SN74F260
DUAL 5-INPUT POSITIVE-NOR GATE
SDFS012A – D3214, JANUARY 1989 – REVISED OCTOBER 1993
Copyright 1993, Texas Instruments Incorporated
2–1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
•Package Options Include Plastic
Small-Outline Packages and Standard
Plastic 300-mil DIPs
description
The SN74F260 contains two independent 5-input
positive-NOR gates. It performs the Boolean
functions Y = A + B + C + D + E in positive logic.
The SN74F260 is characterized for operation from
0°C to 70°C.
logic symbol†logic diagram, each gate (positive logic)
1
1A 2
1B
1Y
5
3
1C 12
1D
2Y
6
8
2B 9
2C
A
BY
≥ 1
C
D
E
10
2D 11
2E
13
1E 4
2A
†This symbol is in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –1.2 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input current range –30 mA to 5 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high state –0.5 V to VCC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current into any output in the low state 40 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range 0°C to 70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
‡Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed.
D OR N PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1B
1C
2A
1Y
2Y
GND
VCC
1E
1D
2E
2D
2C
2B
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN74F260
DUAL 5-INPUT POSITIVE-NOR GATE
SDFS012A – D3214, JANUARY 1989 – REVISED OCT OBER 1993
2–2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions
MIN NOM MAX UNIT
VCC Supply voltage 4.5 5 5.5 V
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
IIK Input clamp current –18 mA
IOH High-level output current –1 mA
IOL Low-level output current 20 mA
TAOperating free-air temperature 0 70 °C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VIK VCC = 4.5 V, II = –18 mA –1.2 V
VOH
VCC = 4.5 V, IOH = – 1 mA 2.5 3.4
V
V
OH VCC = 4.75 V, IOH = – 1 mA 2.7
V
VOL VCC = 4.5 V, IOL = 20 mA 0.3 0.5 V
IIVCC = 5.5 V, VI = 7 V 0.1 mA
IIH VCC = 5.5 V, VI = 2.7 V 20 µA
IIL VCC = 5.5 V, VI = 0.5 V – 0.6 mA
IOS‡VCC = 5.5 V, VO = 0 –60 –150 mA
ICCH VCC = 5.5 V, VI = 0 4.6 6.5 mA
ICCL VCC = 5.5 V, VI = 4.5 V 7.3 9.5 mA
†All typical values are at VCC = 5 V, TA = 25°C.
‡Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
switching characteristics (see Note 2)
PARAMETER FROM
(INPUT) TO
(OUTPUT)
VCC = 5 V,
CL = 50 pF,
RL = 500 Ω,
TA = 25°C
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500Ω,
TA = MIN to MAX§UNIT
MIN TYP MAX MIN MAX
tPLH
ABCDE
Y
1.7 4 5.5 1.2 6.5
ns
tPHL
A
,
B
,
C
,
D
,
E
Y
1 2.5 4 1 4.5
ns
§For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
NOTE 2: Load circuits and waveforms are shown in Section 1.
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74F260D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74F260DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74F260DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74F260DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74F260DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74F260DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74F260N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74F260NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
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PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74F260DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74F260DR SOIC D 14 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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