HLMP-CW11-WZ000 - Avago Technologies

Description

These high intensity white LED

lamps are based on InGaN

material technology. A blue

LED die is coated by

phosphor to produce white.

The typical resulting color is

described by the coordinates x

= 0.31, y = 0.31 using the 1931

CIE Chromaticity Diagram.

Agilent HLMP-CWxx

T-1 ¾ (5mm) Extra Bright

Precision Optical Performance

White LED Lamps

Data Sheet

Features

••

•Well defined spatial radiation

pattern

••

•High luminous white emission

••

•Viewing angle: 15°°

°°

°, 23°°

°°

° and 30°°

°°

••

•Standoff or non-standoff leads

••

•Superior resistance to moisture

Applications

••

•Electronic signs and signals

••

•Small area illumination

••

•Legend backlighting

••

•General purpose indicators

Benefit

••

•Reduced power consumption,

higher reliability, and increased

optical/mechanical design

flexibility compared to

incandescent bulbs and other

alternative white light sources.

Caution: Devices are Class 1 ESD sensitive. Please observe appropriate precautions during

handling and processing. Refer to Application Note AN-1142 for additional details.

HLMP-CW11, HLMP-CW12, HLMP-CW26, HLMP-CW27,

HLMP-CW36, HLMP-CW37

These T-1 ¾ lamps are

untinted, non-diffused, and

incorporate precise optics

which produce well-defined

spatial radiation patterns at

specific viewing cone angle.

Part Numbering System

Package Dimensions

Notes:

1. All dimensions are in millimeters /inches.

2. Epoxy meniscus may extend about 1mm

(0.040") down the leads.

3. If heat-sinking application is required, the

terminal for heat sink is anode.

Package Dimension BPackage Dimension A

1.14 ± 0.20

(0.045 ± 0.008)

5.80 ± 0.20

(0.228 ± 0.008)

5.00 ± 0.20

(0.197 ± 0.008)

31.60

(1.244) MIN.

0.70 (0.028)

MAX.

1.00

(0.039) MIN.

8.71 ± 0.20

(0.343 ± 0.008)

2.54 ± 0.38

(0.100 ± 0.015)

0.50 ± 0.10

(0.020 ± 0.004) SQ. TYP.

CATHODE

LEAD

2.35 (0.093)

MAX.

CATHODE

FLAT

Mechanical Option

00: Bulk

DD: Ammo Pack Straight Leads

Color Bin Options

0: Full color bin distribution

B: Color bin 2 & 3 only

Maximum Intensity Bin

0: No maximum intensity bin limit

Others: Refer to Device Selection Guide

Minimum Intensity Bin

Refer to Device Selection Guide

Viewing Angle and Standoff Option

11: 15˚ without standoff

12: 15˚ with standoff

26: 23˚ without standoff

27: 23˚ with standoff

36: 30˚ without standoff

37: 30˚ with standoff

H L M P --XXXXXXXCW

DIMENSION H:

15°: 12.24 ± 0.25mm (0.482 ± 0.01 inches)

23°: 12.50 ± 0.25mm (0.492 ± 0.01 inches)

30°: 12.00 ± 0.25mm (0.472 ± 0.01 inches)

1.14 ± 0.20

(0.045 ± 0.008)

5.80 ± 0.20

(0.228 ± 0.008)

5.00 ± 0.20

(0.197 ± 0.008)

31.60

(1.244) MIN.

0.70 (0.028)

MAX.

1.00

(0.039) MIN.

8.71 ± 0.20

(0.343 ± 0.008)

2.54 ± 0.38

(0.100 ± 0.015)

0.50 ± 0.10

(0.020 ± 0.004) SQ. TYP.

CATHODE

LEAD

CATHODE

FLAT

1.50 ± 0.15

(0.059 ± 0.006)

DIMENSION H

Device Selection Guide

Part Number

Typical Viewing

Angle, 2θ ½

(Degree)

Intensity (mcd) at 20 mA

Standoff

Package

DimensionMin. Max.

