Technical Data 4341 Effective October 2015 Supersedes September 2010 FP1007 High frequency, high current power inductors Applications Product description * High current carrying capacity * Low core loss * Frequency range up to 2MHz * Inductance Range from 115 nH to 300nH * Current range from 32 to 94 amps * 10.4 x 8.0mm footprint surface mount package in 6.5, 7.0 or 7.5mm height * Ferrite core material * Halogen free, lead free, RoHS compliant * Servers * Multi-phase and Vcore regulators * Voltage Regulator Modules (VRMs) * Desktop VRMs and EVRDs * Data networking and storage systems * Graphics cards and battery power systems * Point-of-Load modules * DCR Sensing circuits Environmental data * Storage temperature range (Component): -40C to +125C * Operating temperature range: -40C to +125C (ambient + self-temperature rise) * Solder reflow temperature: J-STD-020D compliant HALOGEN Pb HF FREE FP1007 High frequency, high current power inductors Technical Data 4341 Effective October 2015 Product specifications OCL1 (nH)10% FLL2 (nH) minimum Irms3 (amps) Isat14 (amps) Isat25 (amps) DCR (m) @ 20C 5% K-factor8 FP1007R1-R12-R 120 86 60 81 65 0.29 10% 371 FP1007R1-R14-R 140 100 60 72 56 0.29 10% 371 FP1007R1-R17-R 170 122 60 58 46 0.29 10% 371 FP1007R1-R22-R 215 155 60 50 36 0.29 10% 371 FP1007R1-R30-R 300 216 60 32 26 0.29 10% 371 FP1007R2-R12-R 120 86 51 81 65 0.48 8% 368 FP1007R2-R14-R 140 100 51 72 56 0.48 8% 368 FP1007R2-R17-R 170 122 51 58 46 0.48 8% 368 FP1007R2-R22-R 215 155 51 50 36 0.48 8% 368 FP1007R2-R30-R 300 216 51 32 26 0.48 8% 368 115 83 61 94 86 0.29 5% 354 Part Number7 R1 version R2 version R3 version FP1007R3-R12-R FP1007R3-R15-R 150 108 61 76 70 0.29 5% 354 FP1007R3-R17-R 175 126 61 66 60 0.29 5% 354 FP1007R3-R22-R 215 155 61 50 43 0.29 5% 354 FP1007R3-R23-R 230 165 61 48 40 0.29 5% 354 FP1007R3-R27-R 270 194 61 40 34 0.29 5% 354 FP1007R3-R30-R 300 216 61 35 30 0.29 5% 354 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25C 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1, +25C 3. Irms: Irms: DC current for an approximate temperature rise of 40C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125C under worst case operating conditions verified in the end application. 4. Isat1: Peak current for approximately 20% rolloff @ +25C 5. Isat2: Peak current for approximately 20% rolloff @ +125C 6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), I (Peak-to-peak ripple current in Amps). 7. Part Number Definition: FP1007Rx-Rxx-R FP1007R= Product code and size x = DCR indicator Rxx = Inductance value in H, R= decimal point -R suffix = RoHS compliant Dimensions (mm) Recommended Pad Layout Schematic Part marking: 1007Rx (x = DCR indicator), Rxx (xx = inductance value in uH, R = decimal point, wwllyy = date code, R = revision level Tolerances are 0.25 millimeters unless stated otherwise. PCB tolerances are 0.1 millimeters unless stated otherwise All soldering surfaces to be coplanar within 0.1 millimeter DCR measured from point "a" to point "b" Do not route traces or vias underneath the inductor 2 www.eaton.com/elx FP1007 High frequency, high current power inductors Technical Data 4341 Effective October 2015 Packaging information (mm) Supplied in tape and reel packaging, FP1007R1 700 parts per 13 " diameter reel FP1007R2 750 parts per 13 " diameter reel FP1007R3 650 parts per 13 " diameter reel User direction of feed Temperature rise vs. total loss www.eaton.com/elx 3 Technical Data 4341 Effective October 2015 Core loss vs. Bp-p Inductance characteristics 4 www.eaton.com/elx FP1007 High frequency, high current power inductors FP1007 High frequency, high current power inductors Technical Data 4341 Effective October 2015 Solder reflow profile TP TC -5C tP Max. Ramp Up Rate = 3C/s Max. Ramp Down Rate = 6C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 <2.5mm) 235C 220C 2.5mm 220C 220C Table 2 - Lead (Pb) Free Solder (Tc) Tsmin 25C ts Time 25C to Peak Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260C 260C 260C 1.6 - 2.5mm 260C 250C 245C >2.5mm 250C 245C 245C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak Standard SnPb Solder Lead (Pb) Free Solder * Temperature min. (Tsmin) 100C 150C * Temperature max. (Tsmax) 150C 200C * Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3C/ Second Max. 3C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183C 60-150 Seconds 217C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp)** within 5 C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6C/ Second Max. 6C/ Second Max. Time 25C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx (c) 2015 Eaton All Rights Reserved Printed in USA Publication No. 4341 BU-10927 October 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners.