RC6432G100AS - Samsung Semiconductor Division

Chip Resistor

- Precision -

Chip Resistor - Precision

- 1 -

■INTRODUCTION

Chip resistors are general passive component which is useful for derating voltage, current

controlling in circuit and surface mounting is available. Precise chip resistors are the current of

the world more and more, so we develop the precision types of chip resistors in order to

correspond to these user's needs trends. Production is increasing with demand for small size &

light weight of set product. We provide ultra-small, high-reliability, high-stability resistors.

■FEATURE AND APPLICATION

●Feature

- Low tolerance. (Under ± 1%)

- Both flow and reflow soldering are applicable.

- Suitable size and packing for surface mount assembly.

- Owing to the reduced lead inductance, the high frequency characteristic is excellent.

●Application

- Circuit for high precision resistance and reliability.

- For Signal control part.

- For Tunning circuit, etc.

Chip Resistor - Precision

- 2 -

■STRUCTURE

Chip Resistor - Precision

- 3 -

■APPEARANCE AND DIMENSION

TYPE inch Power (W) L W H I1I2Unit

Weight

1005 0402 1/16 1.00±0.05 0.50±0.05 0.35±0.05 0.20±0.10 0.25±0.10 0.6㎎

1608 0603 1/10 1.60±0.10 0.80±0.15 0.45±0.10 0.30±0.20 0.35±0.20 2.1㎎

2012 0805 1/8 2.00±0.20 1.25±0.15 0.50±0.10 0.40±0.20 0.35±0.20 4.9㎎

3216 1206 1/4 3.20±0.20 1.60±0.15 0.55±0.10 0.45±0.20 0.40±0.20 9.5㎎

3225 1210 1/4 3.20±0.20 2.55±0.20 0.55±0.10 0.45±0.20 0.40±0.20 16㎎

5025 2010 1/2 5.00±0.15 2.50±0.15 0.55±0.15 0.60±0.20 0.60±0.20 26㎎

6432 2512 16.30±0.15 3.20±0.15 0.55±0.15 0.60±0.20 0.60±0.20 41㎎

[Unit:㎜]

Chip Resistor - Precision

- 4 -

■PART NUMBERING

RC : This code expresses the Resistor that is produced by Samsung Electro-Mechanics

CO.LTD.

The dimension is expressed as 4 digits number by SI unit (mm). <Table 1>

Left 2 digits are length of resistor, and the other 2 digits are width. <Fig 1>

<Fig 1>

Dimension 1005 1608 2012 3216 3225 5025 6432

(inch) (0402) (0603) (0805) (1206) (1210) (2010) (2512)

L1.00±0.05 1.60 ±0.10 2.00 ±0.20 3.20 ±0.20 3.20 ±0.20 5.00 ±0.15 6.30 ±0.15

W0.50±0.05 0.80 ±0.15 1.25 ±0.15 1.60 ±0.15 2.55 ±0.20 2.50 ±0.15 3.20 ±0.15

H0.35±0.05 0.45 ±0.10 0.50 ±0.10 0.55 ±0.10 0.55 ±0.10 0.55 ±0.10 0.55 ±0.10

l10.20±0.10 0.30 ±0.20 0.40 ±0.20 0.45 ±0.20 0.45 ±0.20 0.60 ±0.20 0.60 ±0.20

l20.25±0.10 0.35 ±0.10 0.35 ±0.20 0.40 ±0.20 0.40 ±0.20 0.60 ±0.20 0.60 ±0.20

RC 2012 F 100 CS

●

2●

3●

4●

●

CODE DESIGNATION

DIMENSION

[Unit:㎜]

Chip Resistor - Precision

- 5 -

The Resistance Tolerance is expressed as 1 digit alphabet by EIAJ standard. <Table 2>

The Nominal Resistance Value is expressed as 3 or 4 digits by EIAJ standard. <Table 3>

Item 3DigitsMark 4DigitsMark

Resistance

Tolerance FF

Only number Left 2 digits : Resistance value

Right 1 digit : Exponential number of 10.

