SCAS076 − OCTOBER 1989 − REVISED APRIL 1993
Copyright 1993, Texas Instruments Incorporated
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
•Inputs Are TTL-Voltage Compatible
•3-State Outputs Interface Directly With
System Bus
•Performs Parallel-to-Serial Conversion
•Complementary Outputs Provide True and
Inverted Data
•New Flow-Through Architecture to
Optimize PCB Layout
•Center-Pin VCC and GND Configurations to
Minimize High-Speed Switching Noise
•EPIC (Enhanced-Performance Implanted
CMOS) 1-µm Process
•500-mA Typical Latch-Up Immunity at
125°C
•Package Options Include Plastic Small-
Outline Packages, and Standard Plastic
300-mil DIPs
description
This data selector/multiplexer contains full binary decoding to select one-of-eight data sources and features
strobe-controlled complementary 3-state outputs.
The 3-state outputs can interface with and drive data lines of bus-organized systems. With all but
one of the common outputs disabled (at a high-impedance state), the low-impedance of the signal enabled
output will drive the bus line to a high or low logic level. Both outputs are controlled by the strobe (G). The outputs
are disabled when G is high.
The 74ACT11251 is characterized for operation from − 40°C to 85°C.
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
D0
G
Y
GND
W
A
B
C
D1
D2
D3
D4
VCC
D5
D6
D7
D OR N PACKAGE
(TOP VIEW)
EPIC is a trademark of Texas Instruments Incorporated.
!"#$%! & '("")% $& ! *(+,'$%! -$%).
"!-('%& '!!"# %! &*)''$%!& *)" %/) %)"#& ! )0$& &%"(#)%&
&%$-$"- 1$""$%2. "!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-)
%)&%3 ! $,, *$"$#)%)"&.
4
SCAS076 − OCTOBER 1989 − REVISED APRIL 1993
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
CBA
SELECT
G
STROBE
INPUTS
YW
OUTPUTS
XXX H Z Z
L L L L D0 D0
L L H L D1 D1
L H L L D2 D2
L H H L D3 D3
H L L L D4 D4
H L H L D5 D5
H H L L D6 D6
H H H L D7 D7
logic symbol†
Y
W
3
5
2
6
7
8
1
16
15
14
13
11
10
9
G
A
B
C
D0
D1
D2
D3
D4
D5
D6
D7
0
2
0
1
2
3
4
5
6
7
G 7
0
EN MUX
H = high level, L = low level, X = irrelevant.
D0, D1,...D7 = the level of the respective D input
†This symbol is in accordance with ANSI/IEEE Std 91-1984 an
d
IEC Publication 617-12.
logic diagram (positive logic)
G
D1
D2
D3
D4
D0
D5
D6
D7
A
B
C
Data
Select
(Binary)
Data
Inputs
2
1
16
15
14
13
11
10
9
6
7
8
3
5Y
W
4
SCAS076 − OCTOBER 1989 − REVISED APRIL 1993
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) −0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Note 1) −0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±100 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
recommended operating conditions
MIN MAX UNIT
VCC Supply voltage 4.5 5.5 V
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
VIInput voltage 0 VCC V
VOOutput voltage 0 VCC V
IOH High-level output current −24 mA
IOL Low-level output current 24 mA
∆t/∆vInput transition rise or fall rate 0 10 ns/V
TAOperating free-air temperature −40 85 °C
4
SCAS076 − OCTOBER 1989 − REVISED APRIL 1993
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C
MIN
MAX
UNIT
PARAMETER
TEST CONDITIONS
V
CC MIN TYP MAX
MIN
MAX
UNIT
IOH = − 50 A
4.5 V 4.4 4.4
IOH = − 50 µA5.5 V 5.4 5.4
V
OH
IOH = − 24 mA
4.5 V 3.94 3.8 V
VOH
IOH = − 24 mA 5.5 V 4.94 4.8
V
IOH = −75 mA†5.5 V 3.85
IOL = − 50 A
4.5 V 0.1 0.1
IOL = − 50 µA5.5 V 0.1 0.1
V
OL
IOL = − 24 mA
4.5 V 0.36 0.44 V
VOL
IOL = − 24 mA 5.5 V 0.36 0.44
V
IOL = 75 mA†5.5 V 1.65
IOZ VO = VCC or GND 5.5 V ±0.5 ±5µA
IIVI = VCC or GND 5.5 V ±0.1 ±1µA
ICC VI = VCC or GND, IO = 0 5.5 V 8 80 µA
‡
One input at 3.4 V,
5.5 V
0.9
1
mA
∆ICC‡
One input at 3.4 V,
Other inputs at VCC or GND 5.5 V 0.9 1mA
CiVI = VCC or GND 5 V 3.5 pF
CoVO = VCC or GND 5 V 8 pF
†Not more than one output should be tested at a time and the duration of the test should not exceed 10 ms.
