MC3303, MC3403
QUADRUPLE LOW-POWER OPERATIONAL AMPLIFIERS
SLOS101C – FEBRUAR Y 1979 – REVISED FEBRUAR Y 2002
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D
Wide Range of Supply Voltages, Single
Supply ...3 V to 36 V or Dual Supplies
D
Class AB Output Stage
D
True Differential Input Stage
D
Low Input Bias Current
D
Internal Frequency Compensation
D
Short-Circuit Protection
D
Designed to Be Interchangeable With
Motorola MC3303, MC3403
description
The MC3303 and the MC3403 are quadruple operational amplifiers similar in performance to the µA741, but
with several distinct advantages. They are designed to operate from a single supply over a range of voltages
from 3 V to 36 V . Operation from split supplies also is possible, provided the difference between the two supplies
is 3 V to 36 V. The common-mode input range includes the negative supply . Output range is from the negative
supply to VCC – 1.5 V. Quiescent supply currents are less than one-half those of the µA741.
The MC3303 is characterized for operation from –40°C to 85°C, and the MC3403 is characterized for operation
from 0°C to 70°C.
AVAILABLE OPTIONS
PACKAGE
TAVIOMAX
AT 25°CPLASTIC
SMALL OUTLINE
(D, NS)
PLASTIC SHRINK
SMALL OUTLINE
(DB)
PLASTIC
DIP
(N)
PLASTIC
THIN SHRINK
SMALL OUTLINE
(PW)
0°C to 70°C10 mV MC3403D
MC3403NS MC3403DB MC3403N MC3403PW
–40°C to 85°C8 mV MC3303D MC3303N MC3303PW
The D package is available taped and reeled. Add R suffix to the device type (e.g., MC3403DR). The DB, NS,
and PW packages are only available taped and reeled.
logic diagram (each amplifier)
IN+ OUT
IN–
+
Copyright 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN–
1IN+
VCC+
2IN+
2IN–
2OUT
4OUT
4IN–
4IN+
VCC–
3IN+
3IN–
3OUT
MC3303 ...D, N, OR PW PACKAGE
MC3403 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
MC3303, MC3403
QUADRUPLE LOW-POWER OPERATIONAL AMPLIFIERS
SLOS101C FEBRUARY 1979 REVISED FEBRUARY 2002
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
schematic (each amplifier)
IN
IN+
VCC+
Common
Bias Circuitry
VCC
Output
To Three
Other
Amplifiers
2.4 k
5 pF
Component values shown are nominal.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage (see Note 1): VCC+ 18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VCC 18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage, VCC+ with respect to VCC 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage (see Note 2) ±36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage (see Notes 1 and 3) ±18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 4): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg 65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. These voltage values are with respect to the midpoint between VCC+ and VCC.
2. Differential voltages are at IN+ with respect to IN.
3. Neither input must ever be more positive than VCC+ or more negative than VCC.
4. The package thermal impedance is calculated in accordance with JESD 51-7.
MC3303, MC3403
QUADRUPLE LOW-POWER OPERATIONAL AMPLIFIERS
SLOS101C FEBRUARY 1979 REVISED FEBRUARY 2002
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
recommended operating conditions
MIN MAX UNIT
VCC Supply voltage 5 30 V
Dual su
pp
ly voltage
VCC+ 2.5 15 V
Dual
-
supply
voltage
VCC2.5 15 V
TA
O
p
erating free air tem
p
erature
MC3303 40 85
°C
T
A
Operating
free
