BAW56D
W
SURFACE MOUNT SWITCHI NG DIODE ARRAY
Features
• Fast Switching Speed
• Ultra-Small Surface Mount Package
• For General Purpose Switching Applications
• High Conductance
• Two “BAW56” Circuits In One Package
• Lead Free/RoHS Compliant (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
• "Green" Device (Notes 4 and 5)
Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe). Please see Ordering Information: Note 6, Page 2
• Polarity: See Diagram
• Marking Information: See Page 2
• Weight: 0.006 grams (approximate)
SOT-363
A
1
A
2
C
2
C
1
C
2
C
1
Internal Schematic
TOP VIEW
TOP VIEW
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Non-Repetitive Peak Reverse Voltage VRM 100 V
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR 75 V
RMS Reverse Voltage VR(RMS) 53 V
Forward Continuous Current (Note 1) IFM 300 mA
Average Rectified Output Current (Note 1) IO 150 mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0μs
@ t = 1.0s IFSM 2.0
1.0 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1) PD 200 mW
Thermal Resistance Junction to Ambient Air (Note 1) RθJA 625 °C/W
Operating and Storage Temperature Range TJ , TSTG -65 to +150 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Max Unit Test Condition
Reverse Breakdown Voltage (Note 2) V(BR)R 75 ⎯ V IR = 2.5μA
Forward Voltage VF ⎯
0.715
0.855
1.0
1.25
V
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
Reverse Current (Note 2) IR ⎯
2.5
50
30
25
μA
μA
μA
nA
VR = 75V
VR = 75V, TJ = 150°C
VR = 25V, TJ = 150°C
VR = 20V
Total Capacitance CT ⎯ 2.0 pF VR = 0, f = 1.0MHz
Reverse Recovery Time trr ⎯ 4.0 ns IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Notes: 1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured pri o r to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BAW56DW
Document number: DS30146 Rev. 10 - 2 1 of 3
www.diodes.com March 2008
© Diodes Incorporated
BAW56D
W
0.1
1
0.01
0.001 01.5
1.00.5
I, I
N
S
T
A
N
T
A
N
E
O
U
S
F
O
R
WA
R
D
C
U
R
R
E
N
T
(A)
F
V , INSTANTANEOUS FORWARD VOLT AGE (V)
Fig. 2 Typical Forward Characteristics, Per Element
F
300
BAW56DW
Document number: DS30146 Rev. 10 - 2 2 of 3
www.diodes.com March 2008
© Diodes Incorporated
0
50
100
150
200
250
25050
75 100 125 150
P
,
P
O
WE
R
DISSI
P
A
T
I
O
N (mW)
D
T , AMBIENT TEMPERA T URE ( C)
A
°
Fig. 1 Power Derating Curve, Total Package
Note 1
0.0
0.2
0.4
0.6
0.8
1.8
1.6
1.4
1.2
1.0
2.0
010 20 40
30
C
,
T
O
T
AL
C
A
P
A
C
I
T
A
N
C
E (pF)
T
V , DC REVERSE VOL TAGE (V)
Fig. 4 Total Capacitance vs. Reverse Voltage, Per Element
R
0.1
1
10
100
1,000
10,000
020 40 60 80 100
V , INSTANTANEOUS REVERSE VOLT AGE (V)
Fi g. 3 Typi c al Rever s e C har ac t er istics, Per El em en t
R
I, I
N
S
T
A
N
T
A
N
E
O
U
S
R
EVE
R
SE
C
U
R
R
E
N
T
(nA)
R
Ordering Information (Note 6)
Part Number Case Packaging
BAW56DW-7-F SOT-363 3000/Tape & Reel
Notes: 6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
KJC YM
KJC YM
KJC = Product Type Marking Code
YM = Date Code Marking
Y = Year ex: N = 2002
M = Month ex: 9 = September
Date Code Key
Year 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012
Code L M N P R S T U V W X Y Z
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
BAW56D
W
Package Outline Dimensions
BAW56DW
Document number: DS30146 Rev. 10 - 2 3 of 3
www.diodes.com March 2008
© Diodes Incorporated
Suggested Pad Layout
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume an y liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages. LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
A
M
JL
D
B C
H
K
F
SOT-363
Dim Min Max
A 0.10 0.30
B 1.15 1.35
C 2.00 2.20
D 0.65 Nominal
F 0.30 0.40
H 1.80 2.20
J ⎯ 0.10
K 0.90 1.00
L 0.25 0.40
M 0.10 0.25
α 0° 8°
All Dimensions in mm
X
Z
Y
C
EE
G
Dimensions Value (in mm)
Z 2.5
G 1.3
X 0.42
Y 0.6
C 1.9
E 0.65
