BCR166WH6327 - INFINEON TECHNOLOGIES AG

TC4426A/TC4427A/TC4428A

Features:

• High Peak Output Current – 1.5A

• Wide Input Supply Voltage Operating Range:

- 4.5V to 18V

• High Capacitive Load Drive Capability – 1000 pF

in 25 ns (typ.)

• Short Delay Times – 30 ns (typ.)

• Matched Rise, Fall and Dela y Times

• Low Supply Current:

- With Logic ‘1’ Input – 1 mA (typ.)

- With Logic ‘0’ Input – 100 μA (typ.)

• Low Output Impedance – 7Ω (typ.)

• Latch-Up Protec te d: Wi ll Wit hstand 0.5 A Rev ers e

Current

• Input Will Withstand Negative Inputs Up to 5V

• ESD Protected – 4 kV

• Pin-compatible with TC426/TC427/TC428 and

TC4426/TC4427/TC4428

• Space-saving 8-Pin MSOP and 8-Pin 6x5 DFN

Packages

Applications:

• Switch Mode Power Supplies

• Line Drivers

• Pulse Transformer Drive

General Description:

The TC4426A/TC4427A/TC4428A are improved

versi o ns of t he e a r li er T C4 4 26 /TC44 27/ T C44 2 8 fa mi ly

of MOSFET dri vers. In add ition to matche d rise and fal l

times, the TC4426A/TC4427A/TC4428A devices have

matched leading and falling edge propagation delay

times.

These devices are highly latch-up resistant under any

conditions within their power and voltage ratings. They

are not subject to damage when up to 5V of noise

spiking (of either polarity) occurs on the ground pin.

They can accept, without damage or logic upset, up to

500 mA of reverse current (of either polarity) being

forced back into their outputs. All terminals are fully

protected against Electrostatic Discharge (ESD) up to

4kV.

The TC4426A/TC4427A/TC4428A MOSFET drivers

can easily charge/discharge 1000 pF gate

capacitances in under 30 ns. These devices provide

low enou gh impedance s in both the on and of f states to

ensure the MOSFET’s intended state will not be

affected, even by large t ransients.

Package Types

Note 1: Exposed pad of the DFN package is electrically isola ted.

8-Pin DFN(1)

IN A

GND

IN B

8OUT A

OUT B

IN A

GND

IN B VDD

TC4426A

TC4427A

TC4426A TC4427A

OUT A

OUT B

VDD TC4426A

TC4427A

TC4428A

OUT A

OUT B

VDD

TC4428A TC4428A

OUT A

OUT B

VDD

TC4426A TC4427A

OUT A

OUT B

VDD

TC4428A

OUT A

OUT B

VDD

8-Pin MSOP/

PDIP/SOIC

1.5A Dual High-Speed Power MOSFET Drivers

TC4426A/TC4427A/TC4428A

Functional Block Diagram

Effective

Input C = 12 pF

(Each Input) TC4426A/TC4427A/TC4428A

Output

Input

GND

VDD

300 mV

4.7V

Inverting

Non-Inverting

Note 1: TC4426A has two inverting drivers, while the TC4427A has two non-inverting

drivers. The TC4428A has one inverting and one non-inverting driver.

2: Ground any unused driver input.

500 μA

TC4426A/TC4427A/TC4428A

1.0 ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings†

Supply Voltage.....................................................+22V

Input Voltage, IN A or IN B

.....................................(VDD + 0.3V) to (GND – 5V)

Package Power Dissipation (TA ≤ 70°C)

DFN.............................................................. Note 2

MSOP..........................................................340 mW

PDIP............................................................730 mW

SOIC............................................................470 mW

† Notice: Stresses above those listed under “Absolute Maxi-

mum Ratings” may cause permanen t damage to the device.

These are stress ratings only and functi onal operation of the

device at these or any other conditions above those indicated

in the operation sections of the specifications is not implied.

Exposure to Absolute Maximum Rating conditions for

extended periods may affect device reliability.

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 18V.