Left 3 digits : Resistance value

Right 1 digit : Exponential number of 10.

Number &

alphabet "R" Read alphabet "R" as decimal point. Read alphabet "R" as decimal point.

Example 1) 101 : 10 ×101=10×10 = 100Ω

2)7R5:7.5=7.5

Ω

1) 1001 : 100 ×101= 100 ×10 = 1 ㏀

2) 9R09 : 9.09 = 9.09Ω

If resistance value in E-96 is same resistance value in E-24, we mark 3 or 4 digits on the

resistor.

In case of JUMPER(0 ohm), '000' is marked on that resistor.

Item F

Tolerance (%) ±1

Producing Series E-24, E-96

RESISTANCE TOLERANCE

●

4NOMINAL RESISTANCE VALUE

Chip Resistor - Precision

- 6 -

The Packaging Code is expressed as 2 digits alphabet. <Table 4>

Packaging

Code Description Dimension Packaging Q'ty

CS 7" REEL PACKAGING

1005 10,000 PCS

1608, 2012, 3216, 3225 5,000 PCS

5025, 6432 4,000 PCS

ES 10" REEL PACKAGING 1608, 2012, 3216 10,000 PCS

AS 13" REEL PACKAGING

1005 40,000 PCS

1608, 2012, 3216, 3225 20,000 PCS

5025, 6432 15,000 PCS

GS BULK CASE PACKAGING

1608 25,000 PCS

2012 10,000 PCS

3216 5,000 PCS

PACKAGING CODE

●

Chip Resistor - Precision

- 7 -

■PACKAGING

Packaging protects the resistor from damage during the shipping or storage.

There are two types of packaging method ; one is "Reel" type, and the other is "Bulk" type.

The packaging specification is based on the EIAJ RC-1009.

<Fig 2> is tape dimension For 1005 type. <Table 5> is for pocket sizes, A and B.

<Fig 2>

0.5 Max

1.0

2.0±0.05

4.0±0.1

1.5±

0.1

01.75±0.1

3.5±0.05

8.0±0.1

0.5 Max

Chip Resistor

Top Tape

Carrier Tape

●PACKAGING METHOD

●REEL TYPE PACKAGING SPECIFICATION

Chip Resistor - Precision

- 8 -

<Fig 3> is tape dimension For 1608, 2012, 3216, 3225 type. <Table 5> is for pocket sizes,

AandB.

<Fig 4> is tape dimension For 5025, 6432 type. <Table 5> is for pocket sizes, A and B.

1.0 Max

1.0

2.0±0.05

4.0±0.1

4.0±0.1 A

1.5±

0.1

01.75±0.1

3.5±0.05

8.0±0.1

1.0 Max

Chip Resistor

Bottom Tape

Top Tape

Carrier Tape

<Fig 3>

<Fig 4>

tMAX=1.1

Dimension

Symbol

1005 1608 2012 3216 3225 5025 6432

(0402) (0603) (0805) (1206) (1210) (2010) (2512)

A0.70 ±0.10 1.10 ±0.20 1.65 ±0.20 2.00 ±0.20 2.90 ±0.20 2.80 ±0.10 3.50 ±0.10

B1.20 ±0.10 1.90 ±0.20 2.40 ±0.20 3.60 ±0.20 3.60 ±0.20 5.30 ±0.20 6.75 ±0.10

Chip Resistor - Precision

- 9 -

There are empty holes at both start part and end part of carrier tape. <Fig 5>

Note

①The resistor should move in the pocket freely.

②The resistor should not adhere to the top or bottom tape.

③There should be no vacant pocket.

