Document Number: 63070 For any questions, contact: foil@vishay.com www.vishay.com
Revision: 01-Dec-08 1
VSM Series (0805, 1206, 1506, 2010, 2512)
Vishay Foil Resistors
High Precision Foil Wraparound Surface Mount Chip Resistor with
TCR of ± 2 ppm/°C and Load Life Stability of ± 0.01 % (100 ppm)
INTRODUCTION
Bulk Metal® Foil (BMF) technology out-performs all other
resistor technologies available today for applications that
require high precision and high stability, and allows
production of customer oriented products designed to satisfy
challenging and specific technical requirements.
The BMF provides an inherently low and predictable
Temperature Coefficient of Resistance (TCR) and excellent
load life stability for high precision analog applications.
Model VSM offers low TCR, excellent load life stability, tight
tolerance, excellent shelf life stability, low current noise and
low voltage coefficient, all in the same resistor.
The VSM has a full wraparound termination which ensures
safe handling during the manufacturing process, as well as
providing stability during multiple thermal cyclings.
Our application engineering department is available to
advise and make recommendations. For non-standard
technical requirements and special applications, please
contact us using the e-mail address in the footer below.
Note
(1) For tighter performances, please contact Vishay application
engineering using the e-mail address in the footer below.
FEATURES
Temperature coefficient of resistance (TCR):
± 2.0 ppm/°C typical (- 55 °C to + 125 °C,
+ 25 °C ref.) (see table 1)
Tolerance: to ± 0.01 %
Power rating: to 400 mW at + 70 °C
Load life stability: to ± 0.01 % at 70 °C, 2000 h
at rated power
Resistance range: 10 Ω to 150 kΩ (for higher and lower
values, please contact us)
Vishay Foil resistors are not restricted to standard values,
we can supply specific “as required” values at no extra cost
or delivery (e.g. 1K2345 vs. 1K)
Fast thermal stabilization < 1 s
Electrostatic discharge (ESD) up to 25 000 V
Short time overload: 0.01 %
Non inductive, non capacitive design
Rise time: 1 ns effectively no ringing
Current noise: - 42 dB
Voltage coefficient < 0.1 ppm/V
Non inductive: < 0.08 µH
Non hot spot design
Terminal finishes available: lead (Pb)-free
tin/lead alloy
Matched sets are available per request
Prototype samples available from 72 h. For more
information, please contact foil@vishay.com
For better performances please review VSMP and
VFCP Series datasheets
APPLICATIONS
Automatic test equipment (ATE)
High precision instrumentation
Laboratory, industrial and medical
Audio
EB applications (electron beam scanning and recording
equipment, electron microscopes)
Down hole instrumentation
Communication
* Pb containing terminations are not RoHS compliant, exemptions may apply
TABLE 1 - TOLERANCE AND TCR VS.
RESISTANCE VALUE
(1)
(- 55 °C to + 125 °C, + 25 °C Ref.)
RESISTANCE
VALUE
(Ω)
TOLERANCE
(%)
TYPICAL TCR AND
MAX. SPREAD
(ppm/°C)
250 to 150K ± 0.01 ± 2 ± 2
100 to < 250 ± 0.02 ± 2 ± 3
50 to < 100 ± 0.05 ± 2 ± 3
25 to < 50 ± 0.1 ± 2 ± 4
10 to < 25 ± 0.25 ± 2 ± 6
Top View
FIGURE 1 - POWER DERATING CURVE
100
75
50
25
0
- 75 - 50 - 25 0 + 25 + 50 + 75 + 100 + 125 + 150 + 175
Ambient Temperature (°C)
Percent of Rated Power
+ 70 °C
- 55 °C
VSM Series (0805, 1206, 1506, 2010, 2512)
Vishay Foil Resistors
www.vishay.com For any questions, contact: foil@vishay.com Document Number: 63070
2Revision: 01-Dec-08
Note
(1)
Land Pattern Dimensions are per IPC-7351A
Note
(1)
As shown + 0.01
Ω
to allow for measurement errors at low values.
FIGURE 2 - TRIMMING TO VALUES
(Conceptual Illustration)
Mutual Inductance
Reduction due
to Change in
Current Direction
Current Path
Before Trimming
Note: Foil shown in black, etched spaces in white
Interloop Capacitance
Reduction in Series
Trimming Process
Removes this Material
from Shorting Strip Area
Changing Current Path
and Increasing
Resistance
Current Path
After Trimming
FIGURE 3 -TYPICAL TCR CURVE
(For more Details, see Table 1)
Note
The TCR values for < 100 Ω are influenced by the termination
composition and result in deviation from this curve.