Parameters Sym Min Typ Max Units Conditions

Input

Logic ‘1’, High Input Voltage VIH 2.4 — — V

Logic ‘0’, Low Input Voltage VIL ——0.8V

Input Current IIN –1.0

–10 —

—+1.0

+10 μA0V ≤ VIN ≤ VDD

Output

High Output V oltage VOH VDD – 0.025 — — V DC Test

Low Output Voltage VOL — — 0.025 V DC Test

Output Resistance RO—

—

ΩIOUT = 10 mA, VDD = 18V, TA = +25°C

0°C ≤ TA ≤ +70°C

-40°C ≤ TA ≤ +85°C

-40°C ≤ TA ≤ +125°C

Peak Output Current IPK —1.5—AV

DD = 18V

Latch-Up Protection

Withstand Reverse Current IREV — > 0.5 — A Duty cycle ≤ 2%, t ≤ 300 μsec

VDD = 18V

Swit c h ing Time (Note 1)

Rise Time tR—

—

ns TA = +25°C

0°C ≤ TA ≤ +70°C

-40°C ≤ TA ≤ +85°C

-40°C ≤ TA ≤ +125°C, Figure 4-1

Fall Time tF—

—

ns TA = +25°C

0°C ≤ TA ≤ +70°C

-40°C ≤ TA ≤ +85°C

-40°C ≤ TA ≤ +125°C, Figure 4-1

Delay Time tD1 —

—

ns TA = +25°C

0°C ≤ TA ≤ +70°C

-40°C ≤ TA ≤ +85°C

-40°C ≤ TA ≤ +125°C, Figure 4-1

Delay Time tD2 —

—

ns TA = +25°C

0°C ≤ TA ≤ +70°C

-40°C ≤ TA ≤ +85°C

-40°C ≤ TA ≤ +125°C, Figure 4-1

Power Supply

Power Supply Current IS—

—1.0

0.1 2.0

0.2 mA VIN = 3V (Both inputs)

VIN = 0V (Both inputs), VDD = 18V

Note 1: Switching times ensured by design.

2: Package power dissipation is dependent on the copper pad area on the PCB.

TC4426A/TC4427A/TC4428A

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V.

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Specified Temperature Range (C) TA0—+70°C

Specified Temperature Range (E) TA-40 — +85 °C

Specified Temperature Range (V) TA-40 — +125 °C

Maximum Junction Temperature TJ——+150°C

Storage Temperature Range TA-65 — +150 °C

Package Thermal Resistances

Thermal Resistance, 8L-6x5 DFN θJA —33.2 —°C/W

Thermal Resistance, 8L-MSOP θJA — 206 — °C/W

Thermal Resistance, 8L-PDIP θJA — 125 — °C/W

Thermal Resistance, 8L-SOIC θJA — 155 — °C/W

TC4426A/TC4427A/TC4428A

2.0 TYPICAL PERFORMANCE CURVES

Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 18V.

FIGURE 2-1: Rise Time vs. Supply

Voltage.

FIGURE 2-2: Delay Time vs. Input

Amplitude.

FIGURE 2-3: Rise and Fall Times vs.

Temperature.

FIGURE 2-4: Fall Time vs. Supply

Voltage.

FIGURE 2-5: Propagation Delay Time vs.

Supply Voltage.

FIGURE 2-6: Propagation Delay Time vs.

Temperature.

Note: The g r ap hs and t ables prov id ed followi ng thi s n ote are a stat istic al summ ar y b as ed on a l im ite d n um ber of

samples and are provided for informational purposes only. The performance characteristics listed herein

are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified

operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

5.0 7.5 10.0 12.5 15.0 17.5

100

TA = +25°C

VDD (V)

CL = 2200 pF

CL = 1500 pF

CL = 100 pF

CL = 1000 pF

CL = 470 pF

tRISE (nsec)

12 3 4 5 67 8 9

100

110

Delay Time (nsec)

Input Amplitude (V)

CL = 1000 pF

VDD = 10V

tD1

tD2

-100 -50 0 50 100 150

Time (nsec)

CL = 1000 pF

VDD = 18V

TEMPERATURE (°C)

tFALL

tRISE

5.0 7.5 10.0 12.5 15.0 17.5

100

CL= 100pF

TA = +25°C

VDD (V)

CL = 2200pF

CL = 2200 pF

CL = 1500 pF

CL = 100 pF

CL = 1000 pF

CL = 470 pF

tFALL (nsec)

0 5 10 15 20

Delay Time (nsec)

VDD (V)

CL = 1000 pF

tD1

tD2

Delay Time (nsec)

-100 -50 0 50 100 150

CL = 1000 pF

VDD = 18V

TEMPERATURE (°C)

tD1

tD2

TC4426A/TC4427A/TC4428A

Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 18V.

