Features
■ Select models are compliant with
AEC-Q200 Rev-C Stress Test Qualifi cation
for Passive Components in Automotive
Applications (see chart below)
■ RoHS compliant*
■ ESD protection >25 kV
■ Low capacitance <0.5 pF
■ Low leakage current <50 nA
Applications
■ HDMI 1.4
■ Digital Visual Interface (DVI)
■ USB 3.0 / USB OTG
■ Memory protection
■ SIM card ports
■ Automotive
ChipGuard® MLC Series - ESD Protectors
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
General Information
Electrical Characteristics @ 25 °C (unless otherwise noted)
Parameter Symbol CG0402MLC- Unit
3.3LG 05LG 12LG 24LG 3.3LGA 05LGA 12LGA 24LGA
Typical Continuous Operating Voltage VDC 3.3 5 12 24 3.3 5 12 24 V
Typical Clamping Voltage (Note 1) VC25 V
Maximum Capacitance @ 1 VRMS 1 MHz CO 0.5 pF
Maximum Leakage Current @ Max. VDC IL5nA
Typical Trigger Voltage (Note 2) VT250 V
Maximum Response Time RT1ns
ESD Protection:
Per IEC 61000-4-2 Level 4
Min. Contact Discharge
Min. Air Discharge
Min. Air Discharge
±8
±15 (Note 3)
±25
kV
kV
kV
Operating Temperature TOPR -40 to +85 -40 to +125 ˚C
Storage Temperature TSTG -55 to +150 ˚C
The ChipGuard® MLC Series has been specifi cally designed to protect sensitive electronic
components from electrostatic discharge damage. The MLC family has been designed to
protect equipment to IEC61000-4-2, Level 4 (±8 kV Contact / ±15 kV Air Discharge) ESD
specifi cations targeted for high speed USB 3.0/USB OTG, HDMI 1.4, DVI or IEEE1394
applications.
The ChipGuard® MLC Series has been
manufactured to provide low 0.5 pF
capacitance and leakage currents less than
50 nA with excellent clamp qualities, making
the family almost transparent under normal
working conditions.
Device Symbol
V
Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse.
2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage.
3. IEC 61000-4-2 ESD Performance for CG0603MLC-05E and CG0603MLC-12E devices will meet minimum 100 reps.
Some shifting in characteristics may occur when tested over several hundred ESD pulses. All other part numbers listed will meet
IEC 61000-4-2 ESD Performance with minimum 1000 reps without degradation in performance.
Parameter Symbol CG0603MLC- Unit
3.3LE 05E 05LE 12E 12LE 24LE 3.3LEA 05LEA 12LEA 24LEA
Typical Continuous Operating Voltage VDC 3.3 5 5 12 12 24 3.3 5 12 24 V
Typical Clamping Voltage (Note 1) VC25 20 25 30 25 V
Maximum Capacitance @ 1 VRMS 1 MHz CO 0.5 pF
Maximum Leakage Current @ Max. VDC IL5 50 5 50 5 nA
Typical Trigger Voltage (Note 2) VT250 150 250 150 250 V
Maximum Response Time RT1ns
ESD Protection:
Per IEC 61000-4-2 Level 4
Min. Contact Discharge
Min. Air Discharge
Min. Air Discharge
±8
±15 (Note 3)
±25
kV
kV
kV
Operating Temperature TOPR -40 to +85 -40 to +125 ˚C
Storage Temperature TSTG -55 to +150 ˚C
*RoHS COMPLIANT
AEC APPROVED (Select Models)
AEC Approved Models
Model AEC-Q200
CG0603MLC-05E ✓ Yes
CG0603MLC-05LE ✓ Yes
CG0603MLC-05LEA ✓ Yes
CG0603MLC-12E ✓ Yes
CG0603MLC12LE ✓ Yes
CG0603MLC-12LEA ✓ Yes
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
ChipGuard® MLC Series - ESD Protectors
Product Dimensions
CG0402 CG0603
Dimension Series Series
L 1.00 ± 0.15 1.60 ± 0.20
(0.04 ± 0.006) (0.064 ± 0.008)
W 0.50 ± 0.10 0.80 ± 0.20
(0.02 ± 0.004) (0.032 ± 0.008)
A 0.36 ± 0.05 0.45 ± 0.10
(0.014 ± 0.002) (0.018 ± 0.004)
B 0.25 ± 0.15 0.30 ± 0.20
(0.10 ± 0.006) (0.012 ± 0.008)
DIMENSIONS: MM
(INCHES)
Recommended Pad Layout
Solder Refl ow Recommendations
110 sec. (min.)