④Peeling strength of the top tape should be within 5g and 80g. <Fig 6>

<Fig 5>

10°

Top Tape

Chip Resistor

Carrier Tape

Bottom Tape

Peeling

<Fig 6>

Reel Packed Part Empty Part Lead Part

Adhesion Tape

*********

Start

Empty Portion Chips Empty Portion Lead Part

10 Pitches

or more

End

5,000 Pitches

20,000 Pitches

10 Pitches

or more 200~250 mm

●TAPING METHOD

Chip Resistor - Precision

- 10 -

The Reel dimension is classified by the diameter of Reel. <Fig 7> <Table 6>

Bulk cassette specification is based on the EIAJ ET-7201. <Fig 8>

The standard packaging quantity depends on the dimension. <Table 7>

Packaging Code Diameter A B C D

CS 7" 178 Φ70 9.5(13.0) ±0.1 1.2 ±0.1

ES 10" 258 Φ80 9.5 ±0.1 2.0 ±0.1

FS,AS 13" 330 Φ80 9.5 ±0.1 2.0 ±0.1

[Unit:mm]

110

<Fig 8> 6.0 ±0.05

4.4 ±0.05

3.4 ±0.05

Dimension Inch Standard packaging quantity Weight (g, avg.)

1608 0603 25,000 PCS 71

2012 0805 10,000 PCS 65

3216 1206 5,000 PCS 67

●REEL DIMENSION

●BULK TYPE PACKAGING

<Fig 7>

Chip Resistor - Precision

- 11 -

RC3216F100GS

RMBA71025 ,5000pcs 10 ohm

SAMSUNG ELECTRO-MECHANICS CO.,LTD.

RC3216F100GS

10 ohm

V-2

▶Reel type Label

The reel type label includes following contents as <Fig 9>.

- Following -

①Resistance Value

②Tolerance, Marking

③Part Number

④Quantity

⑤LOT Number

⑥Bar-Code

⑦Serial Number

▶Bulk type Label

The bulk type label includes following contents as <Fig 10>.

- Following -

①Part Number

②Resistance Value

③LOT Number

④Quantity

⑤Bar-Code

⑥Serial Number

①The bulk or reel type packaging is packaged twice by paper box, inner box and outer box.

②The packaging should protect the resistor from damaging during shipping by vehicle, ship,

airplane and etc.

③The information of contents is marked on both inner and outer box.

※For other packaging methods, please contact us.

<Fig 9>

100 F101

Ohm

P/N : RC1608F101CS

QTY : 5000PCS

L/N : RMBA20630

007

SAMSUNG ELECTRO-MECHANICS CO.,LTD.

V-2

④

③

②

⑤

①

⑥

⑦

①

②

③

④

⑤

⑥

●LABELING

●BOX PACKAGING METHOD

Chip Resistor - Precision

- 12 -

①Max 25,000 pcs ( 5 EA ×7" ) ②Max 100,000 pcs ( 20 EA ×7" )

(Unit:mm) (Unit:mm)

③Max 300,000 pcs ( 60 EA ×7" ) ④Max 400,000 pcs ( 20 EA ×13" )

(Unit:mm) (Unit:mm)

①Inner box ( Cassette ×5EA) ②Outer box ( Inner box ×20 EA )

116

(Unit:mm) 242

135

215

(Unit:mm)

30±1.0

185±1.0

66±1.0

195±5.0

285±5.0

187±5.0

215±5.0

410±5.0

370±5.0

348±5.0

339±5.0

336±5.0

●BOX DIMENSION FOR BULK TYPE

●BOX DIMENSION FOR REEL TYPE

Chip Resistor - Precision

- 13 -

■RELIABILITY TEST DATA

The electrical characteristic test should satisfy the test method, procedure, and standard.

If there is no special comment, Each test performs in standard state.

(temperature 20℃, humidity 65%RH, pressure 1023mbar)

item

Permissible deviation

Test method

Resistor

DC resistance

DC resistance value

should be within the

specified resistance

tolerance.