FIGURE 2-7: High-State Output

Resistance.

FIGURE 2-8: Supply Cur re nt vs.

Frequency.

FIGURE 2-9: Supply Cur re nt vs.

Frequency.

FIGURE 2-10: Low-S tate Output

Resistance.

FIGURE 2-11: Supply Current vs.

Capacitive Loa d.

FIGURE 2-12: Supply Current vs.

Capacitive Loa d.

0 5 10 15 20

VDD (V)

DS(ON)

(Ω)

TA = +125°C

TA = +25°C

0500 1000 1500 2000 2500

FREQUENCY (kHz)

ISUPPLY (mA)

VDD = 18V

CL = 2200 pF CL = 1500 pF

CL = 1000 pF CL = 100 pF

FREQUENCY (kHz)

0500 1000 1500 2000 2500

ISUPPLY (mA)

VDD = 12V CL = 2200 pF

CL = 1500 pF

CL = 1000 pF

CL = 100 pF

0510 15 20

VDD (V)

DS(ON)

(Ω)

TA = +125°C

TA = +25°C

0500 1000 1500 2000 2500

60 2 MHz VDD = 18V

ISUPPLY (mA)

CLOAD (pF)

900 kHz

600 kHz

200 kHz

20 kHz

0500 1000 1500 2000 2500

ISUPPLY (mA)

CLOAD (pF)

VDD = 12V

900 kHz

600 kHz

200 kHz

20 kHz

2 MHz

TC4426A/TC4427A/TC4428A

Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 18V.

FIGURE 2-13: Su ppl y Cur rent vs .

Frequency.

FIGURE 2-14: Quiescent Supply Current

vs. Voltage.

FIGURE 2-15: Supply Current vs.

Capacitive Loa d.

FIGURE 2-16: Quiescent Supply Current

vs. Temperature.

0500 1000 1500 2000 2500

FREQUENCY (kHz)

ISUPPLY (mA)

VDD = 6V CL = 2200 pF

CL = 1500 pF

CL = 1000 pF

CL = 100 pF

TA = 25°C

BOTH INPUTS = 1

0 5 10 15 20

800

700

600

500

400

200

100

300

900

IQUIESCENT (µA)

DD (V)

BOTH INPUTS = 0

0500 1000 1500 2000 2500

ISUPPLY (mA)

CLOAD (pF)

VDD = 6V

900 kHz

600 kHz

200 kHz

20 kHz

2 MHz

-100 -50 0 50 100 150

1000

900

800

700

600

400

300

200

100

500

1100

IQUIESCENT (µA)

TEMPERATURE (°C)

VDD = 18V

BOTH INPUTS = 1

BOTH INPUTS = 0

TC4426A/TC4427A/TC4428A

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

3.1 Inputs A and B

MOSFET driver inputs A and B are high-impedance,

TTL/CMOS compatible inputs . These input s als o have

300 mV of hysteresis between the high and low

thresholds that prevents output glitching, even when

the rise and fall time of the input signal is very slow.

3.2 Ground (GND)

The ground pin is the return path for both the bias

current and the high peak current that discharges the

external load capacitance. The ground pin should be

tied int o a ground plane or have a very short trace to the

bias supply source return.

3.3 Output A and B

MOSFET driver outputs A and B are low-impedance,

CMOS push-pul l st yle outp uts . The pull-d own an d pull-

up devices are of equal strength, making the rise and

fall times equivalent.

3.4 Supply Input (VDD)

The VDD in put is the bias s upply for the MO SFET driver

and is rat ed fo r 4.5 V to 18 V, with respect to the ground

pin. The VDD input should be bypassed with local

ceramic capacitors. The value of these capacitors

should be chosen based on the capacitive load that is

being driven.

3.5 Exposed Metal Pad

The expo sed metal p ad of the 6 x5 D F N packa ge i s n ot

internally connected to any potential. Therefore, this

pad can be connected to a ground plane or other

copper plane on a printed circuit board, to aid in heat

removal from the package.

