3
Device Selection Guide
Part Number
Typical Vie w ing
Angle, 2θ ½
(Degree)
Intensity (cd) at 20 MA
Standoff
Package
DimensionMin. Max.
HLMP-CW11-WZ0xx 15 5500 16000 No A
HLMP-CW11-XY0xx 15 7200 12000 No A
HLMP-CW12-WZ0xx 15 5500 16000 Yes B
HLMP-CW12-XY0xx 15 7200 12000 Yes B
HLMP-CW12-XYBxx 15 7200 12000 Yes B
HLMP-CW26-UX0xx 23 3200 9300 No A
HLMP-CW26-VW0xx 23 4200 7200 No A
HLMP-CW27-UX0xx 23 3200 9300 Yes B
HLMP-CW27-VW0xx 23 4200 7200 Yes B
HLMP-CW36-TW0xx 30 2500 7200 No A
HLMP-CW36-UV0xx 30 3200 5500 No A
HLMP-CW36-UVBxx 30 3200 5500 No A
HLMP-CW37-TW0xx 30 2500 7200 Yes B
HLMP-CW37-UV0xx 30 3200 5500 Yes B
HLMP-CW37-UVBxx 30 3200 5500 Yes B
Notes:
1. Tolerance for luminous intensity measurement is +/- 15%
2. The luminous intensity is measured on the mechanical axis of the lamp package.
3. The optical axis is closely aligned with the package mechanical axis.
4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper
safety equipment.
5. 2θ1/2 is the off-axis angle where the luminous intensity is ½ the on axis intensity
Notes:
1. Derate linearly as shown in figure 2.
2. 1.59 mm (0.060 inch) below body
3. Duty factor 10%, frequency 1KHz
Absolute Maximum Rating at TA = 25oC
Parameters Value Unit
DC forward current [1] 30 mA
Peak pulsed forward current [3] 100 mA
Average forward current 30 mA
Power dissipation 105 mW
LED junction temperature 110 oC
Operating temperature range -40 to +85 oC
Storage temperature range -40 to +100 oC
Wave soldering temperature [2] 250 for 3 seconds oC