HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504
2.5 mm x 7.6 mm Rectangular LED Lamps
Data Sheet
Description
The HLMP-R100, -0301, -0401, -0504 are solid state
lamps encapsulated in a radial lead rectangular epoxy
package. They utilize a tinted, diused epoxy to
provide high on-o contrast and a at high intensity
emitting surface. Borderless package design allows
creation of uninterrupted light emitting areas.
The HLMP-R100 uses a double heterojunction (DH)
absorbing substrate (AS) aluminum gallium arsenide
(AlGaAs) red LED chip in a light red epoxy package. This
combination produces outstanding light output over a
wide range of drive currents.
The HLMP-0301 has a high eciency red GaAsP on
GaP LED chip in a light red epoxy package.
The HLMP-0401 provides a yellow GaAsP on GaP LED chip
in a yellow epoxy package.
The HLMP-0504 provides a green GaP LED chip in a green
epoxy package.
Package Dimensions
Features
• Rectangular light emitting surface
• Flat high sterance emitting surface
• Stackable on 2.54 mm (0.100 inch) centers
• Ideal as ush mounted panel indicators
• Ideal for backlighting legends
• Long life: solid state reliability
• Choice of 4 bright colors
– DH AS AlGaAs Red
– High Eciency Red
– Yellow
– High Performance Green
• IC compatible/low current requirements
2.54 (0.100)
2.29 (0.090)
2.54 (0.100)
2.16 (0.085)
8.00 (0.315)
7.37 (0.290)
29.21 (1.15) MIN.
CATHODE LEAD
BOTTOM VIEW
SIDE VIEW
1.27 (0.50)
NOMINAL
NOTES:
1. ALL DIMENSIONS ARE IN
MILLIMETERS (INCHES).
2. AN EPOXY MENISCUS MAY EXTEND
ABOUT 1 mm (0.040") DOWN THE LEADS.
3. THERE IS A MXIMUM 1° TAPER FROM
BASE TO THE TOP OF LAMP.
2.54 (0.100)
NOMINAL
0.46 (0.018)
SQ. NOMINAL
7.62 (0.300)
7.11 (0.280)
7.62 (0.300)
6.99 (0.275)
2
Selection Guide
Color Part Number
Luminous Intensity
Iv (mcd) at 20 mA
Min. Typ.
DH AlGaAs Red HLMP-R100 2.1 –
HLMP-R100-FG0xx 5.4 17.2
Red HLMP-0301 2.1 –
HLMP-0301-C00xx 1.3 –
HLMP-0301-DECxx 2.1 6.8
HLMP-0301-CD0xx 1.3 4.2
Yellow HLMP-0401 3.6 –
HLMP-0401-B00xx 1.4 –
HLMP-0401-D00xx 3.6 –
HLMP-0401-CD0xx 2.2 7.2
HLMP-0401-DEBxx 3.6 11.4
Green HLMP-0504 2.6 –
HLMP-0504-B00xx 1.6 –
HLMP-0504-DECxx 4.2 13.4
HLMP-0504-CD0xx 2.6 8.4
HLMP-0504-C00xx 2.6 –
Mechanical Options
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
DD: Ammo Pack, Straight Leads
Color Bin Options
0: Full Color Bin Distribution
B: Color Bins 2 & 3 only
C: Color Bins 3 & 4 only
Maximum Iv Bin Options
0: Open (No Maximum Limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Color Options
1. As AlGaAs Red
3. High Eciency Red
4. Yellow
5. Green
Package Options
R,0: Rectangular 2.5 mm x 7.6 mm
Part Numbering System
HLMP - x x xx - x x x xx
3
Absolute Maximum Ratings at TA = 25°C
Parameter HLMP-R100 HLMP-0301 HLMP-0401 HLMP-0504 Units
Peak Forward Current 300 90 60 90 mA
Average Forward Current[1] 20 25 20 25 mA
DC Current[2] 30 30 20 30 mA
Power Dissipation 87 135 85 135 mW
Reverse Voltage (IR = 100 μA) 5 5 5 5 V
Transient Forward Current[3] (10 μs Pulse) 500 500 500 500 mA
Operating Temperature Range -20 to +100 -40 to +100 -40 to +100 -20 to +100 °C
Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 -40 to +100
Notes:
