1SD536F2
Data Sheet 1SD536F2-DIM1200ESM33-F000
IGBT-Driver.com Page 5
8) The gate curre nt is limited by on-board gate resistors.
9) Refers to the direct output of the gate drive unit. (Excluding the delay of the gate resistors.)
10) Maximum continuous or re peatedly applied DC voltage or peak value of the repeatedly applied AC
voltage betwe en the power supply inputs and all other terminals.
11) Including the delay of external fiber-optic links. Measured from turn-on transition at direct output
of the gate drive unit (excluding the delay of the gate resistors) to the transition of the status
signal at the optical receiver on the host controller side.
12) Application-specific self-heating of gate drivers and IGBT modules, especially at high switching
frequency, must be taken into account. The switching frequency is commonly limited due to
switching losses of the IGBT modules. Because CONCEPT cannot predict how the drivers will be
incorpo rated in t he user’s a pplicatio n, no bindi ng recom mended val ue for self-heating a nd thus for
the maximum useable output power can be made. It is therefore recommended to check the gate
driver’s ambient temperature within the system.
13) Incl uding t he de lay of e xter nal fibe r-optic links. Measure d from the transiti on of turn-on or turn-off
command at the optical transmitter on the host controller side to direct output of the gate drive
unit. (Excluding the delay of the gate resistors.)
14) Incl uding t he de lay of e xter nal fibe r-optic links. Measure d from the transiti on of turn-on or turn-off
command at the optical transmitter on the host controller side to the transition of the acknowledge
signal at the optical receiver on the host controller side.
15) The test voltage may be applied only once during one minute. It should be noted that with this
(strictly speaking obsolet e) test method, some (minor ) damage occurs to the insulation layers d ue
to the partial discharge. Consequently, this test is not performed at CONCEPT as a series test. In
the case of repeated insulation tests (e.g. module test, equipment test, system test) the
subsequent tests should be performed with a lower test voltage: the test voltage is reduced by
10% for each additional test. The more modern if more elaborate partial-discharge measurement
is better suited than such test methods as it is almost entirely non-destructive.
16) The transceivers required at the host controller side are not delivered with the gate driver. It is
recommended to use the same types as used in the gate driver. For product information refer to
www.IGBT-Driver.com/go/fiberoptics
17) The customer-side connector is not supplied with the gate driver, but via FCI Inc. Recommended
crimp contact housing: order code 65039-032; recommended crimp contacts: 5 pcs, order code
48236-002. Refer to www.IGBT-Driver.com/go/fci
18) The recommended transmitter current at the host controller is 30-35mA, suitable for plastic optic
fibers with a length of less than 2.5 mete rs. Higher current may increase jitter or delay at turn-off.
19) The transmitter current at the gate driver is 30-35mA.
20) The recommended transmitter current at the host controller is 60mA.
21) The transmitter current at the gate driver is about 49mA.
22) With “yes”, a di/dt feedback reduces the di/dt of the IGBT at turn-off. For more information refer
to the “Description and Application Manual for 1SD536F2 SCALE High-Power IGBT Drivers”. With
“no”, no di/dt feedback is implemented.
23) Due to the switching beha viour of the IGBT module and the response time of the IGBT driver the
max. collector current is limited to about 1700A at Tj=125°C and Udc=2200V. At higher currents
the desaturation protection of the driver will be activated at turn-on.
24) The short-circuit pulse width according to IEC60 747-9 is 1.9μs shorter than the response time.