FEATURES FUNCTIONAL BLOCK DIAGRAM ADG904-EP Wideband switch: -3 dB frequency at 2.5 GHz Absorptive 4:1 mux/single-pole, four-throw (SP4T) High off isolation (37 dB at 1 GHz) Low insertion loss (1.1 dB dc to 1 GHz) Single 1.65 V to 2.75 V power supply (VDD) CMOS/LVTTL control logic 20-lead, 4 mm x 4 mm LFCSP package Low power consumption (2.5 A maximum) RF1 50 RF2 RFC 50 RF3 ENHANCED PRODUCT FEATURES 50 Supports defense and aerospace applications (AQEC standard) Military temperature range: -55C to +125C Controlled manufacturing baseline 1 assembly/test site 1 fabrication site Enhanced product change notification Qualification data available on request RF4 50 1 OF 4 DECODER A0 A1 EN 14326-001 Enhanced Product Wideband 2.5 GHz, 37 dB Isolation at 1 GHz, CMOS, 1.65 V to 2.75 V, 4:1 Mux/SP4T ADG904-EP Figure 1. APPLICATIONS Wireless communications General-purpose radio frequency (RF) switching Dual-band applications High speed filter selection Digital transceiver front-end switches IF switching Tuner modules Antenna diversity switching GENERAL DESCRIPTION The ADG904-EP is a wideband analog 4:1 multiplexer that uses a CMOS process to provide high isolation and low insertion loss to 1 GHz. The ADG904-EP is an absorptive/matched mux with 50 terminated shunt legs. This device is designed such that the isolation is high over the dc to 1 GHz frequency range. The device has on-board CMOS control logic, which eliminates the need for external control circuitry. The control inputs are both CMOS and LVTTL compatible. The low power consumption of this device makes it ideally suited for wireless applications and general-purpose high frequency switching. The ADG904-EP switches one of four inputs to a common output, RFC, as determined by the 3-bit binary address lines A0, A1, and EN. A Logic 1 on the EN pin disables the device. Additional application and technical information can be found in the ADG904 data sheet. PRODUCT HIGHLIGHTS 1. 2. 3. Rev. C 37 dB off isolation at 1 GHz. 1.1 dB insertion loss at 1 GHz. 20-lead LFCSP package. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 (c)2016-2017 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com ADG904-EP Enhanced Product TABLE OF CONTENTS Features .............................................................................................. 1 Absolute Maximum Ratings ............................................................5 Enhanced Product Features ............................................................ 1 Thermal Resistance .......................................................................5 Applications ....................................................................................... 1 ESD Caution...................................................................................5 Functional Block Diagram .............................................................. 1 Pin Configuration and Function Descriptions..............................6 General Description ......................................................................... 1 Typical Performance Characteristics ..............................................7 Product Highlights ........................................................................... 1 Test Circuits........................................................................................9 Revision History ............................................................................... 2 Outline Dimensions ....................................................................... 11 Specifications..................................................................................... 