1. See Figure 5 to establish pulsed operating conditions.
2. For AlGaAs Red, Red, and Green Series derate linearly from 50°C at 0.5 mA/°C. For Yellow Series derate linearly from 50°C at 0.2 mA/°C.
3. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that the device be operated at peak current beyond the peak forward current listed in the Absolute Maximum
Ratings.
4
Figure 1. Relative intensity vs. wavelength.
Electrical/Optical Characteristics at TA = 25°C
Sym.
Description
HLMP-R100 HLMP-0301 HLMP-0401 HLMP-0504
Units
Test
ConditionsMin. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
2q1/2 Included Angle
Between Half
Luminous
Intensity Points
100 100 100 100 Deg. Note 1.
Fig. 6
lP Peak Wavelength 645 635 583 565 nm Measure-
ment at
Peak
ld Dominant
Wavelength
637 626 585 569 nm Note 2.
Dl1/2 Spectral Line
Halfwidth
20 40 36 28 nm
ts Speed of Response 30 90 90 500 ns
C Capacitance 30 16 18 18 pF VF = 0;
f = 1 MHz
RqJ-PIN Thermal Resistance 260 260 260 260 °C/W Junction
to Cathode
Lead
VF Forward Voltage 1.8 2.2 1.9 2.6 2.1 2.6 2.2 3.0 V IF = 20 mA
Figure 2.
VR Reverse Breakdown
Voltage
5.0 5.0 5.0 5.0 V IR = 100 μA
hv Luminous Ecacy 80 145 500 595 lm/W Note 3.
Notes:
1. q1/2 is the o-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which denes the color of the
device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the
luminous ecacy in lumens/watt.
HIGH EFFICIENCY RED
WAVELENGTH – nm
RELATIVE INTENSITY
1.0
0.5
0
500 550 600 650 700 750
YELLOW
GREEN
TA = 25° C
AlGaAs RED
5
Figure 6. Relative luminous intensity vs. angular displacement.
Figure 2. Forward current vs. forward voltage.
VF (300 mA) for AlGaAs Red = 2.6 volts typical.
Figure 3. Relative luminous intensity vs. forward
current.
Figure 4. Relative eciency (luminous intensity
per unit current) vs. peak current. hv (300 mA) for
AlGaAs Red = 0.7.
Figure 5. Maximum tolerable peak current vs. peak duration (IPEAK MAX determined from temperature derated IDC MAX).
IF – FORWARD CURRENT – mA
1.0
VF – FORWARD VOLTAGE – V
0
20
40
60
2.0 3.0
90
70
GREEN
YELLOW
HER
AlGaAs
RED
10
30
50
80
4.0 5.0
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
IDC – DC CURRENT PER LED – mA
0305 15
2.5
2.0
AlGaAs RED
0.5
1.0
1.5
10 20 25
HER, YELLOW, GREEN
ηPEAK – RELATIVE EFFICIENCY
0
IPEAK – PEAK CURRENT PER LED – mA
0.4
0.6
0.8
1.0
9020 705040
1.3
1.1
YELLOW
GREEN
AlGaAs RED
0.5
0.7
0.9
1.2
30 60 8010
HER
RATIO OF MAXIMUM TOLERABLE
PEAK CURRENT TO MAXIMUM
TOLERABLE DC CURRENT
1
tP – PULSE DURATION – µs
HER, ORANGE, YELLOW, and GREEN
1.0
2.0
3.0
10,0001000
4.0
1.5
10010
IPEAK MAX.
IDC MAX.