묤Standard : JIS C 5202 (5.1)

묤Test voltage : <Table 8>

묤Applying time : within 5 seconds.

묤Test board : <Fig 11>

Temperature

Coefficient

Resistance

1. Tolerance F

±100ppm/℃

2. Tolerance G

묤Standard : JIS C 5202 (5.2)

묤Temp. : 20℃→-55℃→20℃→125℃→

20℃

묤Test board : <Fig 11>

묤Calculation :

TCR(ppm/℃)=

T0:20±2℃

R0:ResistanceatT

0(Ω)

T : Test temperature ( -55, 125℃)

R : Resistance at T (Ω)

Short time

overload

(STOL)

1. No mechanical

damage

R should be

within ±(1%+0.1Ω)

묤Standard : JIS C 5202. (5.5)

묤Test voltage : 2.5 times of rated voltage Max.

surge current at the Jumper.

묤Applying time : 5 seconds

묤Test board : <Fig 11>

Intermittent

overload

(IOL)

1. No mechanical

damage

R should be

within ±(3%+0.1Ω)

묤Standard : JIS C 5202. (5.8)

묤Test voltage : 2.5 times of rated voltage Max.

surge current at the Jumper.

묤Test method : 1 sec ON, 25 sec OFF

10,000+400cycles

묤Test board : <Fig 11>

Range (Ω) Voltage (V)

R<10 0.1

10 ≤ R < 100 0.3

100 ≤ R < 1K 1.0

1K ≤ R < 10K 3.0

10K ≤ R < 100K 10

100K ≤ R < 1M 25

1M ≤ R 50

Range(Ω) ppm/℃

1≤R<10 +300

-200

10 ≤R<1M ±200

1M ≤R < 10M ±300

RTT

−

●ELECTRICAL CHARACTERISTIC

Chip Resistor - Precision

- 14 -

The mechanical characteristic test should satisfy the test method, procedure, and standard.

If there is no special comment, Each test performs in standard state.

(temperature 20℃, humidity 65%RH, pressure 1023mbar)

item

Permissible deviation

Test method

Resistor

Withstanding

voltage

묤No mechanical

damage, short circuit, or

disconnection.

묤Standard : JIS C 5202. (5.7)

묤Test voltage : 1005 1608 AC 100V,

others AC 500V

묤Applying time : 60 +10/-0 seconds

묤Test board : <Fig 13>

Insulation

resistance

묤Shouldhavemore

than 1,000MΩ

묤Standard : JIS C 5202. (5.6)

묤Test voltage : 1005 1608 DC 100V,

others DC 500V

묤Applying time : 60 seconds

묤Test pressure : 1.0±0.2 N

묤Test board : <Fig 13>

Noise

묤Noise standard

묤Standard : JIS C 5202. (5.9)

JIS appendix1 "Noise measure in

resistor"

묤Measure equipment : QUAN-TECH NOISE

METER

(MODEL 315C)

Range (Ω)dBMax.

1≤R < 100 -10

100 ≤R<1K 0

1K ≤R < 100K 15

100K ≤R<1M 20

1M ≤R < 10M 30

item

Permissible deviation

Test method

Resistor

Solderability

묤New solder

coated more than

95% of termination

묤Standard : JIS C 5202. (6.5)

묤Test temperature : 235 ±5℃

묤Test time : 2 ±0.5 sec (dipping both side)

Bending

strength

1. No mechanical

damage

R should be

within ±(0.5%+0.05Ω)

묤Standard : JIS C 5202. (6.1)

묤Test board : <Fig 12>

묤Test speed : 100mm/min

묤Test procedure : press until 3mm,

then keep 5 seconds <Fig 14>

R205

●MECHANICAL CHARACTERISTIC

Chip Resistor - Precision

- 15 -

The Environmental characteristic test should satisfy the test method, procedure, and standard.

If there is no special comment, Each test performs in standard state.

