© Semiconductor Components Industries, LLC, 2011
November, 2011 Rev. 3
1Publication Order Number:
BC856BWT1/D
BC856BWT1,
SBC856BWT1 Series,
BC857BWT1,
SBC857BWT1 Series,
BC858AWT1 Series
General Purpose
Transistors
PNP Silicon
These transistors are designed for general purpose amplifier
applications. They are housed in the SC70/SOT323 which is
designed for low power surface mount applications.
Features
AECQ101 Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating Symbol Value Unit
Collector-Emitter Voltage
BC856, SBC856
BC857, SBC857
BC858
VCEO
65
45
30
V
Collector-Base Voltage
BC856, SBC856
BC857, SBC857
BC858
VCBO
80
50
30
V
EmitterBase Voltage VEBO 5.0 V
Collector Current Continuous IC100 mAdc
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR5 Board,
(Note 1) TA = 25°C
PD150 mW
Thermal Resistance,
JunctiontoAmbient
RqJA 883 °C/W
Junction and Storage Temperature TJ, Tstg 55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR5 = 1.0 x 0.75 x 0.062 in.
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SC70/SOT323
CASE 419
STYLE 3
MARKING DIAGRAM
1
2
3
COLLECTOR
3
1
BASE
2
EMITTER
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
1
xx M G
G
xx = Specific Device Code
M = Date Code*
G= PbFree Package
*Date Code orientation may vary depending
upon manufacturing location.
(Note: Microdot may be in either location)
BC856BWT1, SBC856BWT1 Series, BC857BWT1, SBC857BWT1 Series, BC858AWT1
Series
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2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
CollectorEmitter Breakdown Voltage BC856, SBC856 Series
(IC = 10 mA) BC857, SBC857 Series
BC858 Series
V(BR)CEO 65
45
30
V
CollectorEmitter Breakdown Voltage BC856, SBC856 Series
(IC = 10 mA, VEB = 0) BC857B, SBC857B Only
BC858 Series
V(BR)CES 80
50
30
V
CollectorBase Breakdown Voltage BC856, SBC856 Series
(IC = 10 mA) BC857, SBC857 Series
BC858 Series
V(BR)CBO 80
50
30
V
EmitterBase Breakdown Voltage BC856, SBC856 Series
(IE = 1.0 mA) BC857, SBC857 Series
BC858 Series
V(BR)EBO 5.0
5.0
5.0
V
Collector Cutoff Current (VCB = 30 V)
Collector Cutoff Current (VCB = 30 V, TA = 150°C)
ICBO
15
4.0
nA
mA
ON CHARACTERISTICS
DC Current Gain BC856A, BC585A
(IC = 10 mA, VCE = 5.0 V) BC856B, SBC856B, BC857B,
SBC857B BC858B
BC857C
(IC = 2.0 mA, VCE = 5.0 V) BC856A, BC858A
BC856B, SBC856B, BC857B,
SBC857B, BC858B
BC857C
hFE
125
220
420
90
150
270
180
290
520
250
475
800
CollectorEmitter Saturation Voltage
(IC = 10 mA, IB = 0.5 mA)
(IC = 100 mA, IB = 5.0 mA)
VCE(sat)
0.3
0.65
V
Base Emitter Saturation Voltage
(IC = 10 mA, IB = 0.5 mA)
(IC = 100 mA, IB = 5.0 mA)
VBE(sat)
0.7
0.9
V
Base Emitter On Voltage
(IC = 2.0 mA, VCE = 5.0 V)
(IC = 10 mA, VCE = 5.0 V)
VBE(on)
0.6
0.75
0.82
V
SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 10 mA, VCE = 5.0 Vdc, f = 100 MHz)
