Description
These high intensity white LED lamps are based on
InGaN material technology. A blue LED die is coated by
a phosphor to produce white. The typical resulting color
is described by the coordinates x = 0.32, y = 0.32 using
the 1931 CIE Chromaticity Diagram.
These T-13⁄4 lamps are untinted, nondiused, and incorpo-
rate precise optics producing well dened spatial radiation
patterns at specic viewing cone angle.
HLMP-CW15, HLMP-CW16, HLMP-CW23, HLMP-CW24,
HLMP-CW30, HLMP-CW31, HLMP-CW70, HLMP-CW72
Features
• Highly luminous white emission
• 15°, 23°, 30°, and 70° viewing angle
Applications
• Indoor Electronic signs and signals
• Small area illumination
• Legend backlighting
• General purpose indicators
Benet
• Reduced power consumption, higher reliability, and in-
creased optical/mechanical design exibility compared
to incandescent bulbs and other alternative white light
sources
HLMP-CWxx
T-13/4 Precision Optical Performance
White LED Lamps
Data Sheet
CAUTION: These devices are Class 1C ESD sensitive. Please observe appropriate precautions during handling
and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
2
Device Selection Guide
Min. Luminous Intensity
Viewing Angle Iv (mcd) @ 20 mA
Part Number Typ. Min. Max. Stando Leads Package Dimension
HLMP-CW15-TW0xx 15° 2500 7200 No A
HLMP-CW15-TW0xx 15° 2500 7200 No A
HLMP-CW15-UV0xx 15° 3200 5500 No A
HLMP-CW15-VWBxx 15° 4200 7200 No A
HLMP-CW15-VY0xx 15° 4200 12000 No A
HLMP-CW15-VYBxx 15° 4200 12000 No A
HLMP-CW15-VYGxx 15° 4200 12000 No A
HLMP-CW15-VYKxx 15° 4200 12000 No A
HLMP-CW16-R00xx 15° 1500 - Yes B
HLMP-CW16-TW0xx 15° 2500 7200 Yes B
HLMP-CW16-VY0xx 15° 4200 12000 Yes B
HLMP-CW23-SV0xx 23° 1900 5500 No A
HLMP-CW23-SVKxx 23° 1900 5500 No A
HLMP-CW23-TW0xx 23° 2500 7200 No A
HLMP-CW24-SV0xx 23° 1900 5500 Yes B
HLMP-CW24-TW0xx 23° 2500 7200 Yes B
HLMP-CW30-PS0xx 30° 880 2500 No A
HLMP-CW30-RU0xx 30° 1500 4200 No A
HLMP-CW30-STBxx 30° 1900 3200 No A
HLMP-CW30-SV0xx 30° 1900 5500 No A
HLMP-CW31-M00xx 30° 520 - Yes B
HLMP-CW31-PS0xx 30° 880 2500 Yes B
HLMP-CW31-SV0xx 30° 1900 5500 Yes B
HLMP-CW70-LMBxx 70º 400 680 No A
HLMP-CW70-LP0xx 70º 400 1150 No A
HLMP-CW72-LP0xx 70º 400 1150 Yes B
Notes:
1. Tolerance for each intensity limit is ±15%.
2. Please refer to AN 5352 for detail information on features of stand-o and non stand-o LEDs.
3
Package Dimensions
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244)
MIN.
0.70 (0.028)
MAX.
1.00
(0.039)
MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
CATHODE
LEAD
CATHODE
FLAT
d
1.50 ± 0.15
(0.059 ± 0.006)
PACKAGE DIMENSION B
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244)
MIN.
0.70 (0.028)
MAX.
1.00
(0.039)
MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS.
CATHODE
LEAD
2.35 (0.093)
MAX.