300
250
200
150
100
50
0
30-70
sec.
Temperature (°C)
120 sec. (min.)
Preheat Stages 1-3 Soldering Cooling
Time (seconds)
• This product can be damaged by rapid heating, cooling or localized heating.
• Heat shocks should be avoided. Preheating and gradual cooling recommended.
• Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
• Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
A Stage 1 Preheat Ambient to Preheating 30 s to 60 s
Temperature
B Stage 2 Preheat 140 °C to 160 °C 60 s to 120 s
C Stage 3 Preheat Preheat to 200 °C 20 s to 40 s
D Main Heating 200 °C 60 s to 70 s
210 °C 55 s to 65 s
220 °C 50 s to 60 s
230 °C 40 s to 50 s
240 °C 30 s to 40 s
250 °C to 255 °C 5 s
E Cooling 200 °C to 100 °C 1 °C/s to 4 °C/s
CG0402 CG0603
Dim. Series Series
A 0.51 0.76
(0.020) (0.030)
B 0.61 1.02
(0.024) (0.040)
C 0.51 0.50
(0.020) (0.020)
D 1.70 2.54
(0.067) (0.100)
L
W
B
AA
CB
D
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
ChipGuard® MLC Series - ESD Protectors
Packaging Dimensions
TOP
TAPE
NOTES: TAPE MATERIAL IS PAPER.
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
TAPE THICKNESS IS
4.00 ± 0.10
(0.16 ± 0.004)
DG
8.00 ± 0.30
(0.32 ± 0.012)
0.48 ± 0.03
(0.019 ± 0.0012)
3.50 ± 0.05
(0.14 ± 0.002)
C
L
W
1.50 ± 0.10
(0.06 ± 0.004) 2.0 ± 0.50
(0.08 ± 0.02)
180.8 ± 2.0
(7.12 ± 0.08)
9.0 ± 0.50
(0.36 ± 0.02)
13.0 ± 1.0
(0.52 ± 0.04)
13.0 ± 0.50
(0.52 ± 0.02)
62.0 ± 1.50
(2.48 ± 0.06)
21.0 ± 0.80
(0.84 ± 0.032)
DIMENSIONS: MM
(INCHES)
How to Order
CG 0402 MLC - 12 L G A
ChipGuard®
Product Designator
Package Option
0402 = 0402 Package
0603 = 0603 Package
Multilayer Series Designator
Operating Voltage
3.3 = 3.3 V
05 = 5 V
12 = 12 V
24 = 24 V
Low Leakage Current Option
L = Low Leakage Current
Blank = Standard Product
Tape & Reel Packaging
E = 5,000 pcs. per reel (0603 Package)
G = 10,000 pcs. per reel (0402 Package)
Operating Temperature Option
A = Higher +125 °C Operating Temperature
Blank = Standard Product
REV. Q 02/27/12
CG0402 CG0603
Dimension Series Series
C 1.75 ± 0.05 1.75 ± 0.10
(0.04 ± 0.002) (0.04 ± 0.004)
D 2.00 ± 0.02 2.00 ± 0.05
(0.08 ± 0.0008) (0.08 ± 0.002)
L 1.12 ± 0.03 1.80 ± 0.20
(0.045 ± 0.0012) (0.072 ± 0.008)
W 0.62 ± 0.03 0.90 ± 0.20
(0.025 ± 0.0012) (0.036 ± 0.008)
G 2.0 ± 0.05 4.0 ± 0.05
(0.08 ± 0.002) (0.16 ± 0.002)
Asia-Pacifi c: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
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