8-Pin PDIP/

MSOP/SOIC 8-Pin

DFN Symbol Description

1 1 NC No connection

2 2 IN A Input A

33GNDGround

4 4 IN B Input B

55OUT BOutput B

66V

DD Supply input

77OUT AOutput A

8 8 NC No connection

— PAD NC Exposed Metal Pad

Note 1: Duplicate pins must be connected for proper operation.

TC4426A/TC4427A/TC4428A

4.0 APPLICATIONS INFORMATION

FIGURE 4-1: Switching Time Test Circuit.

CL = 1000 pF

0.1 μF

4.7 μF

Inverting Driver

Non-Inverting Driver

Input

VDD = 18V

Input

Output

tD1 tF

tD2

Input: 100 kHz,

square wave,

tRISE = tFALL ≤ 10 ns

Output

Input

Output

tD1 tF

tD2

+5V

10%

90%

10%

90%

10%

90%

VDD

90%

10%

10% 10%

90%

+5V

VDD

90%

45(TC4426A, 1/2 TC4428A)

(TC4427A, 1/2 TC4428A)

TC4426A/TC4427A/TC4428A

5.0 P ACKAGING INFORMATION

5.1 Package Marking Information

XXXXXXXX

XXXXXNNN

YYWW

8-Lead PDIP (300 mil) Example:

Legend: XX...X Customer specific information*

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week ‘01’)

NNN Alphanumeric traceability code

Note: In the eve nt the full Micro chip p art num ber can not be ma rked on on e line, it will

be carried ov er to the ne xt li ne thus lim iti ng th e nu mb er of av ai lab le c hara ct ers

for customer specific information.

*Standard marking consists of Microchip part number, year code, week code, traceability code (facility

code, mask rev#, and assembly code).

TC4427A

EPA256

0420

8-Lead SOIC (150 mil) Example:

XXXXXXXX

XXXXYYWW

NNN

TC4428A

COA0420

256

8-Lead MSOP Example:

XXXXX

YWWNNN

4426AE

420256

8-Lead DFN Example:

XXXXXXX

XXYYWW

NNN

TC4426A

EMF

0420

256

TC4426A/TC4427A/TC4428A

8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) – Saw Singulated

TC4426A/TC4427A/TC4428A

8-Lead Plastic Micro Small Outline Package (UA) (MSOP)

(F)

n 1

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

.037 REFFFootprint (Reference)

exceed .010" (0.254mm) per side.

Notes:

Drawing No. C04-111

*Controlling Parameter

Mold Draft Angle Top

Mold Draft Angle Bottom

Foot Angle

Lead Width

Lead Thickness

.003

.009

.006

.012

Dimension Limits

Overall Height

Molded Package Thickness

Molded Package Width

Overall Length

Foot Length

Standoff

Overall Width

Number of Pins

Pitch

.016 .024

.118 BSC

.000

.030

.193 TYP.

.033

MIN

Units

.026 BSC

NOM

INCHES

0.95 REF

.009

.016

0.08

0.22

0°

0.23

0.40

8°

MILLIMETERS*

0.65 BSC

0.85

3.00 BSC

0.60

4.90 BSC

.043

.031

.037

.006

0.40

0.00

0.75

MIN

MAX NOM

1.10

0.80

0.15

0.95

MAX

15°5° -

JEDEC Equivalent: MO-187

0° - 8°

5°

5° -

15°

TC4426A/TC4427A/TC4428A

8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)

Units INCHES*MILLIMETERS

Dimen sion Li mits MIN NOM MAX MIN NOM MAX

Number of Pins n88

Pitch p.100 2.54

Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32

Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68

Base to Seating Plane A1 .015 0.38

Shoulder to Shou lder Width E .300 .313 .325 7.62 7.94 8.26

Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60

Overall Len gth D .360 .373 .38 5 9.1 4 9.46 9. 78

Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43

Lead Thi ckne ss c.008 .012 .015 0.20 0.29 0.38

Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78

Lower Lead Width B .014 .018 .022 0.36 0.46 0.56

Overall Row Spacing §eB .310 .370 .430 7.87 9.40 10.92

Mold Draft Angle Top α5 10 15 5 10 15

Mold Draft Angle Bottom β5 10 15 5 10 15

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-018

§ Significant Characteristic

TC4426A/TC4427A/TC4428A

8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)