CATHODE
FLAT
PACKAGE DIMENSION A
HLMP-CW24
d = 12.52 ± 0.25
(0.493 ± 0.010)
HLMP-CW16
d = 12.6 ± 0.25
(0.496 ± 0.010)
HLMP-CW31
d = 11.96 ± 0.25
(0.471 ± 0.010)
HLMP-CW72
d = 12.52 ± 0.25
(0.493 ± 0.010)
4
Part Numbering System
HLMP – CWxx - x x x xx
Mechanical Option
00: Bulk
DD: Ammo Pack
Color Bin Option
0: Full color bin distribution
B: Color bins 2 & 3
G: Color bins 2, 3 & 4
K: Color bins 2 & 4
Maximum Intensity Bin Limit
0: No maximum intensity bin limit
Others: Refer to Device Selection Guide
Minimum Intensity Bin Limit
Refer to Device Selection Guide
Viewing Angle and Stando Option
15: 15° without standos
16: 15° with standos
23: 23° without standos
24: 23° with standos
30: 30° without standos
31: 30° with standos
70: 50° without standos
72: 50° with standos
Note: Please refer to AB 5337 for complete information about part numbering system.
5
Absolute Maximum Ratings
TA = 25˚C
Parameter Value Units
DC Forward Current[1] 30 mA
Peak Forward Current[2] 100 mA
Power Dissipation 111 mW
Reverse Voltage (IR = 10 µA) 5 V
LED Junction Temperature 110 oC
Operating Temperature Range –40 to +80 oC
Storage Temperature Range –40 to +100 oC
Notes:
1. Derate linearly as shown in Figure 5.
2. Duty factor 10% Frequency 1 kHz.
Electrical Characteristics
TA = 25°C
Forward Voltage, Reverse Breakdown, Capacitance, C (pF), Thermal Resistance
VF (V) @ IF = 20 mA VR (V) @ IR = 10 µA VF = 0, f = 1 MHz RθJ-PIN (°C/W)
Typ. Max. Min. Typ. Typ.
3.2 3.7 5 70 240
Optical Characteristics
TA = 25°C
Typical Chromaticity Viewing Angle
Coordinates[1] 2θ1/2 Degrees[2]
Part Number X Y Typ.
HLMP-CW3x-xxxxx 0.32 0.32 30
HLMP-CW2x-xxxxx 0.32 0.32 23
HLMP-CW1x-xxxxx 0.32 0.32 15
HLMP-CW7x-xxxxx 0.32 0.32 50
Notes:
1. The chromaticity coordinates are derived from the CIE 1931 Chromaticity Diagram and represent the perceived color of the device.
2. θ1/2 is the o-axis angle where the luminous intensity is 1⁄2 the peak intensity.
6
Figure 6a. CW1x spatial radiation pattern
Figure 1. Relative intensity vs. wavelength Figure 3. Relative lv vs. forward current
Figure 5. Maximum forward current vs. temperature
Figure 4. Chromaticity shift vs. current
WAVELENGTH – nm
RELATIVE LUMINOUS INTENSITY
380 780
1.0
0.6
0680580480
0.4
0.8
0.2
Figure 2. Forward current vs. forward voltage
0
1.5
0.3
RELATIVE LUMINOUS INTENSITY
FORWARD CURRENT – mA
0 30
1.2
10 20
0.9
0.6
RELATIVE INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.5
-90 -60 0-30 30 60 90
-0.010
0.025
0
0.005
-0.005
Y-COORDINATES
X-COORDINATES
(X,Y) VALUES @ 20 mA REFERENCE TO (0,0)
-0.004 0.004-0.002
30 mA
5 mA
1 mA
0 0.002
0.015
0.010
0.020
25 mA
20 mA
15 mA
10 mA
FORWARD CURRENT – mA
0
0
FORWARD VOLTAGE – V
20
15
2
35
30
5
10
25
1 3 4
7
Figure 6b. CW2x spatial radiation pattern
RELATIVE LUMINOUS INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.5
-90 -60 0-30 30 60 90
Figure 6c. CW3x spatial radiation pattern
RELATIVE LUMINOUS INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.5
-90 -60 0-30 30 60 90
Figure 6c. CW7x spatial radiation pattern
RELATIVE LUMINOUS INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.5
-90 -60 0-30 30 60 90
8
Intensity Bin Limits
(mcd at 20 mA)
Bin Min. Max.
