DS8500 Evaluation Kit General Description The DS8500 evaluation kit (EV kit) provides a convenient platform to evaluate the DS8500 HART(R) modem. It allows quick evaluation through a demonstration mode and in-depth evaluation using HART Communication Foundation (a part of FieldComm Group) tools. EV Kit Contents DS8500 EV Kit Board Micro-USB Cable Evaluates: DS8500 Benefits and Features The EV Kit Provides Fast and Simple Evaluation by Providing a Total HART Communications Chain on Board Example HART Master and Field Device Circuits Demonstrate Usage in the Two Most Common HART Connection Configurations HART Registered Modem IC On-Board Isolated 4mA-20mA Communications Loop MAXQ622 USB Microcontroller with Demo Firmware External Connections Allow for Advanced Evaluation of the DS8500 in Other Configurations Figure 1. USB Connection and READY LEDs HART and HART Registered are registered trademarks of the HART Communication Foundation Corp. 19-5641; Rev 1; 9/15 Evaluates: DS8500 DS8500 Evaluation Kit Quick Start The DS8500 EV kit comes with demonstration firmware already loaded. Detailed Description of Hardware Users must also use the DS8500 IC data sheet in conjunction with this EV kit data sheet. 1) Download and install the DS8500 EVKIT Software GUI at www.maximintegrated.com/evkitsoftware. Power Supply 2) Use the included Micro-USB cable to connect and power the EV kit as shown in Figure 1. On-Board 4-20mA Current Loop 3) Wait until the READY LEDs (circled in Figure 1) light after the board has finished USB enumeration. This can take several seconds. 4) Start the DS8500 EVKIT GUI from the Start menu by selecting Maxim Integrated | DS8500 | DS8500 Evaluation Kit. Figure 2 shows the demo GUI. It automatically finds the USB-connected EV kit. 5) Simply type messages from the Master or Field Device window and press the Send button to transmit and receive modulated data over the on-board 4-20mA current loop. 6) Observe the ACTIVE LEDs lighting while transmitting and receiving. The EV kit uses USB power for all on-board devices. The current loop is isolated from board ground and power allowing communications between Master and Field Device, both implemented by serial ports on the MAXQ622. This common connection necessitates use of a fully isolated 4-20mA loop, which is very sensitive to ground loops, thus direct probing of the on-board loop is strongly discouraged and could damage the EV kit. Note that this is a nontypical configuration specifically designed for demonstration purposes. In typical installations, Master and Field Device are separately located, with the Field Device floating, often powered by loop current. Figure 2. DS8500 EV Kit Demo GUI www.maximintegrated.com Maxim Integrated 2 Evaluates: DS8500 DS8500 Evaluation Kit Interface Ports Jumpers JP2-JP5 provide direct access to the serial control signals for the Master side of the HART loop. Jumpers JP8-JP11 provide direct access to the serial control signals for the Field Device side of the HART loop. These allow connection to an embedded microcontroller or computer running a HART stack via 3.3V TTL serial UART. See Table 1 and the Advanced Evaluation section for more details. Each DS8500 exposes FSK_OUT and FSK_IN signals via jumper for probing purposes (Table 2). Jumper Functions The DS8500 EV kit is equipped with 17 jumpers for disconnecting pins and modifying the EV kit features. Table 3 details the jumpers not previously covered. External Connectors The EV kit has three terminal blocks for easy loop/wire connections. See Table 4. Advanced Evaluation The DS8500 EV kit can communicate directly with actual HART devices or software-emulated devices. The onboard MAXQ622 is only for demonstration purposes Table 1. Master and Field Device Control Signals PORT PIN PIN NAME PIN TYPE DESCRIPTION JP2 HRXD_M Output Digital serial data output from MASTER DS8500 (DOUT) JP3 HOCD_M Output Carrier detect output from MASTER DS8500 JP4 HTXD_M Input Digital serial data input to MASTER DS8500 (DIN) JP5 HRTS_M Input Active-low request to send signal for MASTER DS8500 JP8 HRXD_F Output Digital serial data output from FIELD DEVICE DS8500 (DOUT) JP9 HOCD_F Output Carrier detect output from FIELD DEVICE DS8500 JP10 HTXD_F Input Digital serial data input to FIELD DEVICE DS8500 (DIN) JP11 HRTS_F Input Active-low request to send signal for FIELD DEVICE DS8500 Note: Serial signals are 3.3V TTL. Table 2. FSK Probe and Disconnect Jumpers JUMPER NAME TYPE JP6 FSK_IN_M Input MASTER side incoming FSK-modulated serial signal JP7 RAW_FSK_M Output MASTER side outgoing FSK-modulated serial signal JP12 FSK_IN_F Input FIELD DEVICE side incoming FSK-modulated serial signal JP13 RAW_FSK_F Output FIELD DEVICE side outgoing FSK-modulated serial signal www.maximintegrated.com DESCRIPTION Maxim Integrated 3 Evaluates: DS8500 DS8500 Evaluation Kit Table 3. Jumper Settings JUMPER JP1 (1-2) JP1 (2-3) J4 J5 J7 J9 JP14 SETTING EFFECT Closed* Powers the 4-20mA loop from on-board power Open Disconnects 4-20mA loop from on-board power Closed Connect external loop power from connector