(temperature 20℃, humidity 65%RH, pressure 1023mbar)

item

Permissible deviation

Test method

Resistor

Termination

strength

묤No mechanical

damage, or sign of

disconnection

묤Standard : JIS C 5202 (6.1)

묤Test time : applying pressure for 10 seconds

묤Test tension : 5 N (500g묤f)

1005, 1608 - 3 N (300g묤f)

Withstanding

soldering heat

1. No mechanical

damage

R should be

within ±(1%+0.05Ω)

묤Standard : JIS C 5202 (6.4)

묤Temperature : 260 ±5℃

묤Test time : 10 ±1second (both side dipping)

묤Test procedure : measures after 24 hours

Vibration

1. No mechanical

damage

R should be

within ±(1%+0.05Ω)

묤Standard : JIS C 5202 (6.3)

묤Test amplitude : 1.5mm

묤Test procedure : frequency 10Hz - 55Hz -

10Hz each 2 hours in x, y, z direction.

item

Permissible deviation

Test method

Resistor

Temperature

cycle

1. No mechanical

damage

R should be

within ±(1%+0.1Ω)

묤Standard : JIS C 5202 (7.4)

묤Test procedure : <Table 11>

묤Measure : after 5 cycles of procedure

묤Test board : <Fig 11>

Moisture

resistance life

1. No mechanical

damage

R should be

within <Table 12>

묤Standard : JIS C 5202 (7.9)

묤Test condition : temp 40 ±3℃, humid 90 ~

95%RH

묤Test voltage : rated voltage

묤Test time : repeat 90min ON, 30min OFF

during 1000+48 hours

묤Test board : <Fig 11>

item 1 2 3 4

temp(℃)-55±25~35 125±25~35

time(min) 30 15 30 15

Range(Ω)

RMAX

1≤R<10 ±5%

10 ≤ R < 1M ±(3%+0.1Ω)

1M ≤ R < 10M ±5%

●ENVIRONMENTAL CHARACTERISTIC

Chip Resistor - Precision

- 16 -

▶Soldering

▷The resistor should be fixed on PCB(printed circuit board) for testing.

- Soldering specification : JIS C 5202 (6.2)

* Soldering method : Flow type(Dipping type), Reflow type

* Solder : H63A (JIS Z 3282)

* FLUX : ROSIN 25WT% (JIS K 5902), IPA 75WT% (JIS K 5901)

- Flow soldering condition

* FLUX dipping time : 5∼10 sec

* Pre-treatment : None

* Soldering temp. : 235℃±5℃

* Soldering time : 5±0.5 sec

* Temp. profile : <Fig 15>

- Reflow soldering condition

* Peak temp. : 230℃±5℃

* Duration over 220℃:15

±5sec

* Solder Cream : Sn-Pb (63-37)

* Temp. Profile : <Fig 16>

item

Permissible deviation

Test method

Resistor

Low

temperature

exposure

1. No mechanical

damage

R should be

within ±(3%+0.1Ω)

묤Standard : JIS C 5202 (7.1)

묤Test temperature : -55 ±2℃

묤Test time : 1000+48 hours (without load)

묤Measure : after 1 hour

묤Test board : <Fig 11>

High

temperatur

exposure

1. No mechanical

damage

R should be

within ±(3%+0.1Ω)

묤Standard : JIS C 5202 (7.2)

묤Test temperature : 1608,2012,3216 : 155 ±

2℃, others : 125 ±2℃

묤Test time : 1000+48 hours (without load)

묤Measure : after 1 hour

묤Test board : <Fig 11>

Load life

1. No mechanical

damage

R should be

within <Table 13>

묤Standard : JIS C 5202 (7.10)

묤Test temperature : 70 ±2℃

묤Test voltage : rated voltage

묤Test time : repeat 90min ON, 30min OFF

during 1000+48 hours

묤Test board : <Fig 11>.

