Product family data sheet
Copyright © 2017-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo,
XLamp® and EasyWhite® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
WWW.CREE.COM/XLAMP
CLD-DS170 REV 0F
Cree® XLamp® XHP70.2 LEDs
PRODUCT DESCRIPTION
The XLamp XHP70.2 LED is the next
generation of Extreme High Power LEDs
that delivers the lowest system cost
through the best lumen density, reliability
and color consistency. Built on Cree’s
latest high-power LED technology, the
XHP70.2 LED improves the lumen density,
voltage characteristics, reliability and
optical performance of the XHP70 LED in
the same 7.0mm x 7.0mm footprint. The
new XHP70.2 LED provides an easy drop-in
upgrade to achieve higher system LPW for
lighting manufacturers with existing XHP70
designs, eliminating redesign costs. Its
unparalleled lumen density and longer
lifetime at higher operating temperatures
also enable new and innovative lighting
designs at lower system costs.
FEATURES
• Available in white, congurable to 6V
or 12V by PCB layout
• Available in 5-step EasyWhite® bins
at 3000K to 5000K CCT, 3-step
EasyWhite bins at 2700K to 5000K
and 2-step EasyWhite bins at 2700K
to 4000K CCT
• Available in ANSI white bins at
3000K to 7000K CCT
• Available in standard, 70-, 80-, and
90-minimum CRI options
• Binned at 85°C
• Maximum drive current: 4800mA
(6V), 2400mA (12V)
• Low thermal resistance: 0.9°C/W
• Wide viewing angle: 125°
• Unlimited oor life at
≤ 30ºC/85% RH
• Reow solderable - JEDEC
J-STD-020C
• RoHS and REACh compliant
• UL® recognized component
(E349212)
TABLE OF CONTENTS
Characteristics ..............................................2
Flux Characteristics, EasyWhite® Order
Codes and Bins .............................................3
Flux Characteristics, ANSI White Order
Codes and Bins .............................................5
Relative Spectral Power Distribution ...........7
Relative Flux vs. Junction Temperature .......7
Electrical Characteristics ..............................8
Relative Flux vs. Current ...............................9
Relative Chromaticity vs Current ............... 10
Relative Chromaticity vs Temperature ...... 11
Typical Spatial Distribution ........................ 11
Thermal Design .......................................... 12
Performance Groups - Luminous Flux ...... 13
Performance Groups - Chromaticity ......... 13
Cree’s Standard White Chromaticity
Regions Plotted on the CIE 1931 Curve .... 17
Cree’s Standard Cool White Kits Plotted
on ANSI Standard Chromaticity Regions .. 20
Cree’s Standard Warm and Neutral White
Kits Plotted on ANSI Standard
Chromaticity Regions ................................ 21
Bin and Order-Code Format ....................... 22
Reow Soldering Characteristics .............. 23
Notes .......................................................... 24
Mechanical Dimensions ............................ 25
Electrical Conguration ............................. 26
Tape and Reel ............................................. 27
Packaging ................................................... 28