J2 Open* Disconnects external loop power from connector J2 Closed* Connects loop power to master device Open Isolates loop power from master device Closed* Connect master to field device via loop Open Isolates master from field device via loop Closed* Connects field device to master via loop Open Isolates field device from master via loop Closed* Connects field device to loop return Open Isolates field device from loop return Closed* Open Connects VBUS power (5V) to loop 24V power supply Disconnects power from loop supply for noise reduction *Default position. Table 4. External Connectors CONNECTOR PURPOSE J2 Power the 4-20mA loop from an external galvanic isolated supply or battery J5 Wire connection interface to MASTER J8 Wire connection interface to FIELD DEVICE (USB interface) and does not implement a HART software stack. The serial UART data and control pins are exposed via jumpers as detailed in Table 1. They allow a hardware serial port on a PC or laptop to transmit and receive modulated signals. Note that these serial pins expect TTL level signals (3.3V), not RS-232 level, so a serial level shifter board is typically required for communications. The following examples detail two evaluation setups. Other configurations are possible, including emulating both simultaneously, or connection to an actual Field Device. However, these are beyond the scope of this document. Note: The following configurations require hardware and software tools available from the FieldComm Group or other sources and are not included with the DS8500 EV kit. Emulated HART Field Device To use the DS8500 EV kit as a Field Device interface, follow the setup detailed in Figure 3, using the on-board 24V loop power supply and load resistor. Simply connect a personal computer running HART master software, (e.g., HCF_KIT_180) and a HART serial modem (e.g., HCF_TOOL-35, available with the Physical Layer Test Kit HCF_KIT-116). The reference modem's loop connections attach across the Field Device as shown. Verify that the jumpers (J7 and J9) remain in place, even with the loop connections attached. Another personal computer simulates the behavior of an actual field device by running the XMTR MV tool (HCF_ TOOL-039). Remove jumpers JP8-JP11 and connect the serial signals to the computer via a RS-232 level shifter. To test, launch the XMTR MV program, then start the Master software and observe communications. www.maximintegrated.com Maxim Integrated 4 Evaluates: DS8500 DS8500 Evaluation Kit USB JP2 RXD M RXD F JP8 JP3 OCD M OCD F JP9 JP4 TXD M TXD F JP10 JP5 RTS M RTS F JP11 PC/LAPTOP RS232 LEVEL SHIFTER FIELD DEVICE XMTR MV HCF_TOOL-039 DS8500 EVKIT BOARD + 24V - FIELD DEVICE MASTER J4 J9 250 J6 J7 REFERENCE MODEM HCF_TOOL-35 PC/LAPTOP MASTER HCF_KIT_180 Figure 3. Setup for Emulated Field Device Evaluation www.maximintegrated.com Maxim Integrated 5 Evaluates: DS8500 DS8500 Evaluation Kit Emulated HART Primary/Secondary Master Another personal computer simulates the behavior of the Field Device by running the XMTR MV tool (HCF_TOOL039) and using a HART serial modem (e.g., HCF_TOOL35, available with the Physical Layer Test Kit HCF_KIT116). The reference modem's loop connections attach across the load resistor as shown in Figure 4. To use the DS8500 EV kit as a Master or Secondary Master, follow the setup detailed in Figure 4. This example does not require loop power so completely remove jumpers J4 and J6 to isolate the Master side of the EV kit from the on-board loop. Remove jumpers JP2-JP5 and connect the serial signals to the computer via a RS-232 level shifter. This computer runs HART master software (e.g., HCF_KIT_180). To test, launch the XMTR MV program, then start the Master software and observe communications. USB PC/LAPTOP MASTER HCF_KIT_180 RS232 LEVEL SHIFTER JP2 RXD M RXD F JP8 JP3 OCD M OCD F JP9 JP4 TXD M TXD F JP10 JP5 RTS M RTS F JP11 DS8500 EVKIT BOARD + 24V - FIELD DEVICE MASTER J4 PC/LAPTOP FIELD DEVICE XMTR MV HCF_TOOL-039 REFERENCE MODEM HCF_TOOL-35 J9 250 J6 J7 Figure 4. Setup for Emulated Master Evaluation www.maximintegrated.com Maxim Integrated 6 Evaluates: DS8500 DS8500 Evaluation Kit Component List, Schematics, and PCB Layout See the following links for component list, PCB layout, and schematics: * DS8500-KIT BOM * DS8500-KIT schematics * DS8500-KIT PCB layout www.maximintegrated.com Ordering Information PART DS8500-KIT# TYPE EV Kit #Denotes RoHS compliant. Maxim Integrated 7 Evaluates: DS8500 DS8500 Evaluation Kit Revision History REVISION NUMBER REVISION DATE PAGES CHANGED 0 11/10 Initial release 1 9/15 Rewrote data sheet to include GUI and jumper descriptions and settings DESCRIPTION -- 1-8 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrated's website at www.maximintegrated.com. Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. (c) 2015 Maxim Integrated Products, Inc. 8 Bill of Materials (BOM) (Rev 1; 6/15) Item Number Quantity Part Reference 1 4 BMP1 BMP2 BMP3 BMP4 2 2 C1 C2 3 8 C3 C13 C15 C17 C19 C35 C36 C50 C5 C7 C11 C12 C14 C16 C18 C20 C24 C25 C26 C27 C34 C37 C41 C42 C43 C44 4 21 C47 C48 C51 5 2 C9 C10 6 3 C21 C38 C54 7 2 C22 C39 8 2 C23 C40 9 4 C28 C29 C45 C46 10 4 C30 C32 C52 C53 11 1 C31 12 1 C33 13 1 C49 14 1 C55 15 1 C56 16 1 C57 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 1 1 3 2 2 1 1 1 1 1 1 1 3 C59 D1 D2 D3 D5 D4 D6 D7 D9 D8 F1 H1 H2 H3 H4 J1 J2 J5 J8 1 J3 J4 J6 J7 J9 JP2 JP3 JP4 JP5 JP6 JP7 JP8 17 JP9 JP10 JP11 JP12 JP13 JP14 1 JP1 2 L1 L5 2 L2 L3 1 L4 1 PCB1 1 Q1 1 Q2 1 Q3 1 Q4 Value Bumper 10uF 1uF BOM_Description BUMPER CYLIN 0.375" DIA BLK CAP CER 10uF 10V 10% X7R 0805 CAP CER 1uF 10V 20% X5R 0603 Manufacturer_PN SJ61A4 GRM21BR71A106KE51L GRM188R61A105MA61D Vendor_PN SJ5750-0-ND 490-3905-1-ND 490-1544-1-ND Vendor Digi-Key Digi-Key Digi-Key PKG_Size 0.375" Dia x 0.311" H 0805 0603 100nF 18pF 2.2nF 10nF 1uF 15pF 33nF 2.2uF 2.2uF 1nF 22uF 1uF 100nF CAP CER 0.1uF 16V 10% X7R 0603 CAP CER 18PF 50V 5% NP0 0402 CAP CER 2200PF 50V 5% NP0 0805 CAP CER 10000PF 50V 5% NP0 0805 CAP CER 1uF 16V 10% X7R 0603 CAP CER 15PF 50V 5% NP0 0603 CAP CER 0.033UF 10V 10% X7R 0603 CAP CER 2.2uF 10V 10% X5R 0603 CAP CER 2.2UF 50V 10% X7R 1206 CAP CER 1nF 50V 5% NP0 0603 CAP ALUM 22UF 50V 20% SMD CAP CER 1UF 50V 10% X7R 1206 CAP CER 0.1UF 50V 10% X7R 0603 C0603C104K4RACTU GRM1555C1H180JA01D GRM2165C1H222JA01D GRM2195C1H103JA01D GCM188R71C105KA64D GRM1885C1H150JA01D C0603C333K8RACTU C0603C225K8PACTU GRM31CR71H225KA88L GRM1885C1H102JA01D RPS1H220MCN1GS C3216X7R1H105K160AB C0603C104K5RACTU 399-1096-1-ND 490-5858-1-ND 490-1628-1-ND 490-1642-1-ND 490-5241-1-ND 490-1407-1-ND 399-9070-1-ND 399-4911-1-ND 490-3367-1-ND 490-1451-1-ND 493-6648-1-ND 445-1423-1-ND 399-5089-1-ND Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key 0603 0402 0805 0805 0603 0603 0603 0603 1206 0603 Alum 8mm Dia (Case E) 1206 0603 47uF SMF5.0A-TP GRN YEL SMCJ36CA 1N5819HW-7-F 350mA DNI DNI DNI DNI MICRO USB AB RCPT RA 2P 3.5mm CAP ALUM 47UF 6.3V 20% SMD 5mm Dia TVS 200W 5V UNIDIR SOD-123FL LED 565NM WTR CLR GREEN 1206 SMD LED ALINGAP YELLOW CLR 1206 SMD TVS DIODE 36VWM 58.1VC SMC DIODE SCHOTTKY 40V 1A SOD123 FUSE PTC RESET 350MA SMD 0603 DNI MTG 125DRL 300PAD DNI MTG 125DRL 300PAD DNI MTG 125DRL 300PAD DNI MTG 125DRL 300PAD CONN RCPT MICRO USB AB R/A SMD TERM BLOCK 3.5MM VERT 2POS PCB MAXQ_POGO_PIN CBL PLUG-OF-NAILS 10PIN PCS0J470MCL1GS SMF5.0A-TP SML-LX1206GC-TR SML-LX1206SYC-TR SMCJ36CA 1N5819HW-7-F MF-FSMF035X-2 493-3966-1-ND SMF5.0A-TPMSCT-ND 67-1357-1-ND 67-1699-1-ND SMCJ36CALFCT-ND 1N5819HW-FDICT-ND MF-FSMF035X-2CT-ND Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key 47589-0001 OSTTE020161 WM17143CT-ND ED2635-ND Alum 5mm Dia SMD SOD-123 1206 1206 SMC (DO-214AB) SOD-123 0603 MTG 125DRL 300PAD MTG 125DRL 300PAD MTG 125DRL 300PAD MTG 125DRL 300PAD Digi-Key 47589-0001 Digi-Key 2P (3.5MM LS) TC2050-IDC-NL TC2050-IDC-NL-ND Digi-Key TC2050-IDC-NL CONN HEADER .100 SINGL STR 2POS (2x1) CONN HEADER .100 SINGL STR 3POS FERRITE CHIP SIGNAL 2000 OHM SMD IND 100UH 0.16A MINI DRUM SMD FIXED IND 6.8UH 640MA 270 MOHM PEC02SAAN PEC03SAAN HZ1206C202R-10 82104C 82682C S1012E-02-ND S1012E-03-ND 240-2413-1-ND 811-2479-1-ND 811-2472-1-ND Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key 2x1 (0.1" LS) 3X1 (0.1" LS) 1206 8200 Series 8200 Series MOSFET P-CH 25V 460MA SOT-23 PHOTOCOUPLER PHOTORELAY 6-DIP MOSFET N-CH 60V 2.8A SOT-223 TRANSISTOR GP NPN AMP SOT-23 FDV304P TLP3545(F) NDT014L MMBT3904 FDV304PCT-ND TLP3545(F)-ND NDT014LCT-ND MMBT3904FSCT-ND Digi-Key Digi-Key Digi-Key Digi-Key SOT-23 3P 6P DIP SOT-223 SOT-23-3 DNI JUMPER 3P JUMPER HZ1206C202R-10 100uH 6.8uH PCB FDV304P TLP3545(F) NDT014L MMBT3904 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 1 4 4 2 2 2 1 2 1 1 1 4 5 2 1 1 1 1 1 1 17 1 1 3 6 1 1 1 1 2 1 1 1 1 2 R1 R2 R3 R4 R5 R6 R13 R18 R20 R7 R21 R8 R23 R9 R22 R10 R11 R15 R12 R14 R16 R17 R19 R24 R32 R25 R26 R27 R28 R29 R30 R33 R31 R34 R35 R36 R37 R38 681 150 100K 1.58K 221K 301K 49.9 10K 12.4K 249 10 1K 1.24M 300 511K 24.3 100 20K 10 10K RES 681 OHM 1/10W 1% 0603 SMD RES 150 OHM 1/10W 1% 0603 SMD RES 100K OHM 1/10W 1% 0603 SMD RES 1.58K OHM 1/10W 1% 0603 SMD RES 221K OHM 1/10W 1% 0603 SMD RES 301K OHM 1/10W 1% 0603 SMD RES 49.9 OHM 1/10W 1% 0603 SMD RES 10K OHM 1/10W 1% 0603 SMD RES 12.4K OHM 1/10W 1% 0603 SMD RES 249 OHM 1W 1% 2512 SMD RES 10 OHM 1/10W 1% 0603 SMD RES 1K OHM 1/10W 1% 0603 SMD RES 1.24M OHM 1/10W 1% 0603 SMD RES 300 OHM 1/10W 1% 0603 SMD RES 511K OHM 1/10W 1% 0603 SMD RES 24.3 OHM 1/10W 1% 0603 SMD RES 100 OHM 1/10W 1% 0603 SMD RES 20K OHM 1/10W .1% 0603 SMD RES SMD 10 OHM 0.1% 1/8W 1206 RES SMD 10K OHM 1% 1/4W 1206 ERJ-3EKF6810V ERJ-3EKF1500V ERJ-3EKF1003V ERJ-3EKF1581V ERJ-3EKF2213V ERJ-3EKF3013V ERJ-3EKF49R9V ERJ-3EKF1002V ERJ-3EKF1242V MCR100JZHF2490 ERJ-3EKF10R0V ERJ-3EKF1001V CRCW06031M24FKEA ERJ-3EKF3000V ERJ-3EKF5113V ERJ-3EKF24R3V ERJ-3EKF1000V ERA-3AEB203V CRT1206-BY-10R0ELF ERJ-8ENF1002V P681HCT-ND P150HCT-ND P100KHCT-ND P1.58KHCT-ND P221KHCT-ND P301KHCT-ND P49.9HCT-ND P10.0KHCT-ND P12.4KHCT-ND RHM249BBCT-ND P10.0HCT-ND P1.00KHCT-ND 541-1.24MHCT-ND P300HCT-ND P511KHCT-ND P24.3HCT-ND P100HCT-ND P20KDBCT-ND CRT1206-BY-10R0ELFCT-ND P10.0KFCT-ND Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key 