L 400 520
M 520 680
N 680 880
P 880 1150
Q 1150 1500
R 1500 1900
S 1900 2500
T 2500 3200
U 3200 4200
V 4200 5500
W 5500 7200
X 7200 9300
Y 9300 12000
Z 12000 16000
Tolerance for each bin limit is ± 15%.
Color Bin Limit Table
Rank Limits (Chromaticity Coordinates)
1 x 0.330 0.330 0.356 0.361
y 0.360 0.318 0.351 0.385
2 x 0.287 0.296 0.330 0.330
y 0.295 0.276 0.318 0.339
3 x 0.264 0.280 0.296 0.283
y 0.267 0.248 0.276 0.305
4 x 0.283 0.287 0.330 0.330
y 0.305 0.295 0.339 0.360
Tolerance for each bin limit is ± 0.01.
0.40
0.35
0.30
0.25
0.20
0.26 0.30 0.34 0.38
Y-COORDINATE
X-COORDINATE
3
2
41
BLACK
BODY
CURVE
Color Bin Limits with Respect to CIE
1931 Chromaticity Diagram
Note:
Bin categories are established for classication of products. Products may not be available in all
bin categories. Please contact your Avago representative for information on currently available
bins.
Relative Light Output vs. Junction Temperature
0.1
1
10
-40 -20 0 20 40 60 80 100
TJ - JUNCTION TEMPERATURE - °C
RELATIVE LIGHT OUTPUT
( NORMALIZED AT TJ = 25ºC)
9
Note:
1. PCB with dierent size and design (component density) will have
dierent heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
prole again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high eciency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED conguration
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment xture that is being applied during
wave soldering should be loosely tted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of alignment xture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reow soldering prior to insertion the TH LED.
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause diculty inserting the TH LED.
Precautions:
Lead Forming:
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms
a mechanical ground which prevents mechanical
stress due to lead cutting from traveling into LED
package. This is highly recommended for hand solder
operation, as the excess lead length also acts as small
heat sink.
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be eectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The
closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59mm. Soldering the LED using soldering iron tip
closer than 1.59mm might damage the LED.
1.59mm
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 60 sec Max -
Peak temperature 250 °C Max. 260 °C Max.
Dwell time 3 sec Max. 5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering prole to
ensure that it is always conforming to recommended
soldering conditions.
CATHODE
InGaN Device
10
Ammo Packs Drawing
18.00 ± 0.50
(0.7087 ± 0.0197)
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
9.125 ± 0.625
(0.3593 ± 0.0246)
12.70 ± 0.30
(0.50 ± 0.0118)
CATHODE
0.70 ± 0.20
(0.0276 ± 0.0079)
20.50 ± 1.00
(0.807 ± 0.039)
A A
VIEW A–A
∅4.00 ± 0.20
(0.1575 ± 0.008) TYP.
ALL DIMENSIONS IN MILLIMETERS (INCHES).
Example of Wave Soldering Temperature Prole for TH LED
030 100
250
200
150
100
50
TIME (MINUTES)
PREHEAT
TURBULENT WAVE LAMINAR WAVE
HOT AIR KNIFE
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
TEMPERATURE (°C)
20
10 40 50 70 90
80
60
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED
lamps.
Note: The ammopacks drawing is applicable to option -DD & -ZZ and regardless of stando or non stando.
11
Packaging Box Ammo Packs
Note: For InGaN device, the ammo pack packaging box contains ESD logo.
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN
(9D) MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID
Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
REV:
DeptID:
STANDARD LABEL LS0002
RoHS Compliant
e1 max temp 250C
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
AVAGO
TECHNOLOGIES
ANODE
MOTHER LABEL
CATHODE
C
A
+
–
ANODE LEAD LEAVES
THE BOX FIRST.
LABEL ON
THIS SIDE
OF BOX.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4125EN
AV02-0214EN - April 4, 2008
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED
OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION,
MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLI-
CATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO
OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
Acronyms and Denition:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin
and VF bin)
(ii) Avago Baby Label (Only available on bulk packaging)
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
PART #: Part Number
LOT#: Lot Number
MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e1 max temp 250C