- 55
- 50 - 25 0 + 25 + 50 + 75 + 100 + 125
± 2 ppm/°C
(+ 25 °C reference)
+ 150
+ 100
+ 50
0
- 50
- 100
- 150
- 200
R
R
(ppm)
Ambient Temperature (°C)
TABLE 2 - DIMENSIONS AND LAND PATTERN in Inches (Millimeters)
CHIP SIZE L
± 0.005 (0.13)
W
± 0.005 (0.13)
THICKNESS
MAXIMUM
D
± 0.005 (0.13)
Z (1)
MAXIMUM
G (1)
MINIMUM
X (1)
MAXIMUM
0805 0.080 (2.03) 0.050 (1.27) 0.025 (0.64) 0.015 (0.38) 0.122 (3.10) 0.028 (0.71) 0.050 (1.27)
1206 0.126 (3.20) 0.062 (1.57) 0.025 (0.64) 0.020 (0.51) 0.175 (4.45) 0.059 (1.50) 0.071 (1.80)
1506 0.150 (3.81) 0.062 (1.57) 0.025 (0.64) 0.020 (0.51) 0.199 (5.05) 0.083 (2.11) 0.071 (1.80)
2010 0.198 (5.03) 0.097 (2.46) 0.025 (0.64) 0.025 (0.64) 0.247 (6.27) 0.115 (2.92) 0.103 (2.62)
2512 0.249 (6.32) 0.127 (3.23) 0.025 (0.64) 0.032 (0.81) 0.291 (7.39) 0.150 (3.81) 0.127 (3.23)
R
ecommen
d
e
d
L
an
d
P
attern
Footprint
G
Z
X
T
op
Vi
ew
D
TW
L
TABLE 3 - SPECIFICATIONS
CHIP SIZE RATED POWER (mW)
at + 70 °C
MAX VOLTAGE RATING
()
RESISTANCE RANGE
(Ω)
MAXIMUM WEIGHT
(mg)
0805 100 34 V 10 to 12K 6
1206 150 67 V 10 to 30K 11
1506 200 89 V 10 to 40K 12
2010 300 173 V 10 to 100K 27
2512 400 220 V 10 to 150K 40
TABLE 4 - PERFORMANCES
TEST OR CONDITIONS
MIL-PRF-55342
CHARACTERISTIC E
ΔR LIMITS
TYPICAL
ΔR LIMITS
MAXIMUM
ΔR LIMITS (1)
Thermal Shock ± 0.1 % ± 0.005 % (50 ppm) ± 0.02 % (200 ppm)
Low Temperature Operation ± 0.1 % ± 0.01 % (100 ppm) ± 0.02 % (200 ppm)
Short Time Overload ± 0.1 % ± 0.01 % (100 ppm) ± 0.02 % (200 ppm)
High Temperature Exposure ± 0.1 % ± 0.01 % (100 ppm) ± 0.03 % (300 ppm)
Resistance to Soldering Heat ± 0.2 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm)
Moisture Resistance ± 0.2 % ± 0.005 % (50 ppm) ± 0.03 % (300 ppm)
Load Life Stability + 70 °C for 2000 h at Rated Power ± 0.5 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm)
PR×
Document Number: 63070 For any questions, contact: foil@vishay.com www.vishay.com
Revision: 01-Dec-08 3
VSM Series (0805, 1206, 1506, 2010, 2512)
Vishay Foil Resistors
Notes
(1) Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction
(2) Vacuum pick up is recommended for handling
(3) Soldering iron may damage the resistor
Note
(1) For non-standard requests, please contact application engineering.
FIGURE 4 - RECOMMENDED MOUNTING (1)(2)(3)
25 % to 85 % of T
A low profile solder fillet is
recommended to avoid unnecessary
stresses along top edge of
metallization. IR and vapor phase
reflow are best.
TABLE 5 - GLOBAL PART NUMBER INFORMATION
NEW GLOBAL PART NUMBER: Y145512K7560T9R (preferred part number format)
DENOTES PRECISION VALUE AER (1)
YR = Ω
K = kΩ
0 = standard
9 = lead (Pb)-free
1 to 999 = custom
PRODUCT CODE RESISTANCE TOLERANCE PACKAGING
1172 = VSM0805
1496 = VSM1206
1455 = VSM1506
1611 = VSM2010
1612 = VSM2512
T= ± 0.01 %
Q= ± 0.02 %
A= ± 0.05 %
B= ± 0.10 %
C= ± 0.25 %
D= ± 0.5 %
F= ± 1.0 %
R= tape and reel
W= waffle pack
FOR EXAMPLE: ABOVE GLOBAL ORDER Y1455 12K7565 T 9 R:
TYPE: VSM1506
VALUES: 12.7560 kΩ
ABSOLUTE TOLERANCE: 0.01 %
TERMINATION: lead (Pb)-free
PACKAGING: tape and reel
HISTORICAL PART NUMBER: VSM1506 12K756 TCR2 T S T (will continue to be used)
VSM1506 12K756 TCR2 T S T
MODEL RESISTANCE
VALUE TCR
CHARACTERISTICS TOLERANCE TERMINATION PACKAGING
VSM0805
VSM1206
VSM1506
VSM2010
VSM2512
12.756 kΩT= ± 0.01 %
Q= ± 0.02 %
A= ± 0.05 %
B= ± 0.10 %
C= ± 0.25 %
D= ± 0.5 %
F= ± 1.0 %
S= lead (Pb)-free
B= tin/lead
T= tape and reel
W= waffle pack
4551 K752Y1 T96 R0
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1
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