Range(Ω)

RMAX

1≤R<10 ±5%

10 ≤R<1M ±(3%+0.1Ω)

1M ≤R < 10M ±5%

●TEST BOARD AND SPECIFICATION

Chip Resistor - Precision

- 17 -

▶Test board

▷Test board

<Table 14>, <Fig 11> are dimensions of test board.

* Board material : epoxy JIS C 6484

* pattern material : pure copper 99.5% or above JIS C 6484

▷Bending Test Board

<Table 15>, <Fig 12> are dimensions of bending test board.

* Board material : epoxy JIS C 6484

* pattern material : pure copper 99.5% or above JIS C 6484

▶Sketch of Withstanding voltage and Insulation resistance

af d=4.

100

P1P1

Substrate

58.5

Connector

35.08

c10 - φ1.0

7.5

5.5

3.5

item Dimension (mm)

Dimension Power a b c f

1005 1/16W 0.6 1.9 0.7 4.9

1608 1/10W 1.0 3.0 1.2 4.5

2012 1/8W 1.2 4.0 1.65 4.3

3216 1/4W 2.2 5.0 2.0 3.3

3225 1/4W 2.2 5.0 2.9 3.3

5025 1/2W 3.6 7.0 3.0 3.0

6432 1W 5.2 8.0 3.5 2.5

item Dimension (mm)

Dimension Power a b c f

1005 1/16W 0.6 1.9 0.7 4.9

1608 1/10W 1.0 3.0 1.2 4.5

2012 1/8W 1.2 4.0 1.65 4.3

3216 1/4W 2.2 5.0 2.0 3.3

3225 1/4W 2.2 5.0 2.9 3.3

5025 1/2W 3.6 7.0 3.0 3.0

6432 1W 5.2 8.0 3.5 2.5 : COPPER PATTERN

: SOLDER - RESISTOR

: COPPER PATTERN

:SOLDER-RESISTOR

Chip Resistor - Precision

- 18 -

■CHARACTERISTIC GRAPH

The Resistance Range that we produce depends on the Dimension and the Resistance

Tolerance of the resistor. <Table 16>

The Rated Power is classified by the dimension of the resistor. <Table 17>

※The rated power is specified as continuous full loading power at the ambient temperature of 70

±2℃.Incaseofthetemperatureexceeding70

±2℃, the power should be derated in

accordance to <Fig 17>.

-55

℃∼+125℃: 1005, 3225, 5025, 6432

-55

℃∼+155℃: 1608, 2012, 3216

Ambient temperature (℃)

100

-55

0306090 150

120

155

-30

100

-55

04080120

125

Ambient temperature (℃)

-40

Ratedloadpercent(%) Ratedloadpercent(%)

[1608, 2012, 3216]

[1005, 3225, 5025, 6432]

●RESISTANCE RANGE

Dimension

Tolerance

1005 1608 2012 3216 3225 5025 6432

(0402) (0603) (0805) (1206) (1210) (2010) (2512)

F, G 10Ω∼1MΩ10Ω∼1MΩ10Ω∼1MΩ10Ω∼1MΩ10Ω∼1MΩ10Ω∼1MΩ10Ω∼1MΩ

●RATED POWER

Dimension

item

1005 1608 2012 3216 3225 5025 6432

(0402) (0603) (0805) (1206) (1210) (2010) (2512)

Rated Power 1/16 W

(0.063 W)

1/10 W

(0.100 W)

1/8 W

(0.125 W)

1/4 W

(0.25 W)

1/4 W

(0.25 W)

1/2 W

(0.5W) 1.0 W

Working Volt.(Max.) 50 V 50 V 150 V 200 V 200 V 200 V 200 V

STOL, IOL Volt.(Max.) 1 0 0 V 100 V 300 V 400 V 400 V 400 V 400 V

▶Working Temperature

Chip Resistor - Precision

- 19 -

■APPLICATION MANUAL

●Applications

Chip resistors are designed for general electronic devices such as home appliances, computer,

mobile communications, digital circuit, etc.