100 KHz
30 KHz
10 KHz
3 KHz
1 KHz
300 Hz
100 Hz
tp – PULSE DURATION – µs
AlGaAs RED
3
1
10
10 1000010001001
3 KHz
10 KHz
1 KHz
300 Hz
f – REFRESH RATE – 100 Hz
2
9
8
7
6
5
4
RATIO OF MAXIMUM PEAK CURRENT
TO TEMPERATURE DERATED
MAXIMUM DC CURRENT
IPEAK MAX.
IDC MAX.
10°100°40°70°20°60°80°30°50°90°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90°
1.0
0.6
0.8
0.2
0.4
6
Intensity Bin Limits
Color Bin
Intensity Range (mcd)
Min. Max.
Red C 0.5 2.4
D 2.4 3.8
E 3.8 6.1
F 6.1 9.7
G 9.7 15.5
H 15.5 24.8
I 24.8 39.6
J 39.6 63.4
K 63.4 101.5
L 101.5 162.4
M 162.4 234.6
N 234.6 340.0
O 340.0 540.0
P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
Maximum tolerance for each bin limit is ±18%.
Intensity Bin Limits, continued
Color Bin
Intensity Range (mcd)
Min. Max.
Yellow B 1.6 2.5
C 2.5 4.0
D 4.0 6.5
E 6.5 10.3
F 10.3 16.6
G 16.6 26.5
H 26.5 42.3
I 42.3 67.7
J 67.7 108.2
K 108.2 173.2
L 173.2 250.0
M 250.0 360.0
N 360.0 510.0
O 510.0 800.0
P 800.0 1250.0
Q 1250.0 1800.0
R 1800.0 2900.0
S 2900.0 4700.0
T 4700.0 7200.0
U 7200.0 11700.0
V 11700.0 18000.0
W 18000.0 27000.0
Green B 1.8 2.9
C 2.9 4.7
D 4.7 7.6
E 7.6 12.0
F 12.0 19.1
G 19.1 30.7
H 30.7 49.1
I 49.1 78.5
J 78.5 125.7
K 125.7 201.1
L 201.1 289.0
M 289.0 417.0
N 417.0 680.0
O 680.0 1100.0
P 1100.0 1800.0
Q 1800.0 2700.0
R 2700.0 4300.0
S 4300.0 6800.0
T 6800.0 10800.0
U 10800.0 16000.0
V 16000.0 25000.0
W 25000.0 40000.0
7
Mechanical Option Matrix
Mechanical Option Code Denition
00 Bulk Packaging, minimum increment 500 pcs/bag
01 Tape & Reel, crimped leads, minimum increment 1300 pcs/bag
02 Tape & Reel, straight leads, minimum increment 1300 pcs/bag
DD Ammo Pack, straight leads with minimum increment 2K/pack
Note:
All categories are established for classication of products. Products may not be available in all categories. Please contact your local Avago
representative for further clarication/information.
Color Categories
Color Category#
Lambda (nm)
Min. Max.
Green 6 561.5 564.5
5 564.5 567.5
4 567.5 570.5
3 570.5 573.5
2 573.5 576.5
Yellow 1 582.0 584.5
3 584.5 587.0
2 587.0 589.5
4 589.5 592.0
5 592.0 593.0
Tolerance for each bin limit is ±0.5 nm.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved.
AV02-1554EN - October 13, 2008
Figure 7. Recommended wave soldering prole.
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of LED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED chip
die attach and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without stando.
• Recommended soldering conditions:
Wave Soldering
Manual Solder
Dipping
Pre-heat Temperature 105°C Max. –
Pre-heat Time 30 sec Max. –
Peak Temperature 250°C Max. 260°C Max.
Dwell Time 3 sec Max. 5 sec Max.
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering prole to ensure
the soldering prole used is always conforming to
recommended soldering condition.
• If necessary, use xture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size Diagonal
Plated Through
Hole Diameter
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
0.718 mm
(0.028 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.