0603 0603 0603 0603 0603 0603 0603 0603 0603 2512 0603 0603 0603 0603 0603 0603 0603 0603 1206 1206 SJ1 SJ2 SJ3 SJ4 SJ5 SJ6 SJ7 SJ8 SJ9 SJ10 SJ11 SJ12 SJ13 SJ14 SJ15 SJ16 SJ17 SW2 T1 TP1 TP3 TP4 TP2 TP5 TP6 TP7 TP8 TP9 U1 U2 U3 U4 U5 U7 U6 U8 U9 Y1 Y2 Y3 SHUNT DIP SW 4POS MET-26 RED BLK MAX1806EUA33+ NME0524SC MAXQ622G-0000+ MAX3207EAUT+T DS8500-JND+ MAX4166EUA+ MAX6133A25+ MAX9620AXK+T 12MHz 3.6864MHz CONN JUMPER SHORTING TIN SWITCH DIP 4POS SEALED GOLD TRANSFORMER 1KCT:1KCT 3.0MADC TEST POINT PC COMPACT .063"D RED TEST POINT PC COMPACT .063"D BLK IC REG LDO 3.3V/ADJ 0.5A 8UMAX CONV DC/DC 1W 5VIN 24V SIP SGL IC MCU 16BIT 128KB IR MOD 64LQFP ESD PROT DIFF SOT23-6 IC MODEM HART SGL 3.6V 20-TQFN IC OPAMP GP 5MHZ RRO 8UMAX IC VREF SERIES 2.5V 8UMAX IC OPAMP CHOPPER 1.5MHZ SC70-5 CRYSTAL 12MHZ 18PF SMD CRYSTAL 3.6864MHZ 18PF THRU STC02SYAN 3-5435640-5 MET-26 5005 5006 MAX1806EUA33+ NME0524SC MAXQ622G-0000+ MAX3207EAUT+T DS8500-JND+ MAX4166EUA+ MAX6133A25+ MAX9620AXK+T ABM3-12.000MHZ-D2Y-T ECS-36-18-4X S9000-ND 450-1404-ND 838-MET-26 5005K-ND 5006K-ND MAX1806EUA33+-ND 811-1481-5-ND MAXQ622G-0000+-ND MAX3207EAUT+TCT-ND DS8500-JND+-ND MAX4166EUA+-ND MAX6133A25+-ND MAX9620AXK+TCT-ND 535-10634-1-ND X1042-ND Digi-Key Digi-Key Mouser Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key Digi-Key BLK Shunt 8P DIP (0.1" LS) MET-26 Compact Compact 8P Power-Umax 4-SIP Module 64P LQFP 6P SOT-23 20P 5x5 TQFN 8P UMAX 8P UMAX SC70 5P 5x3.2 ABM3 HC49/US TP2 Black VBUS GND J1 1 TP1 RED EVKIT POWER IN (USB VBUS) MICRO USB/POWER 1 3V3 U1 MAX1806EUA33+ 750ma trip 2 350mA F1 1 L1 1 2 3 4 HZ1206C202R-10 C1 10uF D1 SMF5.0A-TP R1 681 C3 IN_1 OUT_1 IN_2 OUT_2 POK SET SHDN GND EP TP3 RED 1 8 7 6 5 9 +3V3 C2 10uF 1uF D2 GRN GND_4 GND_3 GND_2 GND_1 VBUS DM DP ID GND 1 2 3 4 5 PRIMARY VOLTAGE REGULATOR TP4 RED POWER 9 8 7 6 1 +24VDC_LOOP_PWR JP1 Add jumper to U2 power inlet. Simplify output filter. LOOP PWR SEL 2 1 SJ17 SHUNT 3 J2 +24VDC 1 2 1 2 GALVANICALLY ISOLATED DC-DC CONVERTER EXT + LOOP POWER LOOP_RET U2 NME0524SC DC-DC VIN 2 1 JP14 L4 2 6.8uH C5 + C59 47uF 100nF C7 1 100nF L2 +VIN +VOUT 5V DC 24V DC -VIN -VOUT 100uH L3 100uH 4 3 C57 100nF 50V C56 1uF 50V + C55 22uF 50V R38 10K 1 TP5 Black LOOP_RET U3 MAXQ622G-0000+ 64 18pF 1 2 C9 18pF 1 Y1 12MHz C10 15 MRST_N L5 25 26 19 HZ1206C202R-10 18 16 MDM MDP C11 U4 MAX3207EAUT+T 1 6 NC6 5 2 IO1 3 GND VCC 4 NC3 IO2 100nF ESD PROTECTION 23 22 3V3 C12 20 100nF 21 C13 1uF C14 100nF C15 1uF C16 100nF C17 1uF C18 100nF C19 1uF 100nF 36 46 47 8 17 24 35 63 J3 JTAG 3V3 MP24 MP27 MP26 1 2 3 4 5 TCK GND TDO VREF TMS DNI GND TDI VCC5 KEY nRST 10 9 8 7 6 MP25 MRST_N IRRX HFXIN HFXOUT RESET VBUS DM DP REG18 VDD VDDB P0.0/IRTXM P0.1/RX0 P0.2/TX0 P0.3/RX1/SDA P0.4/TX1/SCL P0.5/TBA0/TBA1 P0.6/TBB0 P0.7/TBB1 P1.0/INT0 P1.1/INT1 P1.2/INT2 P1.3/INT3 P1.4/INT4 P1.5/INT5 P1.6/INT6 P1.7/INT7 P2.0/MOSI0 P2.1/MISO0 P2.2/SCLK0 P2.3/SSEL0 P2.4/TCK P2.5/TDI P2.6/TMS P2.7/TDO VDDIO C20 37 38 39 40 MAXQ622 PROGRAMMING JTAG PORT IRTX N.C._1 N.C._2 N.C._3 P5.0/MOSI1 P5.1/MISO1 P5.2/SCLK1 P5.3/SSEL1 GND GND GND GND GND P3.0/INT8 P3.1/INT9 P3.2/INT10 P3.3/INT11 P3.4/INT12 P3.5/INT13 P3.6/INT14 P3.7/INT15 P4.0 P4.1 P4.2 P4.3 P4.4 P4.5 P4.6 P4.7 2 3 4 5 6 7 9 10 45 48 49 50 51 52 53 54 HRXD_M HTXD_M HRXD_F HTXD_F HOCD_F HRTS_F HRTS_M HOCD_M MOUNTING HOLES & BUMPERS BMP1 H1 1 11 12 13 14 41 42 43 44 27 28 29 30 31 32 33 34 55 56 57 58 59 60 61 62 Bumper Green - Master Ready R2 150 MP24 MP25 MP26 MP27 D3 GRN 3V3 D4 1 DNI Yellow - Master Activity 150 BMP2 H2 Bumper READY R3 DNI YEL 3V3 ACTIVE H3 BMP3 1 Bumper DNI H4 BMP4 1 Bumper DNI Green - Field Ready R4 150 D5 GRN 3V3 READY Yellow - Field Activity R5 150 D6 YEL ACTIVE 3V3 UART INTERFACE SJ2 SHUNT SJ3 SHUNT SJ4 SHUNT JP2 1 2 RXD M HOCD_M JP3 1 2 OCD M HTXD_M JP4 1 2 TXD M HRTS_M JP5 1 2 RTS M 3V3 R6 100K EP_GND 3V3 DVDD DVDD OCD_M DVDD AGND DVDD FSKIN DGND REF RST FSKOUT U5 OCD DS8500-JND+ AVDD C25 100nF FSK BANDPASS FILTER 3V3 15 14 13 12 11 240Hz HiPass JP6 1 FSKI_M REF_M FSKO_M AVDD_M 2 FSK IN M C21 R8 JP7 1 C26 100nF C27 100nF 2 RAW FSK M 10.1KHz LoPass 2.2nF NPO R7 221K C23 1.58K C22 10nF NPO R9 301K 1uF SJ6 SHUNT 6 7 8 9 10 C24 100nF 1 2 3 4 5 SJ5 SHUNT DS8500 MASTER RTS XTAL1 XTAL2 DGND XCEN 3V3 20 19 18 17 16 21 HRXD_M DIN DOUT DGND PIN17 DGND SJ1 SHUNT XMIT_ENABLE_N_M Y2 1 2 3.6864MHz C28 15pF NP0 C29 15pF NP0 INVERTING RELAY DRIVER TRANSMIT/RECEIVE OPTICAL RELAY Q1 3 R10 3V3 R15 10K 8 4 3V3 IN+ IN- OUT NC1 SHDN NC5 VEE VCC 5 4 S C32 33nF 3 2 LOOP POWER 2 T1 MET-26 D U6 MAX4166EUA+ RAW_FSK_M CAPACITIVE VOLTAGE DIVIDER J4 ISOLATION TRANSFORMER 12.4K D C30 33nF SJ7 SHUNT C31 2.2uF 1 6 2 5 3 4 6 R13 1 5 3V3 100K PRI SEC D7 SMCJ36CA R16 10 C33 R14 249 J5 R LOAD LOOP MASTER MASTER_PLUS 1 MASTER_MINUS 2 2.2uF 7 C34 C35 100nF 1uF SJ8 SHUNT 1 2 1 R12 6 10K Q2 TLP3545(F) G FSK BUFFER AMP R11 +24VDC_LOOP_PWR 49.9 1 3V3 3 S FDV304P 1 2 G 2 D 1 J6 R18 100K INPUT REFERENCE R19 1K TP6 GND Black TP7 GND Black 1 1 C36 C37 1uF 100nF MASTER/FIELD LOOP 2 R17 1K MASTER_FIELD_LOOP + - UART INTERFACE SJ9 SHUNT SJ10 SHUNT SJ11 SHUNT SJ12 SHUNT 