Foot A ngle φ048048

1512015120

Mold Draft Angle Bottom 1512015120

Mold Draft Angle Top 0.510.420.33.020.017.013BLead Width 0.250.230.20.010.009.008

Lead Thickness

0.760.620.48.030.025.019LFoot Length 0.510.380.25.020.015.010hChamfer Distance 5.004.904.80.197.193.189DOverall Length 3.993.913.71.157.154.146E1Molded Pa ckag e Width 6.206.025.79.244.237.228EOverall Width 0.250.180.10.010.007.004A1Standoff §1.551.421.32.061.056.052A2Molded Packag e Thickness 1.751.551.35.069.061.053AOverall Height 1.27

.050

Pitch 88

Numb er of Pin s MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units

45°

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.

JEDEC Equivalent: MS-012

Drawing No. C04-057

§ Significant Characteristic

TC4426A/TC4427A/TC4428A

PRODUCT IDENTIFICATION SYSTEM

To order or o btain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Sales and Support

Device: TC4426A: 1.5A Dual MOSFET Driver, Inverting

TC4427A: 1.5A Dual MOSFET Driver, Non-Inverting

TC4428A: 1.5A Dual MOSFET Driver, Complementary

Temperature Range: C = 0°C to +70°C (PDIP & SOIC Only)

E = -40°C to +85°C

V = -40ºC to +125°C

Package: MF = Dual, Flat, No-Lead (6X5 mm Body), 8-lead

MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead

(Tape and Ree l)

PA = Plastic DIP (300 mil Body), 8-lead

OA = Plastic SOIC, (150 mil Body), 8-lead

OA713 = Plastic SOIC, (150 mil Body), 8-lead

(Tape and Ree l)

UA = Plastic Micro Small Outline (MSOP), 8-lead

UA713 = Plastic Micro Small Outline (MSOP), 8-lead

(Tape and Ree l)

Examples:

a) TC4426ACOA: 1.5A Dual Inverting

MOSFET dri ver,

0°C to +70°C,

8LD SOIC package.

b) TC4426AE OA: 1.5A Dual Inverting

MOSFET dri ver,

-40°C to +85°C,

8LD SOIC package.

c) TC4426AEMF: 1.5A Dual Inverting

MOSFET dri ver,

-40°C to +85°C,

8LD DFN package.

a) TC4427ACPA: 1.5A Dual Non-Inverting

MOSFET dri ver,

0°C to +70°C,

8LD PDIP package.

b) TC4427AEPA: 1.5A Dual Non-Inverting

MOSFET dri ver,

-40°C to +85°C,

8LD PDIP package.

c) TC4427AVMF713: 1.5A Dual Non-Inverting

MOSFET dri ver,

-40°C to +125°C,

8LD DFN package,

Tape and Reel.

a) TC4428AEPA: 1.5A Dual Complementary

MOSFET dri ver,

-40°C to +85°C,

8LD PDIP package.

b) TC4428ACOA713: 1.5A Dual Complementary

MOSFET dri ver,

0°C to +70 ° C

8LD SOIC package,

Tape and Reel.

c) TC4428AVMF: 1.5A Dual Complementary

MOSFET dri ver,

-40°C to +125°C,

8LD DFN package.

PART NO. XXX

PackageTemperature

Range

Device

XXX

Tape & Reel

PB Free

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and

recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microc hip sales office

2. T he Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Dat a Sheet (include Literature #) you are using.

Customer Notification System

TC4426A/TC4427A/TC4428A

NOTES:

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR WAR-

RANTIES OF ANY KIN D WHETHER EXPRESS OR IMPLIED ,

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RELATED TO THE INFORMATION, INCLUDING BUT NOT

LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,

MERCHANTABILITY OR FITNESS FOR PURPOSE.

Microchip disclaims all liability arising from this information and

its use. U se of Microc hip’s products as critical com ponents in

life support systems is not authorized except with express

written approval by Microchip. No licenses are conveyed,

implicitly or otherwise, under any Microchip intellectual property

rights.

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WORLDWIDE SALES AND SERVICE

10/31/05