TN2540-G
®
May 1998 - Ed: 5
SCR
Symbol Parameter Value Unit
IT(RMS) RMS on-state current
(180° conduction angle) Tc= 100°C25 A
I
T(AV) Av erage on-s tate current
(180° conduction angle) Tc= 100°C16 A
I
TSM Non repetitive surge peak on-state current tp = 8.3 ms 314 A
(Tj initial = 25° C) tp = 10 m s 300
I2tI2t Value for fusing tp = 10ms 450 A2s
dI/dt Critical rate of rise of on- state cur rent
IG = 100 mA dIG /dt = 1 A/µs. 100 A/µs
Tstg
TjStorage junction temperature range
Operating junction temperature range - 40 to + 150
- 40 to + 125 °C
Tl Maximum temperature for soldering during 10s 260 °C
ABSOLUTE MAXIMUM R ATINGS
D2PAK
HIGH SURGE CAPABILITY
HIGH ON-S TATE CURRE NT
HIGH STA BILITY AND RELIABILITY
FEATURES
The TN2540 series of S ilicon Controlled Rectifiers
uses a high performance glass passivated tech-
nology.
This SCR is designed for power supplies up to
400Hz on resistive or inductive load.
DESCRIPTION
K
AG
A
Symbol Parameter TN2540- Unit
600G 800G
VDRM
VRRM Repetitive peak off-state voltage
Tj = 125°C 600 800 V
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PG ( A V)= 1W PGM = 10 W (tp = 20 µs) IGM = 4 A (tp = 20 µs) VRGM = 5 V
GATE C HARACT E RISTICS
Symbol Parameter Value Unit
Rth(j-a) Junction to ambient (S=1cm2)45
°
C/W
Rth(j-c) Junc tion to case for D.C 1.0 °C/W
THER MAL RE SISTA NC ES
Symbol Test Conditions Type Value Unit
IGT VD = 12V (DC) RL= 33Tj= 25°CMIN 3 mA
MAX 40
VGT VD = 12V (DC) RL= 33Tj= 25°C MAX 1.3 V
VGD VD = VDRM RL = 3.3k Tj= 125°CMIN 0.2 V
I
HI
T
= 200mA G ate open Tj= 25°C MAX 50 mA
ILIG = 1.2 IGT Tj= 25°C MAX 90 mA
VTM ITM= 50A tp= 380µs Tj= 25°CMAX 1.5 V
I
DRM VD = VDRM Tj= 25°C MAX 5 µA
IRRM VR = VRRM T j= 125°C MAX 4 mA
dV/dt VD=67%VDRM Gate open Tj= 125°C MIN 500 V/µs
ELECTRI CAL CHARACTERI STICS
ORDERI NG INFORMATION
TN 25 40 - 600 G
SCR
CURRENT
PA CKA GE S :
G: D2PAK
VOLTAGE
SENSITIVITY
Add "-TR" suffix for Tape & R eel shipment
TN2540-G
2/5
0 25 50 75 100 125
0
5
10
15
20
25
30
I (A)
T(AV)
D.C.
α=180°
Tcase(°C)
Fig. 3 : Average and D.C. on-state current versus
case temperature.
-40 -20 0 20 40 60 80 100 120 140
0.0
0.5
1.0
1.5
2.0
2.5
I ,I [Tj]/I ,I [Tj=25°C]
GT H GT H
I
GT
I
H
Tj(°C)
Fig. 5: Relative variation of gate trigger current and
holding current versus junc tion temperature.
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
0.01
0.10
1.00
K=[Zth/Rth]
Zth(j-c)
Zth(j-a)
tp(s)
Fig. 4: Relative variation of thermal impedance
versus pulse duration.
1 10 100 1000
0
40
80
120
160
200
240
280
320
I (A)
TSM
Tj initial=25°C
F=50Hz
Number of cycles
Fig. 6 : Non r epetit ive surge peak on- s tat e current
versus number of cycles.
0 5 10 15 20 25
0
5
10
15
20
25
P(W)
α=180°
α=120°
α=90°
α=60°
α=30°
D.C.
I (A)
T(AV)
Fig. 1: Maximum average power dissipation ver-
sus average on-state current .
0 20 40 60 80 100 120 140
0
5
10
15
20
25
P(W) Tcase (°C)
125
α=180°
Rth=0°C/WRth=1°C/WRth=2°C/WRth=3°C/W
100
105
110
115
120
Tamb(°C)
Fig. 2 : Corr elat ion betwee n maximu m average
power dissipation and maximum allowable tem-
peratur es (Tamb and Tcase) for d ifferent thermal
resista nce s he atsink+con t act.
TN2540-G
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0 4 8 1216202428323640
0
10
20
30
40
50
60
70
80
Rth(j-a) (°C/W)
S(Cu) (cm²)
Fig. 9: Ther mal resistance junction to ambient v er-
sus copper surface under tab (Epoxy printed circuit
board FR4, copper thickness: 35µm).
12 510
100
200
500
1000
I (A),I²t(A²s)
TSM
Tj initial=25°C
I
TSM
I²t
tp(ms)
Fig. 7 : Non repetit ive surge peak on-state current
for a sinusoidal pulse with width tp<10ms, and cor-
responding value of I2t.
012345
1
10
100
300
I (A)
TM
Tj=25°C
Tj=Tj max. Tj max.:
Vto=0.77V
Rt=14m
V (V)
TM
Fig. 8: On-state characteristics (maximum values).
0 40 80 120 160 200 240 280 320 360
T (°C)
250
200
150
100
50
0
Epoxy FR4
board
Metal-backed
board
245°C
215°C
t (s)
Fig. 10: Typical reflow soldering heat profile, either
for mounting on FR4 or m etal-backed boards.
TN2540-G
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PACKAGE MECHANICAL DAT A
D2PAK
A
C2
D
R
2.0 MIN.
FLAT ZONE
A2
V2
C
A1
G
L
L3
L2
B
B2
E
REF. DIMENSIONS
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.25 1.40 0.048 0.055
C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
R 0.40 0.016
V2 8°
MARKING : TN2540
x00G
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8.90 3.70
1.30
5.08
16.90
10.30
FOOT PRIN T DI MENSIONS (in millimeters)
TN2540-G
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