3V3 2 RXD F JP9 1 2 OCD F HTXD_F JP10 1 2 TXD F HRTS_F JP11 1 2 RTS F R20 100K EP_GND 3V3 3V3 1 2 3 4 5 DVDD DVDD OCD_FLD DVDD DVDD DGND RST OCD AGND FSKIN U7 DS8500-JND+ REF FSKOUT AVDD 15 14 13 12 11 FSK BANDPASS FILTER 3V3 240Hz HiPass JP12 1 FSKI_FLD REF_FLD FSKO_FLD AVDD_FLD 2 FSK IN F C38 R23 JP13 1 C43 RTS XTAL1 XTAL2 DGND XCEN C42 100nF SJ13 SHUNT DS8500 FIELD DEVICE 2 RAW FSK F C40 C44 100nF 100nF 2.2nF NPO 221K R22 301K 10.1KHz LoPass R21 1.58K C39 10nF NPO 1uF SJ14 SHUNT 6 7 8 9 10 C41 100nF 20 19 18 17 16 21 JP8 1 DIN DOUT DGND PIN17 DGND HRXD_F HOCD_F XMIT_ENABLE_N_FLD Y3 1 2 3.6864MHz C45 15pF NP0 C46 15pF NP0 RAW_FSK_FLD LOOP CURRENT SELECT NC_1 NC_3 NC_7 8 5 C48 100nF 1 3 7 SW2 LOOP CURRENT SET ALL OFF 4mA ALL ON 20mA MASTER_FIELD_LOOP SJ15 SHUNT LOOP CURRENT SET ALL OFF = 4mA POS 1 ON = 8mA POS 1,2 ON = 12mA POS 1-3 ON = 16mA POS 1-4 ON = 20mA J7 R24 1K 2 C52 33nF R26 1.24M R27 1.24M R28 1.24M R29 1.24M 3 1 R31 CAPACITIVE VOLTAGE DIVIDER FIELD/MASTER CURRENT REGULATOR ERROR AMPLIFIER C49 1nF 3V3 U9 MAX9620AXK+T R25 1.24M 511K GND VDD INOUT 5 4 REVERSE POLARITY PROTECTION C50 1uF C51 100nF R30 Q3 LOOP FIELD FIELD_PLUS FIELD_MINUS D 4 D 2 1 G 300 J8 D8 1N5819HW-7-F PASS TRANSISTOR 3 S NDT014L IN+ SJ16 SHUNT 3 C C53 33nF B R33 300 MODULATION GAIN SET 0.511M ohm loop current = 2mA per 0.5V R36 20K 0.1% TP8 GND Black 1 TP9 GND Black 1 1 VREF_2V5 1 2 3 4 GND 6 2 I.C._2 I.C._1 C47 100nF 4 OUT LOOP FEEDBACK GAIN SET Rsense 10 ohms Rfeedback 20K ohms Loop current = 1mA per 0.5uA summing node current 1 R32 1K C54 2.2nF 50V 2 E Q4 MMBT3904 LOOP CURRENT LIMITER R34 24.3 LIMIT SENSE RESISTOR 1 IN 8 7 6 5 U8 MAX6133A25+ 2 J9 D9 SMCJ36CA LOOP RETURN 2 4mA 4mA 4mA 4mA VOLTAGE REFERENCE 3V3 R35 100 LOOP_RET R37 10 0.1% LOOP SENSE RESISTOR 1 2 1 2 + - NOTES: 1. ALL MEASUREMENTS ARE IN INCHES. 2. THE PWB SHALL BE FABRICATED TO IPC-6012, CLASS 2 AND WORKMANSHIP SHALL CONFORM TO IPC-A-600, CLASS 2, CURRENT REV. DIMENSIONING AND TOLERANCE OF PRINTED WIRING BOARD SHALL BE PER IPC-D-300 (CURRENT REV). 3. BOARD MATERIAL TO BE MULTI-FUNCTIONAL FR-4 EXPOXY GLASS LIMINATE, SILKSCREEN TOP AND SHALL MEET OR EXCEED MIL-P-13949. COLOR - NATURAL. SOLDER MASK TOP 4. BOARD MATERIAL AND CONSTRUCTION TO BE U.L. APPROVED AND MARKED ON 1 OZ. FINISHED COPPER 5. MINIMUM COPPER WALL THICKNESS OF PLATED-THRU HOLES TO BE.001 INCHES PREPREG 0.0039" 6. OVERALL BOARD THICKNESS TO BE .062 +/- 10% AND APPLIES AFTER ALL THE FINISHED BOARD. LAYER 1 TOP LAYER 2 GND PLANE LAMINATION AND PLATING PROCESSES. MEASURED FROM COPPER TO COPPER. 0.5 OZ. COPPER 7. MAX WARP AND TWIST TO BE .01 INCHES PER INCH. CORE 0.047" LAYER 3 PWR PLANE 8. BOARD MUST BE ELECTRICALLY TESTED USING THE SUPPLIED IPC-D -356 NETLIST. 9. PLATE ALL EXPOSED AREAS WITH ELECTROLESS IMMERSION GOLD, NICKEL 100 MICROINCHES THK. GOLD 2-6 0.5 OZ. COPPER MICROINCHES THK MIN. PREPREG 0.0039" LAYER 4 BOTTOM PROCESS NOTES: 1 OZ. FINISHED COPPER 1. APPLY LPI SOLDERMASK, BOTH SIDES, OVER BARE COPPER (SMOBC) COLOR: GREEN SOLDERMASK SHALL CONFORM TO IPC-SM-840, CLASS H, AND CURRENT REVISION. VIAS SHALL BE TENTED OR SOLDER MASK BOTTOM CLEARED BY SOLDERMASK PER ARTWORK. FABRICATION VENDOR IS ALLOWED TO ADJUST SOLDERMASK FEATURES SILKSCREEN BOTTOM AS NEEDED AS LONG AS SOLDERMASK DAMS ARE MAINTAINED BETWEEN ALL SMD PADS. 2. SILKSCREEN BOTH SIDES USING LPI SILKSCREEN, COLOR: WHITE. PLACE ANY VENDOR SERIAL NUMBER ASSOCIATED TO PANEL ON BOTTM SIDE OF BOARD. 4.50 BMP4 U3 42 41 8 40 9 2 C1 C C3 1 R20 R4 C7 1C72 1 1 2 C41 R3 3 1 C57 4 C56 2 R24 C38 R21 C47 C47 R21 1 2 C40 C38 1 2 C44 C40 R23 C44 C52 1 2 C52 4 5 3 6 2 7 8 R37 R35 1 4mA R2 A R33 R24 C49 R30 2 2 C54 C54 2 C25 C26 1 2 C26 1 2 1 2 C35 1 C34 2 3 4 1 2 C35 1 2 C34 7 6 5 BMP1 2 1 3 1 2 C24 8 1 1 2 C51 4mA 1 2 R29 R35 1 Q4 Q4 3 2 R30 1 2 R25 1 2 R33 1 2 R28 1 2 1 1R22 R38 2 1 2 R36 1 2 R27 SW2 SW2 1 2 R26 R28 R27 R26 R29 1 GND R32 R34 R32 D9 J8 J8 TP9 2 1 1 J5 J5 R14 1 2 R34 2 FIELD C51 1 LOOP R37 C50 U9 1 MASTER C39 U8 1 2 C50 4 3 4 2 3 U9 5 2 2 LOOP U8 R25 1 J9 1 1 2 C39 1 2 C49 4mA C48 4mA C48 R36 R38 2 2 1 1 R32 1 C53 TP5 RETURN 2 C25 L3 2 1 2 C57 2 C56 1 LOOP 1 1 C55 R4 5 R22 2 R7 R20 1 2 C46 C45 L3 L2 2 LOOP PWR SEL A C1 9 1 2 C2 C3 1 2 C17 1 2 C18 1 2 C19 1 2 C20 1 2 C15 C15 C20 C19 C18 C17 1 R6 2 C59 R6 1 C55 L2 C59 2 Y1 1 2 C24 L4 2 1 C10 1 2 Y1 1 2 C23 C43 C9 R5 R5 6 R22 R31 1 7 2 2 MUST BE GALVANICALLY POWER JP12 JP12 1 2 R23 2 8 1 R31 1 A C42 33 C9 C10 POWER J2 C53 1 R16 C42 C41 34 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 1 2 C14 ALL ON 20mA 1 C21 1 2 1 35 1 2 C13 C2 2 1 38 37 36 1 2 C27 U1 C14 C13 ALL OFF 4mA 2 1 2 R16 2 2 1 39 16 L1 1 L4 2 C27 C23 5 7 14 C28 4 3 44 43 6 C11 J3 J3 1 2 C29 1 47 46 45 4 5 2 1 1 2 C30 6 2 3 15 L1 1 48 U3 2 13 C11 BMP4 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 1 U4 12 16 C30 F1 F1 2 11 1 17 R11 L5 1 10 18 2 R12 R11 L5 19 1 R12 D1 20 15 14 EXT LOOP 1 6 5 4 D7 13 FSK IN F 1 R LOAD 12 C43 LOOP CURRENT SET C33 2 11 2 1 2 3 1 C33 10 1 LOOP C31 GND C46 D5 24V TP4 1 U7 U7 JP13 J2 1 C22 R7 9 U2 8 Y3 21 A 7 A D5 2 D6 C 1 C 2 2 2 2 6 1 READY ACTIVE 1 4 2 6 R13 R1 C45 