test Pass Range VPASS1 Voltage Over the Internal Current Sink; Low Level VPASS2 Voltage Over the Internal Current Sink; High Level VPASS3 Voltage Over the Internal Current Sink; Low Level VPASS4 Voltage Over the Internal Current Sink; High Level (2) Production test cases VDD1,2 = 4.2V VOUT = 3.9V to 4.2V 0.05 0.10 0.16 V +60 % 2.90 3.77 V +30 % -50 2.03 -30 Field test cases VDD1,2 = 3.0V to 4.2V VOUT = 5.0V 5% -30% 0.40 +30% V -10% 3.95 +10% V Data specified by design RECOMMENDED EXTERNAL COMPONENTS OUTPUT CAPACITOR, COUT1, COUT2 The output capacitors COUT1, COUT2 directly affect the magnitude of the output ripple voltage. In general, the higher the value of COUT, the lower the output ripple magnitude. Multilayer ceramic capacitors with low ESR are the best choice. At the lighter loads, the low ESR ceramics offer a much lower VOUT ripple that the higher ESR tantalums of the same value. At the higher loads, the ceramics offer a slightly lower VOUT ripple magnitude than the tantalums of the same value. However, the dv/dt of the VOUT ripple with the ceramics is much lower that the tantalums under all load conditions. Capacitor voltage rating must be sufficient, 10V is recommended Some ceramic capacitors, especially those in small packages, exhibit a strong capacitance reduction with the increased applied voltage. The capacitance value can fall to below half of the nominal capacitance. Too low output capacitance can make the boost converter unstable. INPUT CAPACITOR, CIN The input capacitor CIN directly affects the magnitude of the input ripple voltage and to a lesser degree the VOUT ripple. A higher value CIN will give a lower VIN ripple. Capacitor voltage rating must be sufficient, 10V or greater is recommended. 20 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 LP5527 www.ti.com SNVS436A - MAY 2006 - REVISED MAY 2013 OUTPUT DIODE, D1 The output diode for a boost converter must be chosen correctly depending on the output voltage and the output current. The diode must be rated for a reverse voltage greater than the output voltage used. The average current rating must be greater than the maximum load current expected, and the peak current rating must be greater than the peak inductor current (~1.6A at maximum load). A Schottky diode should be used for the output diode. Schottky diodes with a low forward voltage drop (VF) and fast switching speeds are ideal for increasing efficiency in portable applications. Do not use ordinary rectifier diodes, since slow switching speeds and long recovery times cause the efficiency and the load regulation to suffer. In Schottky barrier diodes reverse leakage current increases quickly with the junction temperature. Therefore, reverse power dissipation and the possibility of thermal runaway has to be considered when operating under high temperature conditions. Examples of suitable diodes are Diodes Incorporated type DFLS220L, ON Semiconductor type MBRA210LT3 and Philips type PMEG1020. INDUCTOR, L1 The LP5527 high switching frequency enables the use of the small surface mount inductor. A 4.7 H shielded inductor is suggested for 2 MHz switching frequency. The inductor should have a saturation current rating higher than the peak current it will experience during circuit operation (~1.7A at maximum load). Less than 300 m ESR is suggested for high efficiency. Open core inductors cause flux linkage with circuit components and interfere with the normal operation of the circuit. This should be avoided. For high efficiency, choose an inductor with a high frequency core material such as ferrite to reduce the core losses. To minimize radiated noise, use a toroid, pot core or shielded core inductor. The inductor should be connected to the SW1 and SW2 pins as close to the IC as possible. Example of a suitable inductor is TDK type VLCF5020T-4R7N1R7-1. Table 12. List of Recommended External Components Symbol Symbol Explanation Value Unit CVDD1 VDD1 Bypass Capacitor 100 nF Ceramic, X5R CVDD2 VDD2 Bypass Capacitor 100 nF Ceramic, X5R COUT1,2 Output Capacitors from FB to GND 2 x 10 F 10% F Ceramic, X5R, 10V CIN Input Capacitor from Battery Voltage to GND 10 10% F Ceramic, X5R, 10V CVDDIO VDD_IO Bypass Capacitor 100 nF Ceramic, X5R CVDDA VDDA Bypass Capacitor 4.7 F Ceramic, X5R, 6.3V C1,2 Audio Input Capacitors 47 nF Ceramic, X5R RT Oscillator Frequency Bias Resistor 82 k 1% RF Flash Current Set Resistor for 400 mA Sink Current 1200 1% CVREF Reference Voltage Capacitor, between VREF and GND 100 nF Ceramic, X5R L1 Boost Converter Inductor 4.7 H Shielded, low ESR, ISAT ~1.7A D1 Rectifying Diode, VF at maximum load 0.35 V Flash LED Type Schottky diode User defined LED1 to LED4 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 21 LP5527 SNVS436A - MAY 2006 - REVISED MAY 2013 www.ti.com CONTROL REGISTERS Table 13. LP5527 Control Registers and Default Values (1) ADDR (HEX) REGISTER D7 D6 D5 D4 D3 D2 D1 D0 00 LED Control Register safety_time flash_sync en_flash en_torch en_led1 en_led2 en_led3 en_led4 0 0 0 0 0 0 0 0 led1[6] led1[5] led1[4] led1[3] led1[2] led1[1] led1[0] 01 LED1 led1[7] 0 0 0 0 0 0 0 0 02 LED2 led2[7] led2[6] led2[5] led2[4] led2[3] led2[2] led2[1] led2[0] 0 0 0 0 0 0 0 0 03 LED3 led3[7] led3[6] led3[5] led3[4] led3[3] led3[2] led3[1] led3[0] 0 0 0 0 0 0 0 0 04 LED4 led4[7] led4[6] led4[5] led4[4] led4[3] led4[2] led4[1] led4[0] 0 0 0 0 0 0 0 0B ENABLES nstby en_boost en_autoload freq_sel 0 0 1 0 0C LED Test Control led1_ok led2_ok led3_ok led4_ok flashled_ok r/o r/o r/o r/o r/o boost[3] boost[2] 0 (1) 22 0D Boost Output 2A Audio Sync Control1 gain_sel[2] 0 0 2B Audio Sync Control2 threshold[3] threshold[2] 0 0 1 1 gain_sel[1] 0 1 dc_freq en_agc en_sync 0 0 0 0 threshold[1] threshold[0] gain_sel[0] en_test 0 boost[1] boost[0] 1 1 speed_ctrl[1] speed_ctrl[2] 0 0 r/o = Read Only Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 LP5527 www.ti.com SNVS436A - MAY 2006 - REVISED MAY 2013 REVISION HISTORY Changes from Original (April 2013) to Revision A * Page Changed layout of National Data Sheet to TI format .......................................................................................................... 22 Submit Documentation Feedback Copyright (c) 2006-2013, Texas Instruments Incorporated Product Folder Links: LP5527 23 PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LP5527TL/NOPB ACTIVE DSBGA YZR 30 TBD Call TI Call TI -30 to 85 5527 LP5527TLX/NOPB ACTIVE DSBGA YZR 30 TBD Call TI Call TI -30 to 85 5527 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 29-Aug-2015 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA YZR0030xxx 0.6000.075 D E TLA30XXX (Rev C) 4215057/A NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. www.ti.com 12/12 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2015, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LP5527TL/NOPB LP5527TLX/NOPB