fT100 MHz
Output Capacitance
(VCB = 10 V, f = 1.0 MHz)
Cob 4.5 pF
Noise Figure
(IC = 0.2 mA, VCE = 5.0 Vdc, RS = 2.0 kW,
f = 1.0 kHz, BW = 200 Hz)
NF 10 dB
BC856BWT1, SBC856BWT1 Series, BC857BWT1, SBC857BWT1 Series, BC858AWT1
Series
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3
BC857/SBC847/BC858
Figure 1. Normalized DC Current Gain
IC, COLLECTOR CURRENT (mAdc)
2.0
Figure 2. “Saturation” and “On” Voltages
IC, COLLECTOR CURRENT (mAdc)
-0.2
0.2
Figure 3. Collector Saturation Region
IB, BASE CURRENT (mA)
Figure 4. BaseEmitter Temperature Coefficient
IC, COLLECTOR CURRENT (mA)
-0.6
-0.7
-0.8
-0.9
-1.0
-0.5
0
-0.2
-0.4
-0.1
-0.3
1.6
1.2
2.0
2.8
2.4
-1.2
-1.6
-2.0
-0.02 -1.0 -10
0-20
-0.1
-0.4
-0.8
hFE, NORMALIZED DC CURRENT GAIN
V, VOLTAGE (VOLTS)
VCE, COLLECTOR-EMITTER VOLTAGE (V)
VB, TEMPERATURE COEFFICIENT (mV/ C)°θ
1.5
1.0
0.7
0.5
0.3
-0.2 -10 -100
-1.0
TA = 25°C
VBE(sat) @ IC/IB = 10
VCE(sat) @ IC/IB = 10
VBE(on) @ VCE = -10 V
VCE = -10 V
TA = 25°C
-55°C to +125°C
IC = -100 mA
IC = -20 mA
-0.5 -1.0 -2.0 -5.0 -10 -20 -50 -100 -200 -0.1 -0.2 -0.5 -1.0 -2.0 -5.0 -10 -20 -50 -100
IC = -200 mAIC = -50 mAIC =
-10 mA
Figure 5. Capacitances
VR, REVERSE VOLTAGE (VOLTS)
10
Figure 6. CurrentGain Bandwidth Product
IC, COLLECTOR CURRENT (mAdc)
-0.4
1.0
80
100
200
300
400
60
20
40
30
7.0
5.0
3.0
2.0
-0.5
C, CAPACITANCE (pF)
f, CURRENT-GAIN - BANDWIDTH PRODUCT (MHz)
T
TA = 25°C
Cob
Cib
-0.6 -1.0 -2.0 -4.0 -6.0 -10 -20 -30 -40
150
-1.0 -2.0 -3.0 -5.0 -10 -20 -30 -50
VCE = -10 V
TA = 25°C
TA = 25°C
1.0
BC856BWT1, SBC856BWT1 Series, BC857BWT1, SBC857BWT1 Series, BC858AWT1
Series
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4
BC856/SBC856
Figure 7. DC Current Gain
IC, COLLECTOR CURRENT (mA)
Figure 8. “On” Voltage
IC, COLLECTOR CURRENT (mA)
-0.8
-1.0
-0.6
-0.2
-0.4
1.0
2.0
-0.1 -1.0 -10 -200
-0.2
0.2
0.5
-0.2 -1.0 -10 -200
TJ = 25°C
VBE(sat) @ IC/IB = 10
VCE(sat) @ IC/IB = 10
VBE @ VCE = -5.0 V
Figure 9. Collector Saturation Region
IB, BASE CURRENT (mA)
Figure 10. BaseEmitter Temperature Coefficient
IC, COLLECTOR CURRENT (mA)
-1.0
-1.2
-1.6
-2.0
-0.02 -1.0 -10
0-20
-0.1
-0.4
-0.8
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
VB, TEMPERATURE COEFFICIENT (mV/ C)°θ
-0.2 -2.0 -10 -200
-1.0
TJ = 25°C
IC =
-10 mA
hFE, DC CURRENT GAIN (NORMALIZED)
V, VOLTAGE (VOLTS)
VCE = -5.0 V
TA = 25°C
0-0.5 -2.0 -5.0 -20 -50 -100
-0.05 -0.2 -0.5 -2.0 -5.0
-100 mA
-20 mA
-1.4
-1.8
-2.2
-2.6
-3.0
-0.5 -5.0 -20 -50 -100
-55°C to 125°C
qVB for VBE
-2.0 -5.0 -20 -50 -100
Figure 11. Capacitance
VR, REVERSE VOLTAGE (VOLTS)
40
Figure 12. CurrentGain Bandwidth Product
IC, COLLECTOR CURRENT (mA)
-0.1 -0.2 -1.0 -50
2.0 -2.0 -10 -100
100
200
500
50
20
20
10
6.0
4.0
-1.0 -10 -100
VCE = -5.0 V
C, CAPACITANCE (pF)
f, CURRENT-GAIN - BANDWIDTH PRODUCT
T
-0.5 -5.0 -20
TJ = 25°C
Cob
Cib