3 Ordering Guide .......................................................................... 11 Continous Current Per Channel ................................................ 4 REVISION HISTORY 5/2017--Rev. B to Rev. C Change to Endnote 1, Table 3 ......................................................... 3 Updated Outline Dimensions ....................................................... 11 3/2017--Rev. A to Rev. B Changes to Endnote 4, Table 1 ........................................................ 3 Added Endnote 1, Table 2................................................................ 4 11/2016--Rev. 0 to Rev. A Changes to Figure 15 ........................................................................ 9 6/2016--Revision 0: Initial Version Rev. C | Page 2 of 11 Enhanced Product ADG904-EP SPECIFICATIONS VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, temperature range = -55C to +125C, unless otherwise noted. Table 1. Parameter AC ELECTRICAL CHARACTERISTICS -3 dB Frequency 2 Insertion Loss Symbol Test Conditions/Comments S12, S21 DC to 100 MHz; VDD = 2.5 V 10%; see Figure 18 500 MHz; VDD = 2.5 V 10% 1000 MHz; VDD = 2.5 V 10% 100 MHz; see Figure 17 500 MHz; see Figure 17 1000 MHz; see Figure 17 100 MHz; see Figure 19 500 MHz; see Figure 19 1000 MHz; see Figure 19 Isolation--RFC to RF1x S12, S21 Crosstalk S12, S21 Return Loss2 On Channel S11, S22 DC to 100 MHz 500 MHz 1000 MHz DC to 100 MHz 500 MHz 1000 MHz Off Channel Timing On Switching Time2 Off Switching Time 2 Transition Time Rise Time2 Fall Time2 Third-Order Intermodulation Intercept Video Feedthrough 3 INPUT POWER 1 dB Input Compression DC ELECTRICAL CHARACTERISTICS Input High Voltage Input Low Voltage Input Leakage Current CAPACITANCE2 RF Port On Capacitance Digital Input Capacitance POWER REQUIREMENTS VDD Quiescent Power Supply Current Min 51 35 30 50 32 30 19 14 Typ 1 Max Unit 2.5 0.5 1 GHz dB 0.7 1.1 60 45 37 58 35 35 1.2 1.8 27 26 18 22 19 18 dB dB dB dB dB dB dB dB dB dB dB dB dB dB tON (EN) 50% EN to 90% RF; see Figure 15 8.5 10 ns tOFF (EN) 50% EN to 10% RF; see Figure 15 13 16 ns tTRANS tRISE tFALL IP3 50% A0/A1 to 10% RF 10% to 90% RF; see Figure 16 90% to 10% RF; see Figure 16 900 MHz/901 MHz, 4 dBm; see Figure 21 See Figure 20 12 3 7.5 31 3 15 5 11 ns ns ns dBm mV p-p P1dB 1000 MHz 4; see Figure 22 VINH VDD = 2.25 V to 2.75 V VDD = 1.65 V to 1.95 V VDD = 2.25 V to 2.75 V VDD = 1.65 V to 1.95 V 0 V VIN 2.75 V f = 1 MHz VINL II 25 16 dBm 0.1 V V V V A 1.7 0.65 VDD CRF ON C 3 2 1.65 IDD 0.7 0.35 VDD 1 Digital inputs = 0 V or VDD 0.1 pF pF 2.75 2.5 V A Typical values are at VDD = 2.5 V and 25C, unless otherwise stated. Guaranteed by design, not subject to production test. 3 Video feedthrough is the dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 test setup, measured with 1 ns rise time pulses and 500 MHz bandwidth. 4 Less than 100 MHz, refer to the AN-952 Application Note for more information about power handling. 1 2 Rev. C | Page 3 of 11 ADG904-EP Enhanced Product CONTINOUS CURRENT PER CHANNEL Table 2. Parameter CONTINUOUS CURRENT PER CHANNEL1 VDD = 2.75 V, VSS = 0 V VDD = 1.65 V, VSS = 0 V 1 25C 85C 105C 125C Unit 93.1 82.6 10.8 10.8 5.9 5.9 3.3 3.3 mA maximum mA maximum Guaranteed by design, not production tested. Rev. C | Page 4 of 11 Test Conditions/Comments 20-lead LFCSP, JA = 30.4C/W, dc bias = 0.5 V Enhanced Product ADG904-EP ABSOLUTE MAXIMUM RATINGS TA = 25C, unless otherwise noted. THERMAL RESISTANCE Table 3. Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. Parameter VDD to GND1 Inputs to GND1 Continuous Current Input Power4 Operating Temperature Range (Industrial) Storage Temperature Range Junction Temperature Lead Temperature, Soldering (10 sec) IR Reflow, Peak Temperature (<20 sec) Electrostatic Discharge (ESD) Rating -0.5 V to +4 V -0.5 V to VDD + 0.3 V2 Data3 + 15% 18 dBm -55C to +125C -65C to +150C 150C 300C 235C 1 kV Tested at +125C. RFx off port inputs to ground = -0.5 V to VDD - 0.5 V. 3 See Table 2. 4 Input power is tested with switch in both open and close position. Power is applied on RFx, while RFC is terminated to a 50 resistor to GND. 1 2 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Table 4. Thermal Resistance Package Type CP-20-61 1 JA 30.4 JC 2.83 Test condition: thermal impedance simulated values are based on JEDEC 2S2P thermal test board with four thermal vias. See JEDEC JESD51. Table 5. Truth Table A1 X2 0 0 1 1 1 2 Unit C/W A0 X2 0 1 0 1 EN 1 0 0 0 0 On Switch1 None RF1 RF2 RF3 RF4 Off switches have 50 termination to GND. X means don't care. ESD CAUTION Rev. C | Page 5 of 11 ADG904-EP Enhanced Product 20 19 18 17 16 GND VDD EN A0 A1 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 2 3 4 5 ADG904-EP TOP VIEW (Not to Scale) 15 14 13 12 11 GND RF2 GND GND RF4 NOTES 1. THE EXPOSED PAD IS TIED TO THE SUBSTRATE, GND. 14326-003 GND 6 GND 7 RFC 8 GND 9 GND 10 GND RF1 GND GND RF3 Figure 2. Pin Configuration Table 6. Pin Function Descriptions Pin No. 0 1, 3, 4, 6, 7, 9, 10, 12, 13, 15, 20 2 5 8 11 14 16 17 18 Mnemonic EPAD GND RF1 RF3 RFC RF4 RF2 A1 A0 EN 19 VDD Function Exposed Pad. The exposed pad is tied to the substrate, GND. Ground Reference Points for All Circuitry on the Device. RF 1 Port. RF 3 Port. Common RF Port for Switch. RF 4 Port. RF 2 Port. Logic Control Input 1. Logic Control Input 0. Active Low Digital Input. When high, the device is disabled and all switches are off. When low, Ax logic inputs determine on switches. Power Supply Input. This device operates from 1.65 V to 2.75 V. VDD must be decoupled to GND. Rev. C | Page 6 of 11 Enhanced Product ADG904-EP VDD = 2.75V VDD = 2.50V 1M 10M 100M FREQUENCY (Hz) 1G 10G Figure 3. Insertion Loss vs. Frequency for VDD > 2.2 V (RFx to RFC) -0.2 -0.3 -0.4 -0.5 -0.6 -0.7 TA = -40C -0.8 TA = +25C -0.9 -1.0 -1.1 -1.2 -1.3 -1.4 -1.5 -1.6 -1.7 -1.8 -1.9 -2.0 -2.1 -2.2 -2.3 -2.4 -2.5 -2.6 -2.7 -2.8 -2.9 -3.0 10k 100k 1M TA = -55C TA = +85C TA = +125C 10M 100M 1G 10G FREQUENCY (Hz) 14326-006 VDD = 2.25V INSERTION LOSS (dB) -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 -1.0 -1.1 -1.2 -1.3 -1.4 -1.5 -1.6 -1.7 -1.8 -1.9 -2.0 -2.1 -2.2 -2.3 -2.4 -2.5 -2.6 -2.7 -2.8 -2.9 TA = 25C -3.0 10k 100k 14326-015 INSERTION LOSS (dB) TYPICAL PERFORMANCE CHARACTERISTICS Figure 6. Insertion Loss vs. Frequency over Various Temperature (RFx to RFC) -0.3 -10 -0.4 -20 VDD = 1.65V TO 2.75V -30 VDD = 2.50V -40 -0.6 ISOLATION (dB) VDD = 2.75V -0.7 VDD = 2.25V -0.8 -50 S21 -60 -70 S12 -0.9 -80 -1.0 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G -100 10k 10M 100M FREQUENCY (Hz) 1G 10G -10 -20 VDD = 1.65V -30 ISOLATION (dB) -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 -1.0 -1.1 -1.2 -1.3 -1.4 -1.5 -1.6 -1.7 -1.8 -1.9 -2.0 -2.1 -2.2 -2.3 -2.4 -2.5 -2.6 -2.7 -2.8 -2.9 TA = 25C -3.0 10k 100k 1M Figure 7. Isolation vs. Frequency over Supplies (RFx to RFC) VDD = 1.80V VDD = 1.95V TA = +125C TA = +85C -40 -50 TA = +25C -60 TA = -40C -70 -80 -90 TA = -55C 1M 10M 100M FREQUENCY (Hz) 1G 10G Figure 5. Insertion Loss vs. Frequency for VDD < 2 V (RFx to RFC) 14326-013 INSERTION LOSS (dB) Figure 4. Insertion Loss vs. Frequency for VDD > 2.2 V (RFx to RFC) Zoomed View of Figure 3 100k 14326-017 -1.1 10k 14326-014 -90 TA = 25C -100 10k 100k 1M 10M 100M FREQUENCY (Hz) 1G 10G 14326-008 INSERTION LOSS (dB) -0.5 Figure 8. Isolation vs. Frequency over Various Temperature (RFx to RFC) Rev. C | Page 7 of 11 ADG904-EP Enhanced Product 0 [T] TRIG'D : 2.40mV T -5 A0 RETURN LOSS (dB) -10 -15 1 -20 OFF SWITCH 3 -25 RFC ON SWITCH 1M 10M 100M FREQUENCY (Hz) 1G 10G CH1 1.00V CH3 1.00mV M 20.0ns Figure 12. Video Feedthrough Figure 9. Return Loss vs. Frequency (RFx to RFC) -10 35 -20 30 -30 25 -40 20 IP3 (dB) -50 15 10 -60 5 -70 VDD = 2.5V TA = 25C 1M 10M 100M FREQUENCY (Hz) 1G 10G 0 100 200 300 400 500 600 FREQUENCY (MHz) 700 800 900 14326-019 100k 14326-025 -80 10k VDD = 2.5V TA = 25C Figure 13. Third-Order Intermodulation Intercept (IP3) vs. Frequency Figure 10. Crosstalk vs. Frequency 18 TEK RUN: 5.00GSPS ET ENVELOPE [ T ] 16 1dB INPUT COMPRESSION (dBm) A1 1 3 RF1/3 14 12 10 8 6 4 2 VDD = 2.5V TA = 25C 0 1.00V 100mV CH2 100mV M 5.00ns 0 14326-026 CH1 CH3 250 500 750 1000 FREQUENCY (MHz) 1250 1500 14326-002 CROSSTALK (dB) 14326-027 VDD = 2.5V TA = 25C -35 10k 100k 14326-020 -30 Figure 14. 1 dB Input Compression vs. Frequency (DC Bias Not Used) Figure 11. Switch Timing Rev. C | Page 8 of 11 Enhanced Product ADG904-EP TEST CIRCUITS VDD 10F VDD VDD RFx VDD RFC 90% VOUT GND 50% 10% tON tOFF NETWORK ANALYZER 50 RF2 A0 A1 50 VS 50 1 OF 4 DECODER 14326-104 VEN RL 50 EN 50% VOUT 50 VOUT RFx RFC VS RL 50 ADG904-EP GND EN INSERTION LOSS = 20log 14326-107 10F VOUT VS Figure 18. Insertion Loss Figure 15. Switch Timing, tON (EN) and tOFF (EN) VDD 10F VDD VDD RF1 VDD VOUT Ax 50% 50% VOUT 50 RF2 90% 10% 90% 10% 1 OF 4 DECODER 14326-105 GND tRISE tFALL A0 A1 RL 50 VOUT 50 GND EN CROSSTALK = 20log VOUT VS Figure 19. Crosstalk Figure 16. Switch Timing, tRISE and tFALL VDD VDD 10F 10F VDD 50 ADG904-EP RF1 RFC RL 50 VS VDD RFx OSCILLOSCOPE RF2 A1 EN RFC RF2 50 1 OF 4 DECODER GND V OFF ISOLATION = 20log OUT VS A0 A1 EN Figure 20. Video Feedthrough Figure 17. Off Isolation Rev. C | Page 9 of 11 NC 50 NETWORK ANALYZER 14326-106 1 OF 4 DECODER 50 ADG904-EP VOUT 50 A0 VS 50 VAx RL 50 50 NC 50 GND 14326-109 VS RFC RFx RFC NETWORK ANALYZER ADG904-EP 14326-108 10F ADG904-EP Enhanced Product VDD VDD 10F ADG904-EP VDD RF1 SPECTRUM RFC ANALYZER 50 50 RF2 1 OF 4 DECODER 50 A1 SPECTRUM ANALYZER RFC RF2 RF SOURCE EN 1 OF 4 DECODER Figure 21. Third-Order Intermodulation Intercept (IP3) 50 50 COMBINER GND A0 ADG904-EP RF1 RF SOURCE 14326-110 VDD RF SOURCE GND A0 A1 EN Figure 22. 1 dB Input Compression (P1dB) Rev. C | Page 10 of 11 VS 50 14326-111 10F Enhanced Product ADG904-EP OUTLINE DIMENSIONS PIN 1 INDICATOR DETAIL A (JEDEC 95) 4.10 4.00 SQ 3.90 0.30 0.25 0.18 0.50 BSC PIN 1 INDIC ATOR AREA OPTIONS (SEE DETAIL A) 20 16 15 1 2.30 2.10 SQ 2.00 EXPOSED PAD 5 11 10 6 BOTTOM VIEW 0.20 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND 0.05 MAX FUNCTION DESCRIPTIONS 0.02 NOM SECTION OF THIS DATA SHEET. COPLANARITY 0.08 0.203 REF 0.80 0.75 0.70 SEATING PLANE PKG-003763 0.65 0.60 0.55 COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-1 02-13-2017-B TOP VIEW Figure 23. 20-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm x 4 mm Body and 0.75 mm Package Height (CP-20-6) Dimensions shown in millimeters ORDERING GUIDE Model 1 ADG904SCPZ-EP ADG904SCPZ-EP-RL7 1 Temperature Range -55C to +125C -55C to +125C Package Description 20-Lead Lead Frame Chip Scale Package [LFCSP] 20-Lead Lead Frame Chip Scale Package [LFCSP] Z = RoHS Compliant Part. (c)2016-2017 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D14326-0-5/17(C) Rev. C | Page 11 of 11 Package Option CP-20-6 CP-20-6