DS8500 Y3 3 1 R13 1 TP7 FIELD DEVICE D6 5 R10 1 R1 2 JP11 2 2 2 T1 2 1 1 5 4 GND U2 J4 1 JP10 1 1 C21 T1 TP8 JP14 JP14 2 ISOLATED 1 2 C31 Q2 R9 R15 1 2 R15 2 1 1 2 C22 U6 1 2 2 U6 R8 2 1 1 2 3 Q2 C32 JP9 TXD F 2 TP1 1 1R18 2 1 2 C32 R9 1 1 2 R19 1R82 4 2 R18 JP8 2 RAW FSK F 3 3 1 2 C36 1 2 C37 2 1 2 JP6 2 2 1 JP7 R17 1 OCD F 2 1 JP1 1 1 1 FSK IN M Q1 Q1 R17 C36 C37 R19 3 READY 2 15 14 2 13 12 11 ACTIVE A RXD F 2 16 10 A D4 D3 1 2 1 17 9 C 1 18 21 8 C D3 1 RTS F 1 C5 19 7 RAW FSK M C5 20 6 2 C29 1 TP2 5 2 1 3 4 5 2 D4 VBUS 1 TP3 6 1 24V LOOP POWER1 U5 U5 H3 POWER 9 2 1 1 Y2 Y2 1 2 R10 2 MASTER 2 GND 1 7 1 RTS M 1 +3V3 1 C16 C28 DS8500 1 BMP3 1 2 C16 1 GND 2 1C12 2 DS8500 EV KIT TP6 1 2 C12 8 JP5 BMP3 6 TXD M A 1 7 JP4 D2 C 6 8 OCD M D2 1 9 JP3 4 5 RXD M 3 4 JP2 JP2 2 3 7 2 10 J1 J1 5 1 1 8 MICRO USB/POWER PCB-00050-2-0 [REV 2] H4 Q3 A C C BMP1 2 D7 Q3 R14 C 2 1 SN: 0 DS8500 EV KIT PASTE TEMPLATE SOLDER SILKSCREEN ASSEMBLY DRILL LAYER MASK 1MASK 4 -DRAWING COMPONENT SOLDER BOTTOM TOP BOTTOM TOP BOTTOM TOP SIDE SIDE (BOTTOM) (TOP) 02-19-2015 BMP2 1 4 FIELD/MASTER PCB-00050-2-0 1 PCA- D8 D8 1 MASTER/FIELD LOOP J7 BMP2 D9 2 0 J6 1 1 H1 H2 3.50 NOTES: 1. ALL MEASUREMENTS ARE IN INCHES. 2. THE PWB SHALL BE FABRICATED TO IPC-6012, CLASS 2 AND WORKMANSHIP SHALL CONFORM TO IPC-A-600, CLASS 2, CURRENT REV. DIMENSIONING AND TOLERANCE OF PRINTED WIRING BOARD SHALL BE PER IPC-D-300 (CURRENT REV). 3. BOARD MATERIAL TO BE MULTI-FUNCTIONAL FR-4 EXPOXY GLASS LIMINATE, SILKSCREEN TOP AND SHALL MEET OR EXCEED MIL-P-13949. COLOR - NATURAL. SOLDER MASK TOP 4. BOARD MATERIAL AND CONSTRUCTION TO BE U.L. APPROVED AND MARKED ON 1 OZ. FINISHED COPPER 5. MINIMUM COPPER WALL THICKNESS OF PLATED-THRU HOLES TO BE.001 INCHES PREPREG 0.0039" 6. OVERALL BOARD THICKNESS TO BE .062 +/- 10% AND APPLIES AFTER ALL THE FINISHED BOARD. LAYER 1 TOP LAYER 2 GND PLANE LAMINATION AND PLATING PROCESSES. MEASURED FROM COPPER TO COPPER. 0.5 OZ. COPPER 7. MAX WARP AND TWIST TO BE .01 INCHES PER INCH. CORE 0.047" LAYER 3 PWR PLANE 8. BOARD MUST BE ELECTRICALLY TESTED USING THE SUPPLIED IPC-D -356 NETLIST. 9. PLATE ALL EXPOSED AREAS WITH ELECTROLESS IMMERSION GOLD, NICKEL 100 MICROINCHES THK. GOLD 2-6 0.5 OZ. COPPER MICROINCHES THK MIN. PREPREG 0.0039" LAYER 4 BOTTOM PROCESS NOTES: 1 OZ. FINISHED COPPER 1. APPLY LPI SOLDERMASK, BOTH SIDES, OVER BARE COPPER (SMOBC) COLOR: GREEN SOLDERMASK SHALL CONFORM TO IPC-SM-840, CLASS H, AND CURRENT REVISION. VIAS SHALL BE TENTED OR SOLDER MASK BOTTOM CLEARED BY SOLDERMASK PER ARTWORK. FABRICATION VENDOR IS ALLOWED TO ADJUST SOLDERMASK FEATURES SILKSCREEN BOTTOM AS NEEDED AS LONG AS SOLDERMASK DAMS ARE MAINTAINED BETWEEN ALL SMD PADS. 2. SILKSCREEN BOTH SIDES USING LPI SILKSCREEN, COLOR: WHITE. PLACE ANY VENDOR SERIAL NUMBER ASSOCIATED TO PANEL ON BOTTM SIDE OF BOARD. 4.50 BMP4 U3 42 41 8 40 9 2 C1 C C3 1 R20 R4 C7 1C72 1 1 2 C41 R3 3 1 C57 4 C56 2 R24 C38 R21 C47 C47 R21 1 2 C40 C38 1 2 C44 C40 R23 C44 C52 1 2 C52 4 5 3 6 2 7 8 R37 R35 1 4mA R2 A R33 R24 C49 R30 2 2 C54 C54 2 C25 C26 1 2 C26 1 2 1 2 C35 1 C34 2 3 4 1 2 C35 1 2 C34 7 6 5 BMP1 2 1 3 1 2 C24 8 1 1 2 C51 4mA 1 2 R29 R35 1 Q4 Q4 3 2 R30 1 2 R25 1 2 R33 1 2 R28 1 2 1 1R22 R38 2 1 2 R36 1 2 R27 SW2 SW2 1 2 R26 R28 R27 R26 R29 1 GND R32 R34 R32 D9 J8 J8 TP9 2 1 1 J5 J5 R14 1 2 R34 2 FIELD C51 1 LOOP R37 C50 U9 1 MASTER C39 U8 1 2 C50 4 3 4 2 3 U9 5 2 2 LOOP U8 R25 1 J9 1 1 2 C39 1 2 C49 4mA C48 4mA C48 R36 R38 2 2 1 1 R32 1 C53 TP5 RETURN 2 C25 L3 2 1 2 C57 2 C56 1 LOOP 1 1 C55 R4 5 R22 2 R7 R20 1 2 C46 C45 L3 L2 2 LOOP PWR SEL A C1 9 1 2 C2 C3 1 2 C17 1 2 C18 1 2 C19 1 2 C20 1 2 C15 C15 C20 C19 C18 C17 1 R6 2 C59 R6 1 C55 L2 C59 2 Y1 1 2 C24 L4 2 1 C10 1 2 Y1 1 2 C23 C43 C9 R5 R5 6 R22 R31 1 7 2 2 MUST BE GALVANICALLY POWER JP12 JP12 1 2 R23 2 8 1 R31 1 A C42 33 C9 C10 POWER J2 C53 1 R16 C42 C41 34 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 1 2 C14 ALL ON 20mA 1 C21 1 2 1 35 1 2 C13 C2 2 1 38 37 36 1 2 C27 U1 C14 C13 ALL OFF 4mA 2 1 2 R16 2 2 1 39 16 L1 1 L4 2 C27 C23 5 7 14 C28 4 3 44 43 6 C11 J3 J3 1 2 C29 1 47 46 45 4 5 2 1 1 2 C30 6 2 3 15 L1 1 48 U3 2 13 C11 BMP4 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 1 U4 12 16 C30 F1 F1 2 11 1 17 R11 L5 1 10 18 2 R12 R11 L5 19 1 R12 D1 20 15 14 EXT LOOP 1 6 5 4 D7 13 FSK IN F 1 R LOAD 12 C43 LOOP CURRENT SET C33 2 11 2 1 2 3 1 C33 10 1 LOOP C31 GND C46 D5 24V TP4 1 U7 U7 JP13 J2 1 C22 R7 9 U2 8 Y3 21 A 7 A D5 2 D6 C 1 C 2 2 2 2 6 1 READY ACTIVE 1 4 2 6 R13 R1 C45 DS8500 Y3 3 1 R13 1 TP7 FIELD DEVICE D6 5 R10 1 R1 2 JP11 2 2 2 T1 2 1 1 5 4 GND U2 J4 1 JP10 1 1 C21 T1 TP8 JP14 JP14 2 ISOLATED 1 2 C31 Q2 R9 R15 1 2 R15 2 1 1 2 C22 U6 1 2 2 U6 R8 2 1 1 2 3 Q2 C32 JP9 TXD F 2 TP1 1 1R18 2 1 2 C32 R9 1 1 2 R19 1R82 4 2 R18 JP8 2 RAW FSK F 3 3 1 2 C36 1 2 C37 2 1 2 JP6 2 2 1 JP7 R17 1 OCD F 2 1 JP1 1 1 1 FSK IN M Q1 Q1 R17 C36 C37 R19 3 READY 2 15 14 2 13 12 11 ACTIVE A RXD F 2 16 10 A D4 D3 1 2 1 17 9 C 1 18 21 8 C D3 1 RTS F 1 C5 19 7 RAW FSK M C5 20 6 2 C29 1 TP2 5 2 1 3 4 5 2 D4 VBUS 1 TP3 6 1 24V LOOP POWER1 U5 U5 H3 POWER 9 2 1 1 Y2 Y2 1 2 R10 2 MASTER 2 GND 1 7 1 RTS M 1 +3V3 1 C16 