HLMP-CW11-WZ0xx 15 5500 16000 No A

HLMP-CW11-X10xx 15 7200 21000 No A

HLMP-CW11-XY0xx 15 7200 12000 No A

HLMP-CW11-YZ0xx 15 9300 16000 No A

HLMP-CW12-WZ0xx 15 5500 16000 Yes B

HLMP-CW12-X10xx 15 7200 21000 Yes B

HLMP-CW12-XY0xx 15 7200 12000 Yes B

HLMP-CW12-XYBxx 15 7200 12000 Yes B

HLMP-CW12-YZ0xx 15 9300 16000 Yes B

HLMP-CW12-YZBxx 15 9300 16000 Yes B

HLMP-CW26-UX0xx 23 3200 9300 No A

HLMP-CW26-VW0xx 23 4200 7200 No A

HLMP-CW26-VY0xx 23 4200 12000 No A

HLMP-CW26-WX0xx 23 5500 9300 No A

HLMP-CW27-UX0xx 23 3200 9300 Yes B

HLMP-CW27-UX2xx 23 3200 9300 Yes B

HLMP-CW27-VW0xx 23 4200 7200 Yes B

HLMP-CW27-VY0xx 23 4200 12000 Yes B

HLMP-CW27-WX0xx 23 5500 9300 Yes B

HLMP-CW36-TW0xx 30 2500 7200 No A

HLMP-CW36-UV0xx 30 3200 5500 No A

HLMP-CW36-UVBxx 30 3200 5500 No A

HLMP-CW36-VW0xx 30 4200 7200 No A

HLMP-CW36-VWBxx 30 4200 7200 No A

HLMP-CW37-TW0xx 30 2500 7200 Yes B

HLMP-CW37-UV0xx 30 3200 5500 Yes B

HLMP-CW37-UVBxx 30 3200 5500 Yes B

HLMP-CW37-VW0xx 30 4200 7200 Yes B

HLMP-CW37-VWBxx 30 4200 7200 Yes B

Notes:

1. Tolerance for luminous intensity measurement is +/- 15%

2. The luminous intensity is measured on the mechanical axis of the lamp package.

3. The optical axis is closely aligned with the package mechanical axis.

4. LED light output is bright enough to cause injuries to the eyes. Precautions must be taken to prevent looking directly at the LED without proper

safety equipment.

5. 2θ1/2 is the off-axis angle where the luminous intensity is ½ the on axis intensity.

6. Part numbers in BOLD are recommended for new designs.

Electrical/Optical Characteristics TA = 25oC

Parameters Symbol Min Typ Max Units Test Condition

Forward voltage VF3.2 4.0 V IF = 20 mA

Reverse Voltage [1] VR5.0 V IR = 10 µA

Thermal resistance RθJ-PIN 240 oC/W LED Junction to anode lead

Chromaticity Coordinates [2] X

0.31

IF = 20 mA

Capacitance C 70 VF=0, f=1MHz

Notes:

1. The reverse voltage of the product is equivalent to the forward voltage of the protective chip at IR = 10 µA

2. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.

Figure 1. Relative Intensity vs. Wavelength

0.0

0.2

0.4

0.6

0.8

1.0

380 480 580 680 780

WAVELENGTH - nm

RELATIVE LUMINOUS INTENSITY

Figure 2. Forward Current vs. Ambient

Temperature

Figure 3. Relative Intensity versus DC

Forward Current

020406080

100

AMBIENT TEMPERATURE - ˚C

IF - FORWARD CURRENT - mA

RθJ-A = 585˚C/W

RθJ-A = 780˚C/W

0.3

0.6

0.9

1.2

1.5

0102030

FORWARD CURRENT - mA

RELATIVE LUMINOUS INTENSITY

Notes:

1. Derate linearly as shown in figure 2.

2. Duty factor 10%, frequency 1KHz

Absolute Maximum Rating at TA = 25oC

Parameters Value Unit

DC forward current [1] 30 mA

Peak pulsed forward current [2] 100 mA

Power dissipation 105 mW

LED junction temperature 110 oC

Operating temperature range -40 to +85 oC

Storage temperature range -40 to +100 oC

Figure 4. Chromaticity shift vs. Current

*Note: (x,y) values @ 20mA reference to (0,0)

Figure 7. Spatial Radiation Pattern for CW2x

Figure 8. Spatial Radiation Pattern for CW3x

Figure 6. Spatial Radiation Pattern for CW1x

Figure 5. Forward Current vs. Forward

Voltage

-0.010

-0.005

0.000

0.005

0.010

0.015

0.020

0.025

-0.005 0.000 0.005 0.010 0.015

X-COORDINATES

Y-COORDINATES

30mA

20mA

10mA

5mA

1mA

2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6

VF - FORWARD VOLTAGE - VOLTS

- FORWARD CURRENT - mA

0.5

-90 -60 -30 0 30 60 90

ANGULAR DISPLACEMENT (˚)

RELATIVE LUMINOUS INTENSITY

0.5

-90 -60 -30 0 30 60 90

ANGULAR DISPLACEMENT (˚)

RELATIVE LUMINOUS INTENSITY

0.5

-90 -60 -30 0 30 60 90

ANGULAR DISPLACEMENT (˚)

RELATIVE LUMINOUS INTENSITY

Color Bin Limit Table

Note:

1. Bin categories are established for classification of products. Products may not be available in all

bin categories. Please contact your Agilent representative for information on currently available

bins.

Rank Limits (Chromaticity Coordinates)

1 X 0.330 0.330 0.356 0.361

Y 0.360 0.318 0.351 0.385

2 X 0.287 0.296 0.330 0.330

Y 0.295 0.276 0.318 0.339

3 X 0.264 0.280 0.296 0.283

Y 0.267 0.248 0.276 0.305

4 X 0.283 0.287 0.330 0.330

Y 0.305 0.295 0.339 0.360

Color Bin Limits with Respect to CIE

1931 Chromaticity Diagram

0.40

0.35

0.30

0.25

0.20

0.26 0.30 0.34 0.38

Y-COORDINATE

X-COORDINATE

BLACK

BODY

CURVE

Tolerance for each bin limit is ± 0.01

Bin Intensity (mcd) at 20 mA

Min Max

Q 1150 1500

R 1500 1900

S 1900 2500

T 2500 3200

U 3200 4200

V 4200 5500

W 5500 7200

X 7200 9300

Y 9300 12000

Z 12000 16000

1 16000 21000

Intensity Bin Limit Table

Tolerance for each bin limit is ± 15%

Wave Soldering

Manual Solder

Dipping

Pre-heat temperature 105 °C Max. −

Preheat time 30 sec Max −

Peak temperature 250 °C Max. 260 °C Max.

Dwell time 3 sec Max. 5 sec Max

BOTTOM SIDE

OF PC BOARD

TOP SIDE OF

PC BOARD

NOTE: ALLOW FOR BOARDS TO BE

SUFFICIENTLY COOLED BEFORE

EXERTING MECHANICAL FORCE.

CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)

PREHEAT SETTING = 150 C (100 C PCB)

SOLDER WAVE TEMPERATURE = 245 C

AIR KNIFE AIR TEMPERATURE = 390 C

AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)

AIR KNIFE ANGLE = 40

SOLDER: SN63; FLUX: RMA

250

200

150

FLUXING

TURBULENT WAVE

PREHEAT

TIME - SECONDS

TEMPERATURE - ˚C

100

0 10 20 30 40 50 60 70 80 90 100

LAMINAR WAVE

HOT AIR KNIFE

LED component

ead size Diagonal

Plated through

hole diameter

0.457 x 0.457mm

(0.018 x 0.018inch)

0.646 mm

(0.025 inch)

0.976 to 1.078 mm

(0.038 to 0.042 inch)

0.508 x 0.508mm

(0.020 x 0.020inch)

0.718 mm

(0.028 inch)

1.049 to 1.150mm

(0.041 to 0.045 inch)

Precautions:

Lead Forming:

•The leads of an LED lamp may be preformed or cut to

length prior to insertion and soldering into PC board.

•If lead forming is required before soldering, care must

be taken to avoid any excessive mechanical stress

induced to LED package. Otherwise, cut the leads of

LED to length after soldering process at room

temperature. The solder joint formed will absorb the

mechanical stress of the lead cutting from traveling to

the LED chip die attach and wirebond.

•It is recommended that tooling made to precisely form

and cut the leads to length rather than rely upon hand

operation.

Soldering Condition:

•Care must be taken during PCB assembly and

soldering process to prevent damage to LED

component.

•The closest LED is allowed to solder on board is

1.59mm below the body (encapsulant epoxy) for those

parts without standoff.

•Recommended soldering condition:

Recommended Wave Soldering Profile

Note: Refer to application note AN1027 for more information on

soldering LED components.

•Wave soldering parameter must be set and

maintain according to recommended temperature

and dwell time in the solder wave. Customer is

advised to periodically check on the soldering

profile to ensure the soldering profile used is

always conforming to recommended soldering

condition.

•If necessary, use fixture to hold the LED

component in proper orientation with respect to

the PCB during soldering process.

•Proper handling is imperative to avoid excessive

thermal stresses to LED components when

heated. Therefore, the soldered PCB must be

allowed to cool to room temperature, 25°C before

handling.

•Special attention must be given to board

fabrication, solder masking, surface plating and

lead holes size and component orientation to

assure solderability.

•Recommended PC board plated through holes size

for LED component leads.

www.agilent.com/

semiconductors

For product information and a complete list

of distributors, please go to our web site.

For technical assistance call:

Americas/Canada: +1 (800) 235-0312

or (408) 654-8675

Europe: +49 (0) 6441 92460

China: 10800 650 0017

Hong Kong: (+65) 6756 2394

India, Australia, New Zealand: (+65) 6755 1939

Japan: (+81 3) 3335-8152(Domestic/Inter-

national), or 0120-61-1280(Domestic Only)

Korea: (+65) 6755 1989

Singapore, Malaysia, Vietnam, Thailand,

Philippines, Indonesia: (+65) 6755 2044

Taiwan: (+65) 6755 1843

Data subject to change.

Obsoletes 5989-3733EN

October 20, 2005

5989-4117EN