-
air
temperature
MC3403 0 70
°C
electrical characteristics at specified free-air temperature, VCC+ = 14 V, VCC = 0 V for MC3303,
VCC± = ±15 V for MC3403 (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MC3303 MC3403
UNIT
PARAMETER
TEST
CONDITIONS
MIN TYP MAX MIN TYP MAX
UNIT
VIO
In
p
ut offset voltage
See Note 5
25°C 2 8 2 10
mV
V
IO
Input
offset
voltage
See
Note
5
Full range 10 12
mV
a
VIO Temperature coefficient
of input offset voltage See Note 5 Full range 10 10 µV/°C
IIO
In
p
ut offset current
See Note 5
25°C 30 75 30 50
nA
I
IO
Input
offset
current
See
Note
5
Full range 250 200
nA
a
IIO Temperature coefficient
of input offset current See Note 5 Full range 50 50 pA/C
IIB
In
p
ut bias current
See Note 5
25°C0.2 0.5 0.2 0.5
µA
I
IB
Input
bias
current
See
Note
5
Full range 10.8 µ
A
VICR Common-mode
input voltage range25°CVCC
to 12 VCC
to 12.5 VCC
to 13 VCC
to 13.5 V
Pk tt
RL = 10 k25°C 12 12.5 ±12 ±13.5
VOM Peak output
voltage swing
RL = 2 k25°C 10 12 ±10 ±13 V
voltage
swing
RL = 2 kFull range 10 ±10
AVD
Lar
g
e-si
g
nal differential
VO=±10 V RL=2k
25°C 20 200 20 200
V/mV
A
VD
gg
voltage amplification
V
O =
±10
V
,
R
L =
2
k
Full range 15 15
V/mV
BOM Maximum-output-swing
bandwidth VOPP = 20 V, AVD = 1,
THD 5%, RL = 2 k25°C 9 9 kHz
B1Unity-gain bandwidth VO = 50 mV, RL = 10 k25°C 1 1 MHz
φmPhase margin CL = 200 pF, RL = 2 k25°C 60°60°
riInput resistance f = 20 Hz 25°C 0.3 1 0.3 1 M
roOutput resistance f = 20 Hz 25°C 75 75
CMRR Common-mode
rejection ratio VIC = VICRmin 25°C 70 90 70 90 dB
kSVS Supply voltage
sensitivity
(VIO/VCC)VCC± = ±2.5 to ±15 V 25°C 30 150 30 150 µV/V
IOS Short-circuit
output current§25°C±10 ±30 ±45 ±10 ±30 ±45 mA
ICC Total supply current No load, See Note 5 25°C 2.8 7 2.8 7 mA
All characteristics are measured under open-loop conditions with zero common-mode voltage unless otherwise specified. Full range for TA is
40°C to 85°C for MC3303, and 0°C to 70°C for MC3403.
The VICR limits are linked directly, volt-for-volt, to supply voltage; the positive limit is 2 V less than VCC+.
§Temperature and/or supply voltages must be limited to ensure that the dissipation rating is not exceeded.
NOTE 5: VIO, IIO, IIB, and ICC are defined at VO = 0 for MC3403 and VO = 7 V for MC3303.
MC3303, MC3403
QUADRUPLE LOW-POWER OPERATIONAL AMPLIFIERS
SLOS101C FEBRUARY 1979 REVISED FEBRUARY 2002
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics, VCC+ = 5 V, VCC = 0 V, TA = 25°C (unless otherwise noted)
TEST CONDITIONS
MC3303 MC3403
UNIT
TEST
CONDITIONS
MIN TYP MAX MIN TYP MAX
UNIT
VIO Input offset voltage VO = 2.5 V 10 2 10 mV
IIO Input offset current VO = 2.5 V 75 30 50 nA
IIB Input bias current VO = 2.5 V 0.5 0.2 0.5 µA
RL = 10 k3.3 3.5 3.3 3.5
VOM Peak output voltage swing
RL = 10 kΩ,
VCC+ = 5 V to 30 V VCC+
1.7 VCC+
1.7 V
AVD
Lar
g
e-si
g
nal
VO=17Vto33VR
L=2k
20
200
20
200
V/mV
A
VD
gg
differential voltage amplification
V
O =
1
.
7
V
to
3
.
3
V
,
R
L =
2
k
20
200
20
200
V/mV
kSVS
Supply-volta
g
e sensitivity
VCC±=±25Vto±15 V
150
150
µV/V
k
SVS
yg y
(VIO/VCC±)
V
CC± =
±2
.
5
V
to
±15
V
150
150
µ
V/V
ICC Supply current VO = 2.5 V, No load 2.5 7 2.5 7 mA
VO1/VO2 Crosstalk attenuation f = 1 kHZ to 20 kHZ120 120 dB
All characteristics are measured under open-loop conditions with zero common-mode input voltage unless otherwise specified.