C28 DS8500 1 BMP3 1 2 C16 1 GND 2 1C12 2 DS8500 EV KIT TP6 1 2 C12 8 JP5 BMP3 6 TXD M A 1 7 JP4 D2 C 6 8 OCD M D2 1 9 JP3 4 5 RXD M 3 4 JP2 JP2 2 3 7 2 10 J1 J1 5 1 1 8 MICRO USB/POWER PCB-00050-2-0 [REV 2] H4 Q3 A C C BMP1 2 D7 Q3 R14 C 2 1 SN: 0 DS8500 EV KIT PASTE TEMPLATE SOLDER SILKSCREEN ASSEMBLY DRILL LAYER MASK 1MASK 4 -DRAWING COMPONENT SOLDER BOTTOM TOP BOTTOM TOP BOTTOM TOP SIDE SIDE (BOTTOM) (TOP) 02-19-2015 BMP2 1 4 FIELD/MASTER PCB-00050-2-0 1 PCA- D8 D8 1 MASTER/FIELD LOOP J7 BMP2 D9 2 0 J6 1 1 H1 H2 3.50 PCB-00050-2-0 [REV 2] H4 H3 D2 J1 C12 JP8 JP2 JP3 JP9 C16 TP3 TP2 TP1 JP4 JP10 JP5 JP11 TP6 JP14 R6 R20 C28 D3 U7 C46 C45 Y3 D6 D4 C29 Y2 TP7 U5 D5 JP1 U2 Q1 JP12 JP6 R35 C33 J5 R14 D9 J8 R34 R32 C40 C38 R21 Q4 C49 C54 D7 TP9 R37 R33 J9 R24 J4 R16 C50 U9 C31 T1 C44 U8 R25 R15 TP8 C47 TP5 R22 C39 C48 R7 TP4 R23 C51 C23 C22 U6 C52 R31 SW2 R13 Q2 R12 R11 C32 R9 C21 R18 C27 C30 R19 R8 C53 R10 JP13 J2 C36 C37 R30 JP7 R17 Q3 J6 J7 D8 H1 H2 DS8500 EV KIT PCB-00050-2-0 LAYER 1 -DRAWING ASSEMBLY COMPONENT TOP SIDE 02-19-2015 (TOP) NOTES: 1. ALL MEASUREMENTS ARE IN INCHES. 2. THE PWB SHALL BE FABRICATED TO IPC-6012, CLASS 2 AND WORKMANSHIP SHALL CONFORM TO IPC-A-600, CLASS 2, CURRENT REV. DIMENSIONING AND TOLERANCE OF PRINTED WIRING BOARD SHALL BE PER IPC-D-300 (CURRENT REV). 3. BOARD MATERIAL TO BE MULTI-FUNCTIONAL FR-4 EXPOXY GLASS LIMINATE, SILKSCREEN TOP AND SHALL MEET OR EXCEED MIL-P-13949. COLOR - NATURAL. SOLDER MASK TOP 4. BOARD MATERIAL AND CONSTRUCTION TO BE U.L. APPROVED AND MARKED ON 1 OZ. FINISHED COPPER 5. MINIMUM COPPER WALL THICKNESS OF PLATED-THRU HOLES TO BE.001 INCHES PREPREG 0.0039" 6. OVERALL BOARD THICKNESS TO BE .062 +/- 10% AND APPLIES AFTER ALL THE FINISHED BOARD. LAYER 1 TOP LAYER 2 GND PLANE LAMINATION AND PLATING PROCESSES. MEASURED FROM COPPER TO COPPER. 0.5 OZ. COPPER 7. MAX WARP AND TWIST TO BE .01 INCHES PER INCH. CORE 0.047" LAYER 3 PWR PLANE 8. BOARD MUST BE ELECTRICALLY TESTED USING THE SUPPLIED IPC-D -356 NETLIST. 9. PLATE ALL EXPOSED AREAS WITH ELECTROLESS IMMERSION GOLD, NICKEL 100 MICROINCHES THK. GOLD 2-6 0.5 OZ. COPPER MICROINCHES THK MIN. PREPREG 0.0039" LAYER 4 BOTTOM PROCESS NOTES: 1 OZ. FINISHED COPPER 1. APPLY LPI SOLDERMASK, BOTH SIDES, OVER BARE COPPER (SMOBC) COLOR: GREEN SOLDERMASK SHALL CONFORM TO IPC-SM-840, CLASS H, AND CURRENT REVISION. VIAS SHALL BE TENTED OR SOLDER MASK BOTTOM CLEARED BY SOLDERMASK PER ARTWORK. FABRICATION VENDOR IS ALLOWED TO ADJUST SOLDERMASK FEATURES SILKSCREEN BOTTOM AS NEEDED AS LONG AS SOLDERMASK DAMS ARE MAINTAINED BETWEEN ALL SMD PADS. 2. SILKSCREEN BOTH SIDES USING LPI SILKSCREEN, COLOR: WHITE. PLACE ANY VENDOR SERIAL NUMBER ASSOCIATED TO PANEL ON BOTTM SIDE OF BOARD. 4.50 BMP3 9 8 D2 C A H3 A POWER 5 9 8 7 6 1 4 3 C 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 F1 5 2 2 48 U3 1 2 U4 1 6 L5 3 47 44 43 6 1 RXD F 1 2 JP8 OCD F 1 2 JP9 TXD F 1 2 JP10 1 2 JP11 42 7 41 8 40 9 10 1 2 C2 1 2 C17 2 C9 2 2 1 C10 1 2 Y1 L4 2 2 1 1 2 C18 U1 1 2 C19 1 2 C14 1 2 C20 C3 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 1 2 C13 1 2 C15 2 2 35 34 16 L1 1 1 36 14 15 4 2 37 13 3 1 38 12 2 TP1 2 1 39 11 1 2 1 1 2 TP2 5 1 RTS M C11 J3 46 45 4 5 VBUS 1 TP3 6 JP5 GND 1 9 TXD M 1 2 C16 1 JP4 +3V3 DS8500 EV KIT 7 OCD M 1 JP3 2 1C12 2 8 RXD M 1 2 JP2 1 D1 1 C1 1 4 6 3 7 2 10 1 R1 2 1 4 3 2 5 1 J1 1 BMP4 MICRO USB/POWER PCB-00050-2-0 [REV 2] H4 RTS F 2 1 1 C5 R4 1C72 1 1 2 C57 2 3 4 1 C56 2 4mA 4mA 4mA 4mA R38 2 2 1 1 1 2 C41 1 2 C40 1R22 1 5 C53 6 R22 3.50 C25 1 2 C26 2 1 C47 4 5 3 6 2 7 8 1 1 2 C51 R30 1 2 C49 3 6 4 5 R37 R35 A 1 2 R16 R24 1 2 R33 1 R32 2 Q4 1 C54 2 2 D9 J8 3 1 2 R34 3 7 A 1 2 1 1 J5 R14 1 GND 2 FIELD 2 LOOP 1 6 5 4 D7 TP9 2 MASTER 2 LOOP 1 R LOAD 1 1 1 2 2 3 1 LOOP CURRENT SET 1 R21 C48 1 2 R25 1 2 C50 1 2 R36 2 1 2 R29 4 1 8 1 2 R28 3 4 2 3 1 2 J9 5 J4 C33 2 U8 1 1 1 2 C31 U9 1 2 1 2 C34 2 6 1 2 R27 2 1 SW2 1 2 R26 1 1 2 C35 R7 TP5 RETURN 2 2 5 4 LOOP 1 1 MUST BE GALVANICALLY POWER 2 1 LOOP 2 2 TP4 1 2 C39 1 1 1 7 2 C38 1 R32 2 8 1 R31 2 C21 JP12 1 2 R23 1 POWER 1 2 C44 1 2 C52 ALL ON 20mA 2 ALL OFF 4mA 1 L3 2 C55 R6 R20 1 2 C46 C45 1 1 2 C24 L2 2 C28 C59 1 R5 LOOP PWR SEL 2 1 2 C23 2 1 1 2 C27 2 1 2 C29 16 2 1 2 C30 1 17 1 EXT LOOP 1 R11 18 13 12 11 1 R12 19 10 2 ISOLATED R13 15 20 14 9 FSK IN F 24V 1 2 R15 T1 8 C43 U2 JP13 J2 1 1 2 C22 U6 TP8 GND 21 2 1 2 3 Q2 Y3 7 1 2 C32 A 2 1 1R18 2 R9 A D5 1 2 1 2 R19 1 2 R10 1R82 D6 C RAW FSK F 3 3 1 2 C36 1 2 C37 C 2 GND 2 JP6 2 2 1 JP7 2 1 JP1 1 U7 1 1 1 FSK IN M 1 READY ACTIVE 2 2 15 14 2 13 12 11 READY 2 16 10 ACTIVE A 2 6 1 17 9 A D4 D3 4 18 21 8 C 1 3 19 7 C Q1 R17 DS8500 5 20 6 2 RAW FSK M TP7 FIELD DEVICE 2 1 2 1 3 4 5 2 Y2 JP14 24V LOOP POWER1 U5 1 1 2 1 1 1 1 MASTER DS8500 1 GND C42 TP6 1 2 2 A C C BMP1 2 C PCA- FIELD/MASTER 1 SN: 0 DS8500 EV KIT PCB-00050-2-0 PASTE TEMPLATE SOLDER SILKSCREEN ASSEMBLY DRILL LAYER MASK 1MASK 4 -DRAWING COMPONENT SOLDER BOTTOM TOP BOTTOM TOP BOTTOM TOP SIDE SIDE (BOTTOM) (TOP) 02-19-2015 1 BMP2 2 4 2 MASTER/FIELD LOOP D8 J7 1 1 H1 0 J6 1 Q3 1 H2 DS8500 EV KIT PCB-00050-2-0 LAYER 2 - GND 02-19-2015 PLANE DS8500 EV KIT PCB-00050-2-0 LAYER 3 - PWR 02-19-2015 PLANE ASSEMBLY LAYER 4 -DRAWING SOLDER BOTTOM SIDE (BOTTOM) PCB-00050-2-0 DS8500 EV 02-19-2015 KIT BMP2 BMP1 R36 R29 R28 R27 R26 C34 C35 R38 C56 R4 C43 R2 C26 C7 C57 R5 R3 C41 C24 C55 C42 L2 C25 L3 C59 C5 L4 Y1 C17 C18 C19 C20 C15 U1 C3 C2 L1 C9 C10 C14 C13 C11 L5 C1 D1 U4 J3 U3 F1 R1 BMP3 BMP4 MICRO USB/POWER H4 D2 H3 POWER J1 C12 RXD F JP8 OCD F JP9 TXD M TXD F JP10 RTS M RTS F JP11 VBUS TP1 JP14 FSK IN F JP12 ALL OFF 4mA ALL ON 20mA R31 R7 24V TP4 TP5 MUST BE GALVANICALLY ISOLATED R15 LOOP POWER LOOP RETURN U8 LOOP MASTER J5 LOOP FIELD R14 D9 J8 GND R34 R32 Q4 C54 D7 TP9 R37 T1 R LOAD R35 GND R16 LOOP CURRENT SET C33 C49 J9 R24 J4 R22 C50 U9 C31 TP8 R23 C39 C48 POWER C40 JP13 EXT LOOP C38 J2 R9 C22 U6 GND RAW FSK F R33 R13 Q2 R12 R11 C32 Y3 U2 4mA R18 C23 R19 R8 JP1 C21 R10 C27 C30 C36 C37 D5 R21 JP6 JP7 R17 D6 READY C44 LOOP PWR SEL FSK IN M RAW FSK M Q1 ACTIVE C47 READY U7 C52 ACTIVE R6 D4 D3 DS8500 SW2 C28 C29 Y2 TP7 FIELD DEVICE 24V LOOP POWER U5 R20 MASTER DS8500 GND C51 TP6 TP2 C46 C45 TP3 R30 JP5 GND C16 4mA JP4 DS8500 EV KIT R25 OCD M 4mA JP3 +3V3 4mA RXD M C53 JP2 Q3 J6 H1 MASTER/FIELD LOOP DS8500 EV FIELD/MASTER KIT PCB-00050-2-0 ASSEMBLY DRAWING D8 J7 02-19-2015 TOP H2 ASSEMBLY DRAWING BOTTOM PCB-00050-2-0 DS8500 EV 02-19-2015 KIT BMP2 PCA- SN: BMP1 R36 R29 R28 R27 R26 C34 C35 R38 C56 R4 C43 R2 C26 C7 C57 R5 R3 C41 C24 C55 C42 L2 C25 L3 C59 C5 L4 Y1 C17 C18 C19 C20 C15 U1 C3 C2 L1 C9 C10 C14 C13 C11 L5 C1 D1 U4 J3 U3 F1 R1 BMP3 BMP4 NOTES: 1. ALL MEASUREMENTS ARE IN INCHES. 2. THE PWB SHALL BE FABRICATED TO IPC-6012, CLASS 2 AND WORKMANSHIP SHALL CONFORM TO IPC-A-600, CLASS 2, CURRENT REV. DIMENSIONING AND TOLERANCE OF PRINTED WIRING BOARD SHALL BE PER IPC-D-300 (CURRENT REV). 3. BOARD MATERIAL TO BE MULTI-FUNCTIONAL FR-4 EXPOXY GLASS LIMINATE, SILKSCREEN TOP AND SHALL MEET OR EXCEED MIL-P-13949. COLOR - NATURAL. SOLDER MASK TOP 4. BOARD MATERIAL AND CONSTRUCTION TO BE U.L. APPROVED AND MARKED ON 1 OZ. FINISHED COPPER 5. MINIMUM COPPER WALL THICKNESS OF PLATED-THRU HOLES TO BE.001 INCHES PREPREG 0.0039" 6. OVERALL BOARD THICKNESS TO BE .062 +/- 10% AND APPLIES AFTER ALL THE FINISHED BOARD. LAYER 1 TOP LAYER 2 GND PLANE LAMINATION AND PLATING PROCESSES. MEASURED FROM COPPER TO COPPER. 0.5 OZ. COPPER 7. MAX WARP AND TWIST TO BE .01 INCHES PER INCH. CORE 0.047" LAYER 3 PWR PLANE 8. BOARD MUST BE ELECTRICALLY TESTED USING THE SUPPLIED IPC-D -356 NETLIST. 9. PLATE ALL EXPOSED AREAS WITH ELECTROLESS IMMERSION GOLD, NICKEL 100 MICROINCHES THK. GOLD 2-6 0.5 OZ. COPPER MICROINCHES THK MIN. PREPREG 0.0039" LAYER 4 BOTTOM PROCESS NOTES: 1 OZ. FINISHED COPPER 1. APPLY LPI SOLDERMASK, BOTH SIDES, OVER BARE COPPER (SMOBC) COLOR: GREEN SOLDERMASK SHALL CONFORM TO IPC-SM-840, CLASS H, AND CURRENT REVISION. VIAS SHALL BE TENTED OR SOLDER MASK BOTTOM CLEARED BY SOLDERMASK PER ARTWORK. FABRICATION VENDOR IS ALLOWED TO ADJUST SOLDERMASK FEATURES SILKSCREEN BOTTOM AS NEEDED AS LONG AS SOLDERMASK DAMS ARE MAINTAINED BETWEEN ALL SMD PADS. 2. SILKSCREEN BOTH SIDES USING LPI SILKSCREEN, COLOR: WHITE. PLACE ANY VENDOR SERIAL NUMBER ASSOCIATED TO PANEL ON BOTTM SIDE OF BOARD. 4.50 DRILL CHART: TOP to BOTTOM ALL UNITS ARE IN MILS FIGURE 3.50 0 0 DS8500 EV PCB-00050-2-0 DRILL TEMPLATE KIT 02-19-2015 SIZE TOLERANCE PLATED 12.0 +3.0/-3.0 PLATED QTY 12 12.0 +3.0/-3.0 PLATED 116 32.0 +3.0/-3.0 PLATED 10 38.0 +3.0/-3.0 PLATED 14 42.0 +3.0/-3.0 PLATED 38 45.0 +3.0/-3.0 PLATED 3 50.0 +3.0/-3.0 PLATED 6 65.0 +3.0/-3.0 PLATED 9 125.0 +3.0/-3.0 PLATED 4 40.0 +3.0/-3.0 NON-PLATED 3 35.0x28.0 +3.0/-3.0 PLATED 2 52.0x25.0 +3.0/-3.0 PLATED 2 DS8500 EV PCB-00050-2-0 PASTE MASK KIT 02-19-2015 TOP DS8500 EV KIT PCB-00050-2-0 PASTE MASK 02-19-2015 BOTTOM MICRO USB/POWER H4 D2 H3 POWER J1 C12 RXD F JP8 OCD F JP9 TXD M TXD F JP10 RTS M RTS F JP11 JP14 MASTER C28 DS8500 U2 D3 FSK IN M C30 R20 FSK IN F RAW FSK F JP12 JP13 EXT ALL OFF 4mA ALL ON 20mA LOOP C21 POWER J2 C22 4mA R8 C53 C48 TP4 MUST BE GALVANICALLY TP5 ISOLATED R15 LOOP POWER LOOP C39 C47 24V R7 R22 R31 RETURN SW2 R12 R11 C46 D5 U6 R13 U8 R25 C50 C51 C31 J4 T1 C33 TP9 LOOP MASTER LOOP FIELD R37 R33 R24 C49 R30 LOOP CURRENT SET R LOAD GND U9 J9 R35 R16 Q2 JP1 R9 C27 C23 R10 R18 C32 TP8 JP6 JP7 R17 C36 C37 R19 READY R23 C29 Q1 GND ACTIVE C38 READY Y3 R21 LOOP PWR SEL ACTIVE R6 Y2 TP7 C45 DS8500 U7 D6 D4 RAW FSK M FIELD DEVICE 24V LOOP POWER U5 GND C52 TP6 TP1 TP2 C40 JP5 TP3 C16 VBUS C44 JP4 GND +3V3 DS8500 EV KIT 4mA OCD M 4mA RXD M 4mA JP2 JP3 GND Q4 C54 R34 R32 J5 J8 Q3 D7 R14 D9 J6 H1 J7 MASTER/FIELD LOOP DS8500 EV PCB-00050-2-0 SILKSCREEN D8 FIELD/MASTER KIT 02-19-2015 TOP H2 SILKSCREEN BOTTOM PCB-00050-2-0 02-19-2015 DS8500 EV KIT BMP2 PCA- SN: BMP1 R29 R36 R28 R27 R26 C34 C35 R38 C56 R4 C43 R2 C26 C57 C7 C41 R5 R3 C42 C24 C25 L3 C59 L2 C15 C20 C19 C18 C17 L4 U1 C5 C55 Y1 C3 C2 C9 C10 C14 C13 L1 C11 L5 J3 U4 D1 F1 R1 U3 C1 BMP3 BMP4 DS8500 EV PCB-00050-2-0 SOLDER MASK KIT 02-19-2015 TOP DS8500 EV KIT PCB-00050-2-0 SOLDER MASK 02-19-2015 BOTTOM Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Maxim Integrated: DS8500-KIT#