W005G thru W10G
FEATURES
Rating to 1000V PRV
Ideal for printed circuit board
Low forward voltage drop, high current capability.
Reliable low cost construction utilizing m olded epoxy
technique results in inexpensive product
The plas tic ma te ria l h a s U L flam ma b ility clas s i ficatio n
94V-0
UL Recognition File # E95060
ME CHANICAL DATA
Case : Molded plastic
Polarity: As marked on Body
Weight : 0.05 ounces, 1.3 grams
Mounting position : Any
MAXIMUM RATINGS AND ELECTRICAL CH ARACTERISTICS
Ratings at 25
℃
am bient temperature unless otherw ise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
F o r capacitive lo ad, derate c u rrent b y 20%
W10G
1000
700
1000
W08G
800
560
800
W06G
600
420
600
W04G
400
280
400
W02G
200
140
200
W005G
50
35
50
W01G
100
70
100
NOTES : 1.Measured at 1.0MHz and applied revers e voltage of 4.0V DC.
2.Thermal Resistance Junction to Ambient
V
RMS
V
DC
V
RRM
I
(AV)
I
FSM
V
F
I
R
C
J
@T
A
=
25 C
@T
J
=125 C
Maximum Av erage Forward
Rectified Current
Peak Forward Surge Current
8.3ms single half sine-wave
superimposed on rated load (JEDEC METHOD )
Maximum R ecurrent Peak Reverse Voltag e
Maximum R MS Volta ge
Maximum DC Blocking Voltage
Maximum forward Volt age at 1.0A D C
Maximum DC Reverse Current
at Rated DC Blocking Voltage
@T
J
=25 C
Typical Junction Capacitance
per elemen t (Note 1)
1.5
50
1.0
5.0
500
20
T
J
Operating Temperature Range
-55 to +150 C
T
STG
Storage Temperature Range
-55 to +150 C
Typical Thermal Resistance (Note 2)
R
0JA
36
C/W
pF
uA
uA
V
A
A
V
UNIT
V
V
CHARACTERISTICS SYMBOL
WOG
All Dimensions in millimete r
WOG
DIM. MIN. MAX.
A
C
D
E
F
B8.84 9.86
25.4
27.9 4.60
4.00
0.71 0.81
4.60 5.60
A
C
D
E
F
B
F
GLASS PA S SIVA TE D BRIDGE RECT IFIERS
REVE RSE VOLTAGE
- 50
to
1000
Volts
FOR WAR D CURRENT
- 1.5
Amperes
SEMICONDUCTOR
LITE-ON
REV. 2, 01-Dec-2000, KBDD01