8.0
-50 mA -200 mA
BC856BWT1, SBC856BWT1 Series, BC857BWT1, SBC857BWT1 Series, BC858AWT1
Series
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Figure 13. Thermal Response
t, TIME (ms)
1.0
r(t), TRANSIENT THERMAL
2.0 5.01.00.50.20.1
RESISTANCE (NORMALIZED)
0.7
0.5
0.3
0.2
0.1
0.07
0.05
0.03
0.02
0.01
20 5010 200 500100 1.0k 2.0k 5.0k 10k
Figure 14. Active Region Safe Operating Area
VCE, COLLECTOR-EMITTER VOLTAGE (V)
-200
-1.0
IC, COLLECTOR CURRENT (mA)
TA = 25°C
D = 0.5
0.2
0.1 0.05 SINGLE PULSE
SINGLE PULSE
BONDING WIRE LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
3 ms
TJ = 25°C
ZqJC(t) = r(t) RqJC
RqJC = 83.3°C/W MAX
ZqJA(t) = r(t) RqJA
RqJA = 200°C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) TC = P(pk) RqJC(t)
t1
t2
P(pk)
DUTY CYCLE, D = t1/t2
-100
-50
-10
-5.0
-2.0
-5.0 -10 -30 -45 -65 -100
1 s
BC858
BC857
BC856
The safe operating area curves indicate ICVCE lim-
its of the transistor that must be observed for reliable oper-
ation. Collector load lines for specific circuits must fall
below the limits indicated by the applicable curve.
The data of Figure 14 is based upon TJ(pk) = 150°C; TC
or TA is variable depending upon conditions. Pulse curves
are valid for duty cycles to 10% provided TJ(pk) 150°C.
TJ(pk) may be calculated from the data in Figure 13. At
high case or ambient temperatures, thermal limitations
will reduce the power that can be handled to values less
than the limitations imposed by the secondary breakdown.
ORDERING INFORMATION
Device Marking Package Shipping
BC856BWT1G
3B SC70/SOT323
(PbFree) 3,000 / Tape & Reel
SBC856BWT1G
BC857BWT1G
3F SC70/SOT323
(PbFree) 3,000 / Tape & Reel
SBC857BWT1G
BC857CWT1G 3G SC70/SOT323
(PbFree) 3,000 / Tape & Reel
BC858AWT1G 3J SC70/SOT323
(PbFree) 3,000 / Tape & Reel
BC858BWT1G 3K SC70/SOT323
(PbFree) 3,000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
BC856BWT1, SBC856BWT1 Series, BC857BWT1, SBC857BWT1 Series, BC858AWT1
Series
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6
PACKAGE DIMENSIONS
SC70 (SOT323)
CASE 41904
ISSUE N
STYLE 3:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
AA2
D
e1
b
e
E
A1
c
L
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
0.05 (0.002)
1.9
0.075
0.65
0.025
0.65
0.025
0.9
0.035
0.7
0.028 ǒmm
inchesǓ
SCALE 10:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
HE
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.80 0.90 1.00 0.032
INCHES
A1 0.00 0.05 0.10 0.000
A2 0.70 REF
b0.30 0.35 0.40 0.012
c0.10 0.18 0.25 0.004
D1.80 2.10 2.20 0.071
E1.15 1.24 1.35 0.045
e1.20 1.30 1.40 0.047
0.035 0.040
0.002 0.004
0.014 0.016
0.007 0.010
0.083 0.087
0.049 0.053
0.051 0.055
NOM MAX
L
2.00 2.10 2.40 0.079 0.083 0.095
HE
e1 0.65 BSC
0.38
0.028 REF
0.026 BSC
0.015
0.20 0.56 0.008 0.022
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