• RoHS compliant
• Lead free
Applications:
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Desktop and server VRMs and EVRDs
• Notebook regulators
• Data networking and storage systems
• Graphics cards and battery power systems
• Point-of-load modules
• DCR sensing
Environmental Data:
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(ambient plus self-temperature rise)
• Solder reflow temperature: J-STD-020D compliant
Packaging:
• Supplied in tape and reel packaging on 13” diameter reel
• FP1007R1 700 parts per reel
• FP1007R2 750 parts per reel
• FP1007R3 650 parts per reel
Product Specifications
Part Number7OCL1± 10% (nH) FLL2Min. (nH) Irms3(Amps) Isat14@ 25°C (Amps) Isat25@ 125°C (Amps) DCR (mW) @ 20°C K-factor6
R1 Version
FP1007R1-R12-R 120 86 81 65 371
FP1007R1-R14-R 140 100 72 56 371
FP1007R1-R17-R 170 122 60 58 46 0.29 ± 10% 371
FP1007R1-R22-R 215 155 50 36 371
FP1007R1-R30-R 300 216 32 26 371
R2 Version
FP1007R2-R12-R 120 86 81 65 368
FP1007R2-R14-R 140 100 72 56 368
FP1007R2-R17-R 170 122 51 58 46 0.48 ± 8% 368
FP1007R2-R22-R 215 155 50 36 368
FP1007R2-R30-R 300 216 32 26 368
R3 Version
FP1007R3-R12-R 120 86 94 86 354
FP1007R3-R15-R 150 108 76 70 354
FP1007R3-R17-R 170 122 66 60 354
FP1007R3-R22-R 215 155 61 50 43 0.29 ± 5% 354
FP1007R3-R23-R 230 165 48 40 354
FP1007R3-R27-R 270 194 40 34 354
FP1007R3-R30-R 300 216 35 30 354
Description:
• Halogen free
• 125°C maximum total temperature operation
• 10.4 x 8.0 x 6.5, 7.0 or 7.5mm maximum surface mount package
• Ferrite core material
• High current carrying capacity, low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 120nH to 300nH
• Current range from 32 to 94 Amps
• Frequency range up to 2MHz
High Current, High Frequency, Power Inductors
FLAT-PAC™ FP1007 Series
0910 BU-SB10927 Page 1 of 4 Data Sheet: 4341
SMD Device
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms,I
sat1
3I
rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
4I
sat1: Peak current for approximately 20% rolloff at +25°C.
5I
sat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K *L *DI *10-3,B
p-p : (Gauss),
K: (K-factor from table), L: (inductance in nH), DI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP1007Rx-Rxx-R
• FP1007 = Product code and size • Rx is the DCR indicator
• Rxx= Inductance value in mH, R = decimal point • “-R” suffix = RoHS compliant
Pb
HALOGEN
HF
FREE
7.8 +0.2/-0.3
Rxx
wwllyy R
1007Rx 1 0.2 ± 0.2 2.54 ± 0.20
1
2
2.5 3.0
4.7
a
b
Side View Bottom View
Top View
2
1
2.24 ± 0.15
Recommended Pad Layout Schematic
1
2
FP 1 0 0 7 R 1 -R = 6.80 ± 0.2
FP 1 0 0 7 R 2 -R = 6 .30 ± 0.2
FP 1 0 0 7 R 3-R = 7.30 ± 0.2
Dimensions - mm
Section A-A
User direction of feed
Section B-B
1.75
11.5
4.0
12.0
1.5 dia. 2.0
24 ± 0.3
10.5
8.1
1.5 dia.
wwllyy R
Rxx
1007Rx
1
2
FP1007R1 = 7.1
FP1007R2 = 6.6
FP1007R3 = 7.6
0
10
20
30
40
50
60
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
Total Loss (W )
Temperature Rise (°C)
FP1007R1-R
FP1007R2-R
FP1007R3-R
Part Marking: Coiltronics Logo 1007Rx (Rx = DCR Indicator) Rxx = Inductance value in mH. (R = Decimal point) wwllyy = Date code R = Revision level
The nominal DCR is
measured from point
“a” to point”b.”
Supplied in tape-and-reel packaging, on 13” diameter reel; FP1007R1 700 parts, FP1007R2 750 parts, FP1007R3 650 parts
Packaging Information - mm
Temperature Rise vs.Total Loss
0910 BU-SB10927 Page 2 of 4 Data Sheet: 4341
0910 BU-SB10927 Page 3 of 4 Data Sheet: 4341
0.00001
0.0001
0.001
0.01
0.1
1
10
100 1000 10000
B (Gauss)
Core Loss (W)
100kHz
200kHz
300kHz
500kHz
1MHz
p-p
Core Loss vs. B
p-p
% of OCL vs. I
sat
1
0
10
20
30
40
50
60
70
80
90
100
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
% of I
sat
1
% of OCL
+125°C
+25°C
-40°C
Inductance Characteristics
Core Loss
0910 BU-SB10927 Page 4 of 4 Data Sheet: 4341
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncon-
trolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann
reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to
change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the
Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the label-
ing, can be reasonably expected to result in significant injury to the user.
North America
Cooper Electronic Technologies
1225 Broken Sound Parkway NW
Suite F
Boca Raton, FL 33487-3533
Tel: 1-561-998-4100
Fax: 1-561-241-6640
Toll Free: 1-888-414-2645
Cooper Bussmann
P.O. Box 14460
St. Louis, MO 63178-4460
Tel: 1-636-394-2877
Fax: 1-636-527-1607
Europe
Cooper Electronic Technologies
Cooper (UK) Limited
Burton-on-the-Wolds
Leicestershire • LE12 5TH UK
Tel: +44 (0) 1509 882 737
Fax: +44 (0) 1509 882 786
Cooper Electronic Technologies
Avda. Santa Eulalia, 290
08223
Terrassa, (Barcelona), Spain
Tel: +34 937 362 812
+34 937 362 813
Fax: +34 937 362 719
Asia Pacific
Cooper Electronic Technologies
1 Jalan Kilang Timor
#06-01 Pacific Tech Centre
Singapore 159303
Tel: +65 278 6151
Fax: +65 270 4160
Solder Reflow Profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
Ta
ab
bl
le
e
1
1
-
-
S
St
ta
an
nd
da
ar
rd
d
S
Sn
nP
Pb
b
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume
Package mm3mm3
Thickness <350 >
_350
<2.5mm 235°C220°C
>
_2.5mm 220°C220°C
T
Ta
ab
bl
le
e
2
2
-
-
L
Le
ea
ad
d
(
(P
Pb
b)
)
F
Fr
re
ee
e
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume Volume
Package mm3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C260°C260°C
1.6 – 2.5mm 260°C250°C245°C
>2.5mm 250°C245°C245°C
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak• Temperature min. (Tsmin) 100°C150°C
• Temperature max. (Tsmax) 150°C200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 Seconds
Average ramp up rate Tsmaxto Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (T
L
) 183°C217°C
Time at liquidous (tL)60-150 Seconds60-150 Seconds
Peak package body temperature (TP)*Table 1Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc) 20 Seconds** 30 Seconds**
Average ramp-down rate (Tpto Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
© 2009 Cooper Bussmann
www.cooperbussmann.com
