Nov. 2012 Graphic Memory Product Guide SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. 2012 Samsung Electronics Co., Ltd. All rights reserved. -1- Nov. 2012 Product Guide Graphic Memory 1. GRAPHIC MEMORY ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 K 4 X XX XX X X X - X X XX Speed SAMSUNG Memory Temperature & Power DRAM Package Type Product Density & Refresh Revision Interface (VDD, VDDQ) Organization Bank 1. SAMSUNG Memory 11. "-" 2. DRAM 12. Package Type E H B G V 3. Product W : gDDR3 SDRAM J : GDDR3 SGRAM G : GDDR5 SGRAM 4~5. Density & Refresh 51 52 10 20 1G 2G 4G 41 GDDR5 H : 170FBGA(Halogen Free & Lead Free & Flip-Chip) F : 170FBGA(Halogen Free & Lead Free) 13. Temperature & Power(VDD) C J L Y 16 : x16 32 : x32 8. Bank : : : : Commercial Normal Commercial High Commercial Low Commercial Low Voltage 14~15. Speed 3 : 4Banks 4 : 8Banks 5 : 16Banks 9. Interface ( VDD, VDDQ) 6 : SSTL_15 (1.5V,1.5V) F : POD_15 (1.5V,1.5V) K : POD_18 (1.8V,1.8V) 10. Revision 1st Gen. 3rd Gen. 5th Gen. 7th Gen. 9th Gen. 17th Gen. gDDR3 100FBGA(Halogen Free & Lead Free) 96FBGA(Halogen Free & Lead Free) 96FBGA(Halogen Free & Lead Free & Flip-Chip) 78FBGA(Halogen Free & Lead Free) 78FBGA(Halogen Free & Lead Free & Flip-Chip) GDDR3 B : 136FBGA(Lead Free) H : 136FBGA(Halogen Free & Lead Free) : 512M, 8K/64ms : 512M, 8K/32ms : 1G, 8K/32ms : 2G, 16K/32ms : 1G, 8K/64ms : 2G, 8K/64ms : 4G, 8K/64ms : 4G, 16K/32ms 6~7. Organization M: B : D: F : H: Q: : : : : : A C E G I Z : : : : : : 1B 1A 11 12 14 15 16 18 19 20 22 2nd Gen. 4th Gen. 6th Gen. 8th Gen. 10th Gen. 26th Gen. -2- : : : : : : : : : : : 0.83ns (2400Mbps) 1.0ns (2133Mbps) 1.07ns (1866Mbps) 1.25ns (1600Mbps) 1.4ns (1400Mbps) 1.5ns (1333Mbps) 1.6ns (1200Mbps) 1.8ns (1100Mbps) 1.875ns (1066Mbps) 2.0ns (1000Mbps) 2.2ns (900Mbps) 25 28 03 04 05 5C 06 6A 07 7A 09 : : : : : : : : : : : 0.25ns 0.28ns 0.33ns 0.40ns 0.50ns 0.56ns 0.62ns 0.66ns 0.71ns 0.77ns 0.9ns (8000Mbps) (7000Mbps) (6000Mbps) (5000Mbps) (4000Mbps) (3600Mbps) (3200Mbps) (3000Mbps) (2800Mbps) (2600Mbps) (2200Mbps) Nov. 2012 Product Guide Graphic Memory 2. GRAPHIC MEMORY COMPONENT PRODUCT GUIDES Product Density Part Num. PKG & Speed Org. 1Gb G-die K4W1G1646G BC08/1A 11/12/15 64Mx16 2Gb C-die K4W2G1646C HC1A/11 12/15 gDDR3 SDRAM GDDR3 SGRAM Banks Ref. Voltage(V) SSTL_15 8K/64ms 1.5V 0.075V 2Gb E-die K4W2G1646E 4Gb B-die K4W4G1646B HC 1A/11/12 256Mx16 K4J10324KG HC1A/14 32Mx32 POD_18 8K/32ms 1.8V 0.1V K4G10325FG HC03/04/05 32Mx32 POD_15 8K/32ms 1.5V 0.045V K4G20325FD FC28/03/04 64Mx32 POD_15 16K/32ms 1.5V 0.045V K4G41325FC HC28/03/04 128Mx32 POD_15 16K/32ms 1.5V 0.045V 1Gb G-die 8Banks 2Gb D-die 4Gb C-die 16Banks -3- PKG. Status Mass Production BC1A/11 12/15 1Gb G-die GDDR5 SGRAM 128Mx16 8Banks Interf. 96ball FBGA Mass Production Mass Production Mass Production 136ball FBGA Mass Production Mass Production 170ball FBGA Mass Production ES Sep.'12