7.62mm
[0.300"]
20.32mm [0.800"]
5.72mm [0.225"] 0.64mm [0.025"] typ.
7.29mm
[0.287"]
3.99mm
[0.157"]
12.70mm
[0.500"]
1.59mm
[0.063"] 6.99mm
[0.275"] 12.07mm
[0.475"]
1.27mm [0.050"] typ.
Ø 0.46mm [Ø 0.018"] typ.2.54mm [0.100"] typ.
Front View
Top View
Date: 2/21/06
PC-SOIC/DIP16-02F Drawing Rev: B
Status: Released
File: PC-SOIC/DIP16-02F Dwg Modified: 9/28/07
Scale : 3:1
Drawing by: H. Hanse n
Description : PACKAGE CONVERTOR
16 position (0.050" pitch) SOIC SM land pattern to 0.300" wide dip, round machined pins. Pin assignment; 1:1.
Add "W" to part # for optional wire wrap sub base.
Tolerances: diameters ±0. 03mm [±0. 001”], PCB perimet ers ±0.13mm [±0.005”], PCB thicknesse s ±0.18mm [±0. 007"], pit ches (from t rue position)
±0.08mm [±0.003"] , all other tolerances ±0.13 m m [± 0.005”] unle ss st ated otherwise . Materi al s and specif i cat i ons are subject to change without noti ce.
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-820 0
www.ironwoodelectronics.com
RoHS COMPLIANT
Pins: Material- Brass Alloy 360 1/2 hard; finish-
10µ" Au over 50µ" Ni (min.).
2
1Substrate: 1.59mm ±0 .18mm [0.0625" ±0.007"]
per IPC 4101/21, RoHS surface finish.
Right Side View
23
1