If you require our products with high reliability-performing at more than 125C or below -55C- for

medical equipments, aircraft, high speed machines, military usage, and items that can affect

human life or if you need to use in specific conditions (corrosive gas atmosphere), please contact

us beforehand.

▶Normal Operation temperature ranges(℃)asfollows.

- 1608, 2012, 3216(general, precision) : -55℃~+155℃

- Others (rectangular, array, trimmable) : -55℃~+125℃

▶Although resistor body is coated, sharp excessive impact should be avoided to prevent

damages and adverse effects on characteristics(resistor value, open circuited, T.C.R.).

●Storage

To maintain proper quality of chip components, the following precautions are required for storage

environment, method and period.

▶Storage Environment

- Chip components may be deformed, if the temperature of packaged components exceeds

40C.

- Do not store where the soldering properties can be deteriorated by harmful gas such as

sulphurous gas, chlorine gas, etc.

- Bulk packed chip components should be used as soon as the seal is opened, thus

preventing the solderability from deteriorating.

- The remaining unused chips should be put in the original bag and sealed again or store in

a desiccator containing a desiccating agent.

▶Storage Time Period

- Stored chip components should be used within 12 months after receiving the components.

If 12 months or more have elapsed, please check the solderability before actually using.

●Mounting

Please give more attention not to press the chip owing to the nozzle's improper height when it

is mounted on PCB.

(Excessive pressure may cause exterior damage, change in resistance, circuit open, etc.)

Chip Resistor - Precision

- 20 -

●Soldering

Our products have Ag electrodes protected by double layer.

▶1st Ni Coating

- This prevents Ag electrode from leaching and enhance the bonding with Sn-Pb.

▶2nd Sn-Pb Coating

- This is made of Sn 90% and Pb 10% with melting point 213℃to prevent it from melting

when solder cream melts, and to enhance the bonding.

- Commercial solder creams are made of Sn 63% and Pb 37% with melting point 183℃.

●Cleaning

After Soldering Cleaning, soldering flux & Ionic cleaning liquid should be avoided on product.

If any possibility on product, please take a test before usage.

●Caution for chip resistor separation from PCB

Chip resistor installation on PCB is similar phenomenon on chocolate chip on top of cake.

PCB has enough flexibility on outer force but Chip resistor can be defected without any bending.

(By chip resistor use of Ceramic, solder, metal)

Therefore, when separate from Chip resistor on PCB, be ware of any crack of chip

●Others

▶Manual work

- Whenever separate chip resistor from PCB, do not re-use the chip resistor for circuit safety.

Chip resistor can be electrical specification change by soldering Iron after separation.

Re-use of separated chip resistor should be prohibited.

▶Do not use more than rated voltage.(check the contents on the file)

Chip Resistor - Precision

- 21 -

■NOTICE

●Usage of the resistor

▶Flow Soldering

After sticking the resistor to PCB with paste, dip the PCB into solder bath. <Fig 15>

▶Reflow Soldering

After printing solder creams on PCB, place the resistor on the solder cream.

Then heat the PCB. <Fig 16>

●Caution

▶Storage condition

Please make sure that keep the storage conditions.

* Temperature : 5℃∼35℃,*Humidity:45%RH∼85%RH

▶Damage control

Please handle with care, to prevent damaging the resistor.

Specially, the excessive nozzles' height of SMD or the extreme touch with tweezers.

▶Leaching prevention

It is important to keep the soldering conditions for prevent Ag leaching in Flow soldering.

<Fig 15> Temp.

Soldering Cooling

235±5℃

within 5 sec

<Fig 16> Temp.

Pre-heating Soldering Cooling

within 120 sec

230±5℃

160℃

within 20 sec

200℃

130℃

Pre-heating

T≤150℃

Peak temp.

within 10 sec

Time