‡This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V to VCC.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
TA = 25°C
MIN
MAX
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT) MIN TYP MAX
MIN
MAX
UNIT
tPLH
A, B, or C
Y
3.2 6.8 10.2 3.2 11.4
ns
tPHL A, B, or C Y2.7 6.7 9.5 2.7 10.5 ns
tPLH
A, B, or C
W
2.5 6.3 8.8 2.5 9.8
ns
tPHL A, B, or C W2.8 6.3 9.7 2.8 10.8 ns
tPLH
Any D
Y
3 5.7 7.8 3 8.7
ns
tPHL Any D Y2 5.2 7.9 2 8.6 ns
tPLH
Any D
W
1.7 4.7 7.1 1.7 7.8
ns
tPHL Any D W2.7 5.1 7.2 2.7 8 ns
tPZH
G
Y
1.3 3.7 6.2 1.3 6.8
ns
tPZL
G
Y1.3 4 6 1.3 6.8 ns
tPZH
G
W
1 4.4 6.4 1 7
ns
tPZL
G
W1.3 4.1 5.8 1.3 6.4 ns
tPHZ
G
Y
4.1 5.7 7.6 4.1 8.1
ns
tPLZ
G
Y3.1 4 6.6 3.1 6.9 ns
tPHZ
G
W
4.1 5.7 7.7 4.1 8.2
ns
tPLZ
G
W
3.2 4.1 6.6 3.2 6.9
ns
4
SCAS076 − OCTOBER 1989 − REVISED APRIL 1993
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd
Power dissipation capacitance
Outputs enabled
CL= 50 pF, f = 1 MHz
60
pF
C
pd
Power dissipation capacitance
Outputs disabled
C
L
= 50 pF, f = 1 MHz
16
pF
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1
2 X VCC
Open
GND
500 Ω
500 Ω
TEST
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
S1
OPEN
2 x VCC
GND
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
1.5 V 1.5 V 3 V
0
50%50%
Input
(see Note C)
Out-of-Phase
Output
In-Phase
Output
Output
Control
(Low-Level
Enabling)
Output
Waveform 1
S1 at 2 x VCC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
1.5 V1.5 V
0
50% 20%
50% 80%
ENABLE AND DISABLE TIMES
VOLTAGE WAVEFORMS
3 V
50% 50%
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
≈ VCC
≈ 0 V
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 i s for an output with internal conditions such that the output is low except when disabled by the output control. Waveform
2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
74ACT11251D OBSOLETE SOIC D 16 TBD Call TI Call TI
74ACT11251N OBSOLETE PDIP N 16 TBD Call TI Call TI
74ACT11251N OBSOLETE PDIP N 16 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Jun-2005
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
74ACT11251D OBSOLETE SOIC D 16 TBD Call TI Call TI
74ACT11251N OBSOLETE PDIP N 16 TBD Call TI Call TI
74ACT11251N OBSOLETE PDIP N 16 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Jun-2005
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
74ACT11251D OBSOLETE SOIC D 16 TBD Call TI Call TI
74ACT11251N OBSOLETE PDIP N 16 TBD Call TI Call TI
74ACT11251N OBSOLETE PDIP N 16 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Jun-2005
Addendum-Page 1
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