20.32mm [0.800"] 5.72mm [0.225"] 0.64mm [0.025"] typ. 1.59mm 12.70mm [0.063"] [0.500"] 6.99mm 12.07mm [0.275"] [0.475"] 1.27mm [0.050"] typ. Top View 1 3.99mm [0.157"] 7.29mm [0.287"] 2 2.54mm [0.100"] typ. O 0.46mm [O 0.018"] typ. Front View 3 7.62mm [0.300"] Right Side View RoHS COMPLIANT 1 Substrate: 1.59mm 0.18mm [0.0625" 0.007"] per IPC 4101/21, RoHS surface finish. 2 Pins: Material- Brass Alloy 360 1/2 hard; finish10" Au over 50" Ni (min.). Description: PACKAGE CONVERTOR 16 position (0.050" pitch) SOIC SM land pattern to 0.300" wide dip, round machined pins. Pin assignment; 1:1. Add "W" to part # for optional wire wrap sub base. Tolerances: diameters 0.03mm [0.001"], PCB perimeters 0.13mm [0.005"], PCB thicknesses 0.18mm [0.007"], pitches (from true position) 0.08mm [0.003"], all other tolerances 0.13mm [0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. PC-SOIC/DIP16-02F Drawing Status: Released (c) 2006 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing by: H. Hansen Date: 2/21/06 File: PC-SOIC/DIP16-02F Dwg Modified: 9/28/07 Scale: 3:1 Rev: B