CREAT BY ART
- Glass passivated junction chip
- Ideal for automated placement
- Low profile package
- Low power loss, high efficiency
- Fast switching for high efficiency
- Moisture sensitivity level: level 1, per J-STD-020
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
HAL HBL HDL HFL HGL HJL HKL HML
V
RRM
50 100 200 300 400 600 800 1000 V
V
RMS
35 70 140 210 280 420 560 700 V
V
DC
50 100 200 300 400 600 800 1000 V
I
F(AV)
A
Cj pF
Trr ns
R
θjA O
C/W
T
JO
C
T
STG O
C
Document Number: DS_D1405079 Version: B14
1.71.3
Note 3: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
50 75
20 15
Operating junction temperature range - 55 to +150
Storage temperature range - 55 to +150
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Measured at 1 MHz and Applied VR=4.0 Volts.
Maximum reverse recovery time (Note 3)
Typical thermal resistance 100
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=125 ℃I
R
5μA
150
Typical junction capacitance (Note 2)
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
30 A
Maximum instantaneous forward voltage (Note 1)
@ 1 A V
F
0.95 V
Marking code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current 1
HS
1FL
HS
1GL
HS
1JL
HS
1KL
HS
1ML UNIT
Case: Sub SMA Sub SMA
Polarity: Indicated by cathode band
Weight: 0.019 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER SYMBOL HS
1AL
HS
1BL
HS
1DL
HS1AL thru HS1ML
Taiwan Semiconductor
Hi
g
h Efficient Surface Mount Rectifiers
FEATURES
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
PART NO.
PART NO.
HS1JL
HS1JL
HS1JL
(TA=25℃ unless otherwise noted)
Document Number: DS_D1405079 Version: B14
HS1JLHRU H RU AEC-Q101 qualified
RATINGS AND CHARACTERISTICS CURVES
HS1JL RU RU
HS1JL RUG RU G Green compound
MH Sub SMA 10,000 / 13" Plastic reel (12mm tape)
Note 1: "x" defines voltage from 50V (HS1AL) to 1000V (HS1ML)
EXAMPLE
PREFERRED P/N AEC-Q101
QUALIFIED PACKING CODE GREEN COMPOUND
CODE DESCRIPTION
M2 Sub SMA 7,500 / 13" Plastic reel (12mm tape)
RH Sub SMA 10,000 / 13" Paper reel (12mm tape)
RF Sub SMA 3,000 / 7" Plastic reel (12mm tape)
R2 Sub SMA 7,500 / 13" Paper reel (12mm tape)
MQ Sub SMA 10,000 / 13" Plastic reel (8mm tape)
R3 Sub SMA 1,800 / 7" Plastic reel (12mm tape)
7,500 / 13" Paper reel (8mm tape)
MT Sub SMA 7,500 / 13" Plastic reel (8mm tape)
RQ Sub SMA 10,000 / 13" Paper reel (8mm tape)
Prefix "H"
RU
Suffix "G"
Sub SMA 1,800 / 7" Plastic reel (8mm tape)
RV Sub SMA 3,000 / 7" Plastic reel (8mm tape)
RT Sub SMA
HS1AL thru HS1ML
Taiwan Semiconductor
ORDERING INFORMATION
AEC-Q101
QUALIFIED
PACKING COD E GREEN COMPOUND
CODE
PACKAGE PACKING
HS1xL
(Note 1)
0
0.2
0.4
0.6
0.8
1
1.2
80 90 100 110 120 130 140 150
AVERAGE FORWARD CURRENT (A)
LEAD TEMPERATURE (oC)
FIG.1- MAXIMUM AVERAGE FORWARD CURRENT
DERATING
5
10
15
20
25
30
35
40
1 10 100
PEAK FORWARD SURGE URRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 3- MAXIMUM NON-REPETITIVE FORWARD SURGE
CURRENT
8.3ms Single Half Sine Wave
0.001
0.01
0.1
1
10
100
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT
(μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 2- TYPICAL REVERSE CHARACTERISTICS
TJ=25
℃
TJ=125℃
0.01
0.1
1
10
100
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
INSTANTANEOUS FORWARD
CURRENT (A)
FORWARD VOLTAGE (V)
FIG. 4- TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS
HS1AL-HS1DL
HS1GL
HS1JL-HS1ML
Min Max Min Max
B 1.70 1.90 0.067 0.075
C 2.70 2.90 0.106 0.114
D 0.16 0.30 0.006 0.012
E 1.23 1.43 0.048 0.056
F 0.80 1.20 0.031 0.047
G 3.40 3.80 0.134 0.150
H 2.45 2.60 0.096 0.102
I 0.35 0.85 0.014 0.033
J 0.00 0.10 0.000 0.004
P/N = Marking Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: DS_D1405079 Version: B14
MARKING DIAGRAM
D 1.9 0.075
E 4.3 0.169
B 1.2 0.047
C 3.1 0.122
SUGG ESTED PAD LAYO UT
Symbol Unit (mm) Unit (inch)
A 1.4 0.055
HS1AL thru HS1ML
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
0
10
20
30
40
50
60
70
0.1 1 10 100 1000
JUNCTION CAPACITANCE (pF)
REVERSE VOLTAGE (V)
FIG. 5- TYPICAL JUNCTION CAPACITANCE
HS1AL-HS1GL
HS1JL-HS1ML
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1405079 Version: B14
HS1AL thru HS1ML
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