Output will swing essentially to ground.
operating characteristics, VCC+ = 14 V, VCC = 0 V for MC3303, VCC± = ±15 V for MC3403,
TA = 25°C, AVD = 1 (unless otherwise noted)
PARAMETER TEST CONDITIONS TYP UNIT
SR Slew rate at unity gain VI = ±10 V, CL = 100 pF, RL = 2 kΩ, See Figure 1 0.6 V/µs
trRise time VO = 50 mV, CL = 100 pF, RL = 10 k,See Figure 1 0.35 µs
tfFall time VO = 50 mV, CL = 100 pF, RL = 10 k,See Figure 1 0.35 µs
Overshoot factor VO = 50 mV, CL = 100 pF, RL = 10 k,See Figure 1 20 %
Crossover distortion VI(PP) = 30 mV, VOPP = 2 V, f = 10 kHZ1 %
PARAMETER MEASUREMENT INFORMATION
+
RL
CL = 100 pF
VI
OUT
Figure 1. Unity-Gain Amplifier
MC3303, MC3403
QUADRUPLE LOW-POWER OPERATIONAL AMPLIFIERS
SLOS101C FEBRUARY 1979 REVISED FEBRUARY 2002
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
|VCC±| Supply Voltage V
V
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
RL = 10 k
TA = 25°C
MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE
vs
SUPPLY VOLTAGE
Figure 2
OPP Maximum Peak-to-Peak Output Voltage V
30
25
20
15
10
5
00 2 4 6 8 10121416
f Frequency Hz
MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE
vs
FREQUENCY
Figure 3
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC± = ±15 V
CL = 0
RL = 10 k
TA = 25°C
See Figure 1
VOPP Maximum Peak-to-Peak Output Voltage V
30
25
20
15
10
5
0
1 k 10 k 100 k 1 M
1
f Frequency Hz
10
102
103
104
105
106
LARGE-SIGNAL
DIFFERENTIAL VOLTAGE AMPLIFICATION
vs
FREQUENCY
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC± = ±15 V
RL = 2 k
TA = 25°C
A
Figure 4
VD Large-Signal Differential Voltage Amplification dB
1 10 100 1 k 10 k 100 k 1 M
Input Output Voltages V
t Time µs
VOLTAGE-FOLLOWER
LARGE-SIGNAL PULSE RESPONSE
Figure 5
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC± = ±15 V
RL = 2 k
TA = 25°C
See Figure 1
10
5
0
5
10
0 1020304050 60708090
Output
Input
Operation of the device at these or any other conditions beyond those indicated under ‘‘recommended operating conditions is not implied.
MC3303, MC3403
QUADRUPLE LOW-POWER OPERATIONAL AMPLIFIERS
SLOS101C FEBRUARY 1979 REVISED FEBRUARY 2002
6POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
I
TA Free-Air Temperature °C
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC± = ±15 V
INPUT BIAS CURRENT
vs
FREE-AIR TEMPERATURE
Figure 6
IB Input Bias Current mA
250
200
150
100
50
0
75 50 25 0 25 50 75 100 125
INPUT BIAS CURRENT
vs
SUPPLY VOLTAGE
|VCC±| Supply Voltage V
ÎÎÎÎ
ÎÎÎÎ
TA = 25°C
Figure 7
IIB Input Bias Current mA
250
200
150
100
50
00246810121416
Operation of the device at these or any other conditions beyond those indicated under ‘‘recommended operating conditions is not implied.
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MC3303D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3303DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3303DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3303DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3303DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3303DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3303N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
MC3303NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
MC3303PW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3303PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3303PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3303PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3303PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3303PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3403D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3403DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3403DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3403DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3403DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3403DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3403N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
MC3403NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
MC3403NSLE OBSOLETE SO NS 14 TBD Call TI Call TI
MC3403NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3403NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 24-May-2007
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MC3403PW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3403PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3403PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3403PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3403PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MC3403PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 24-May-2007
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
MC3303DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
MC3303PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
MC3403DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
MC3403DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
MC3403NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
MC3403PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MC3303DR SOIC D 14 2500 367.0 367.0 38.0
MC3303PWR TSSOP PW 14 2000 367.0 367.0 35.0
MC3403DR SOIC D 14 2500 333.2 345.9 28.6
MC3403DR SOIC D 14 2500 367.0 367.0 38.0
MC3403NSR SO NS 14 2000 367.0 367.0 38.0
MC3403PWR TSSOP PW 14 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated