Wideband 2.5 GHz, 37 dB Isolation at 1 GHz,
CMOS, 1.65 V to 2.75 V, 4:1 Mux/SP4T
Enhanced Product
ADG904-EP
Rev. C Document Feedback
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Tel: 781.329.4700 ©2016–2017 Analog Devices, Inc. All rights reserved.
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FEATURES
Wideband switch: –3 dB frequency at 2.5 GHz
Absorptive 4:1 mux/single-pole, four-throw (SP4T)
High off isolation (37 dB at 1 GHz)
Low insertion loss (1.1 dB dc to 1 GHz)
Single 1.65 V to 2.75 V power supply (VDD)
CMOS/LVTTL control logic
20-lead, 4 mm × 4 mm LFCSP package
Low power consumption (2.5 µA maximum)
ENHANCED PRODUCT FEATURES
Supports defense and aerospace applications (AQEC standard)
Military temperature range: −55°C to +125°C
Controlled manufacturing baseline
1 assembly/test site
1 fabrication site
Enhanced product change notification
Qualification data available on request
APPLICATIONS
Wireless communications
General-purpose radio frequency (RF) switching
Dual-band applications
High speed filter selection
Digital transceiver front-end switches
IF switching
Tuner modules
Antenna diversity switching
FUNCTIONAL BLOCK DIAGRAM
ADG904-EP
50Ω
50Ω
50Ω
50Ω
1 OF 4 DECO DE R
RFC
A0 A1 EN
RF1
RF2
RF3
RF4
14326-001
Figure 1.
GENERAL DESCRIPTION
The ADG904-EP is a wideband analog 4:1 multiplexer that uses
a CMOS process to provide high isolation and low insertion
loss to 1 GHz. The ADG904-EP is an absorptive/matched mux
with 50 Ω terminated shunt legs. This device is designed such
that the isolation is high over the dc to 1 GHz frequency range.
The ADG904-EP switches one of four inputs to a common
output, RFC, as determined by the 3-bit binary address lines
A0, A1, and EN. A Logic 1 on the EN pin disables the device.
The device has on-board CMOS control logic, which eliminates
the need for external control circuitry. The control inputs are both
CMOS and LVTTL compatible. The low power consumption of
this device makes it ideally suited for wireless applications and
general-purpose high frequency switching.
Additional application and technical information can be found
in the ADG904 data sheet.
PRODUCT HIGHLIGHTS
1. 37 dB off isolation at 1 GHz.
2. 1.1 dB insertion loss at 1 GHz.
3. 20-lead LFCSP package.
ADG904-EP Enhanced Product
Rev. C | Page 2 of 11
TABLE OF CONTENTS
Features .............................................................................................. 1
Enhanced Product Features ............................................................ 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Continous Current Per Channel ................................................ 4
Absolute Maximum Ratings ............................................................5
Thermal Resistance .......................................................................5
ESD Caution...................................................................................5
Pin Configuration and Function Descriptions ..............................6
Typical Performance Characteristics ..............................................7
Test Circuits ........................................................................................9
Outline Dimensions ....................................................................... 11
Ordering Guide .......................................................................... 11
REVISION HISTORY
5/2017—Rev. B to Rev. C
Change to Endnote 1, Table 3 ......................................................... 3
Updated Outline Dimensions ....................................................... 11
3/2017—Rev. A to Rev. B
Changes to Endnote 4, Table 1 ........................................................ 3
Added Endnote 1, Table 2................................................................ 4
11/2016—Rev. 0 to Rev. A
Changes to Figure 15 ........................................................................ 9
6/2016—Revision 0: Initial Version
Enhanced Product ADG904-EP
Rev. C | Page 3 of 11
SPECIFICATIONS
VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, temperature range = −55°C to +125°C, unless otherwise noted.
Table 1.
Parameter Symbol Test Conditions/Comments Min Typ 1 Max Unit
AC ELECTRICAL CHARACTERISTICS
−3 dB Frequency2 2.5 GHz
Insertion Loss S12, S21 DC to 100 MHz; VDD = 2.5 V ± 10%;
see Figure 18
0.5 1 dB
500 MHz; VDD = 2.5 V ± 10% 0.7 1.2 dB
1000 MHz; VDD = 2.5 V ± 10% 1.1 1.8 dB
Isolation—RFC to RF1x S12, S21 100 MHz; see Figure 17 51 60 dB
500 MHz; see Figure 17 35 45 dB
1000 MHz; see Figure 17 30 37 dB
Crosstalk S12, S21 100 MHz; see Figure 19 50 58 dB
500 MHz; see Figure 19 32 35 dB
1000 MHz; see Figure 19 30 35 dB
Return Loss
2
S11, S22
On Channel DC to 100 MHz 19 27 dB
500 MHz 26 dB
1000 MHz 18 dB
Off Channel DC to 100 MHz 14 22 dB
500 MHz 19 dB
1000 MHz 18 dB
Timing
On Switching Time2 tON (EN) 50% EN to 90% RF; see Figure 15 8.5 10 ns
Off Switching Time2 tOFF (EN) 50% EN to 10% RF; see Figure 15 13 16 ns
Transition Time tTRANS 50% A0/A1 to 10% RF 12 15 ns
Rise Time2 tRISE 10% to 90% RF; see Figure 16 3 5 ns
Fall Time2 tFAL L 90% to 10% RF; see Figure 16 7.5 11 ns
Third-Order Intermodulation Intercept IP3 900 MHz/901 MHz, 4 dBm; see Figure 21 25 31 dBm
Video Feedthrough3 See Figure 20 3 mV p-p
INPUT POWER
1 dB Input Compression P1dB 1000 MHz4; see Figure 22 16 dBm
DC ELECTRICAL CHARACTERISTICS
Input High Voltage VINH VDD = 2.25 V to 2.75 V 1.7 V
VDD = 1.65 V to 1.95 V 0.65 VDD V
Input Low Voltage VINL VDD = 2.25 V to 2.75 V 0.7 V
VDD = 1.65 V to 1.95 V 0.35 VDD V
Input Leakage Current II 0 V ≤ VIN ≤ 2.75 V ±0.1 ±1 µA
CAPACITANCE2 f = 1 MHz
RF Port On Capacitance CRF ON 3 pF
Digital Input Capacitance
C
2
pF
POWER REQUIREMENTS
VDD 1.65 2.75 V
Quiescent Power Supply Current IDD Digital inputs = 0 V or VDD 0.1 2.5 µA
1 Typical values are at VDD = 2.5 V and 25°C, unless otherwise stated.
2 Guaranteed by design, not subject to production test.
3 Video feedthrough is the dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test
setup, measured with 1 ns rise time pulses and 500 MHz bandwidth.
4 Less than 100 MHz, refer to the AN-952 Application Note for more information about power handling.
ADG904-EP Enhanced Product
Rev. C | Page 4 of 11
CONTINOUS CURRENT PER CHANNEL
Table 2.
Parameter 25°C 85°C 105°C 125°C Unit Test Conditions/Comments
CONTINUOUS CURRENT PER
CHANNEL1
20-lead LFCSP, θJA = 30.4°C/W, dc bias = 0.5 V
VDD = 2.75 V, VSS = 0 V 93.1 10.8 5.9 3.3 mA maximum
VDD = 1.65 V, VSS = 0 V 82.6 10.8 5.9 3.3 mA maximum
1 Guaranteed by design, not production tested.
Enhanced Product ADG904-EP
Rev. C | Page 5 of 11
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter Rating
VDD to GND1 −0.5 V to +4 V
Inputs to GND1 −0.5 V to VDD + 0.3 V2
Continuous Current Data3 + 15%
Input Power4 18 dBm
Operating Temperature Range (Industrial) −55°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature
150°C
Lead Temperature, Soldering (10 sec) 300°C
IR Reflow, Peak Temperature (<20 sec) 235°C
Electrostatic Discharge (ESD) 1 kV
1 Tested at +125°C.
2 RFx off port inputs to ground = −0.5 V to VDD − 0.5 V.
3 See Table 2.
4 Input power is tested with switch in both open and close position. Power is
applied on RFx, while RFC is terminated to a 50 Ω resistor to GND.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Table 4. Thermal Resistance
Package Type
θ
JA
θ
JC
Unit
CP-20-61 30.4 2.83 °C/W
1 Test condition: thermal impedance simulated values are based on
JEDEC 2S2P thermal test board with four thermal vias. See JEDEC JESD51.
Table 5. Truth Table
A1 A0 EN On Switch1
X2 X2 1 None
0 0 0 RF1
0 1 0 RF2
1 0 0 RF3
1 1 0 RF4
1 Off switches have 50 Ω termination to GND.
2 X means don’t care.
ESD CAUTION
ADG904-EP Enhanced Product
Rev. C | Page 6 of 11
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
14326-003
14
13
12
1
3
4
RF2
15 GND
GND
GND
11 RF4
GND
GND 2
RF1
GND 5
RF3
7
GND 6
GND
8
RFC 9
GND 10
GND
19 VDD
20 GND
18 EN
17 A0
16 A1
TOP VIEW
(No t t o Scal e)
ADG904-EP
NOTES
1. THE EXPOSED PAD IS TIED
TO THE S UBS TRATE, GND.
Figure 2. Pin Configuration
Table 6. Pin Function Descriptions
Pin No. Mnemonic Function
0 EPAD Exposed Pad. The exposed pad is tied to the substrate, GND.
1, 3, 4, 6, 7, 9, 10, 12, 13, 15, 20 GND Ground Reference Points for All Circuitry on the Device.
2 RF1 RF 1 Port.
5 RF3 RF 3 Port.
8 RFC Common RF Port for Switch.
11 RF4 RF 4 Port.
14 RF2 RF 2 Port.
16 A1 Logic Control Input 1.
17 A0 Logic Control Input 0.
18 EN
Active Low Digital Input. When high, the device is disabled and all switches are off. When low,
Ax logic inputs determine on switches.
19 VDD Power Supply Input. This device operates from 1.65 V to 2.75 V. VDD must be decoupled to GND.
Enhanced Product ADG904-EP
Rev. C | Page 7 of 11
TYPICAL PERFORMANCE CHARACTERISTICS
14326-015
FRE QUENCY ( Hz ) 10G10k 100k 1M 10M 100M 1G
INSERTION LOSS (dB)
–0.3
–0.4
–0.5
–0.6
–0.7
–0.8
–0.9
–1.0
–1.1
–1.2
–1.3
–1.4
–1.5
–1.6
–1.7
–1.8
–1.9
–2.0
–2.1
–2.2
–2.3
–2.4
–2.5
–2.6
–2.7
–2.8
–2.9
–3.0 T
A
= 25° C
V
DD
= 2.25V
V
DD
= 2.75V
V
DD
= 2.50V
Figure 3. Insertion Loss vs. Frequency for VDD > 2.2 V (RFx to RFC)
14326-014
FRE QUENCY ( Hz ) 10G10k 100k 1M 10M 100M 1G
INSERTION LOSS (dB)
–0.3
–0.4
–0.5
–0.6
–0.7
–0.8
–0.9
–1.0
–1.1
V
DD
= 2.50V
V
DD
= 2.75V
V
DD
= 2.25V
T
A
= 25° C
Figure 4. Insertion Loss vs. Frequency for VDD > 2.2 V (RFx to RFC)
Zoomed View of Figure 3
14326-013
FRE QUENCY ( Hz ) 10G10k 100k 1M 10M 100M 1G
INSERTION LOSS (dB)
–0.3
–0.4
–0.5
–0.6
–0.7
–0.8
–0.9
–1.0
–1.1
–1.2
–1.3
–1.4
–1.5
–1.6
–1.7
–1.8
–1.9
–2.0
–2.1
–2.2
–2.3
–2.4
–2.5
–2.6
–2.8
–2.9
–2.7
–3.0
V
DD
= 1.65V
V
DD
= 1.80V
V
DD
= 1.95V
T
A
= 25° C
Figure 5. Insertion Loss vs. Frequency for VDD < 2 V (RFx to RFC)
INSERTION LOSS (dB)
FRE QUENCY ( Hz )
14326-006
–3.0
–2.9
–2.8
–2.7
–2.6
–2.5
–2.4
–2.3
–2.2
–2.1
–2.0
–1.9
–1.8
–1.7
–1.6
–1.5
–1.4
–1.3
–1.2
–1.1
–1.0
–0.9
–0.8
–0.7
–0.6
–0.5
–0.4
–0.3
–0.2
10k 100k 1M 10M 100M 1G 10G
T
A
= –55° C
T
A
= –40° C T
A
= +25°C T
A
= +85°C
T
A
= +125°C
Figure 6. Insertion Loss vs. Frequency over Various Temperature (RFx to RFC)
14326-017
FRE QUENCY ( Hz ) 10G10k 100k 1M 10M 100M 1G
ISOLATION (dB)
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
VDD = 1.65V TO 2.75V
S12
S21
Figure 7. Isolation vs. Frequency over Supplies (RFx to RFC)
ISOLATION (dB)
FRE QUENCY ( Hz )
14326-008
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
10k 100k 1M 10M 100M 1G 10G
TA = –55° C
TA = –40° C
TA = +25°C
TA = +85°C
TA = +125°C
Figure 8. Isolation vs. Frequency over Various Temperature (RFx to RFC)
ADG904-EP Enhanced Product
Rev. C | Page 8 of 11
14326-020
FRE QUENCY ( Hz ) 10G10k 100k 1M 10M 100M 1G
RET URN LOS S ( dB)
0
–5
–10
–15
–20
–25
–30
–35
V
DD
= 2.5V
T
A
= 25° C
OFF SWITCH
ON SWITCH
Figure 9. Return Loss vs. Frequency (RFx to RFC)
14326-025
FRE QUENCY ( Hz ) 10G10k 100k 1M 10M 100M 1G
CROSS TAL K ( dB)
–10
–20
–30
–40
–50
–60
–70
–80
V
DD
= 2.5V
T
A
= 25° C
Figure 10. Crosstalk vs. Frequency
14326-026
CH1 CH2 M 5.00n s
CH3 1.00V
100mV 100mV
1
3
TEK RUN: 5.00GSPS ET ENVELOPE T
[]
RF1/3
A1
Figure 11. Switch Timing
14326-027
CH3 1.00mV
CH1 1.00V M20.0ns
Δ: 2.40mV
1
3
T
[ ]
RFC
A0
T
TRIG'D
Figure 12. Video Feedthrough
14326-019
FREQUENCY (MHz) 900
100 200 300 400 500 600 700 800
IP3 (dB)
35
30
25
20
15
10
5
0
VDD = 2.5V
TA = 25° C
Figure 13. Third-Order Intermodulation Intercept (IP3) vs. Frequency
14326-002
FREQUENCY (MHz) 15000250 500 750 1000 1250
1dB INPUT COMPRE S S ION ( dBm)
18
14
16
12
10
6
8
2
4
0
V
DD
= 2.5V
T
A
= 25° C
Figure 14. 1 dB Input Compression vs. Frequency (DC Bias Not Used)
Enhanced Product ADG904-EP
Rev. C | Page 9 of 11
TEST CIRCUITS
14326-104
t
ON
50% 50%
90% 10%
V
EN
V
OUT
t
OFF
10µF
V
S
EN
RFx
RFC V
OUT
GND
V
DD
V
DD
R
L
50Ω
Figure 15. Switch Timing, tON (EN) and tOFF (EN)
V
Ax
V
OUT
50% 50%
90% 90% 10%
10%
tFALL
tRISE
V
DD
V
DD
10µF
V
S
Ax
RFx
RFC
GND
V
OUT
14326-105
R
L
50Ω
Figure 16. Switch Timing, tRISE and tFALL
V
S
NETWORK
ANALYZER
OFF ISOLATION = 20log V
OUT
V
S
V
DD
10µF
V
DD
V
OUT
ADG904-EP
RF2
RF1
RFC
14326-106
GND
A0 A1
1 OF 4
DECODER
EN
50Ω
50Ω
50Ω
50Ω
R
L
50Ω
Figure 17. Off Isolation
V
S
NETWORK
ANALYZER
INSERTION LOSS = 20log V
OUT
V
S
V
DD
10µF
V
DD
50Ω
V
OUT
R
L
50Ω
GND
A0 A1
1 OF 4
DECODER
ADG904-EP
RF2
RFx
RFC 50Ω
14326-107
EN
50Ω
50Ω
Figure 18. Insertion Loss
V
S
NETWORK
ANALYZER
CROSSTALK = 20log V
OUT
V
S
V
DD
10µF
V
DD
V
OUT
ADG904-EP
RF2
RF1
RFC
14326-108
GND
A0 A1
1 OF 4
DECODER
EN
50Ω
50Ω
50Ω
50Ω
R
L
50Ω
Figure 19. Crosstalk
V
DD
10µF
V
DD
ADG904-EP
RF2
RFx
RFC
NC
NC
OSCILLOSCOPE
14326-109
GND
A0 A1
1 OF 4
DECODER
EN
50Ω
50Ω
Figure 20. Video Feedthrough
ADG904-EP Enhanced Product
Rev. C | Page 10 of 11
SPECTRUM
ANALYZER
V
DD
10µF
V
DD
ADG904-EP
RF2
RF1
RFC
GND
50Ω
COMBINER
RF
SOURCE
RF
SOURCE
14326-110
A0 A1
1 OF 4
DECODER
EN
50Ω
50Ω
Figure 21. Third-Order Intermodulation Intercept (IP3)
SPECTRUM
ANALYZER
V
DD
10µF
V
DD
ADG904-EP
RF2
RF1
RFC
50Ω
RF
SOURCE V
S
14326-111
GND
A0 A1
1 OF 4
DECODER
EN
50Ω
50Ω
Figure 22. 1 dB Input Compression (P1dB)
Enhanced Product ADG904-EP
Rev. C | Page 11 of 11
OUTLINE DIMENSIONS
0.80
0.75
0.70
2.30
2.10 SQ
2.00
0.50
BSC
0.65
0.60
0.55
0.30
0.25
0.18
BOTTOM VIEW
TOP VIEW
EXPOSED
PAD
4.10
4.00 SQ
3.90
0.05 M AX
0.02 NO M
0.203 REF
0.20 M IN
COPLANARITY
0.08
PIN 1
INDICATOR
1
20
6
10
11
15
16
5
PKG-003763
COMPLIANT
TO
JEDEC STANDARDS M O-220-WGGD-1
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
02-13-2017-B
FOR PRO P E R CONNECT ION OF
THE EXPOSED PAD, REFER TO
THE PIN CO NFIGURATION AND
FUNCTION DESCRIPT IONS
SECTION OF THIS DATA SHEET.
SEATING
PLANE
Figure 23. 20-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-20-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range Package Description Package Option
ADG904SCPZ-EP −55°C to +125°C 20-Lead Lead Frame Chip Scale Package [LFCSP] CP-20-6
ADG904SCPZ-EP-RL7 −55°C to +125°C 20-Lead Lead Frame Chip Scale Package [LFCSP] CP-20-6
1 Z = RoHS Compliant Part.
©2016–2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D14326-0-5/17(C)
